• Arm

  

  Main advantages： Arm technology is at the heart of a computing and data revolution for wide range of application segment. For intelligent connected vehicles, Arm believes these new technologies address a key trend in computing, the shift towards autonomous decision making. By deep collaboration with car OEM, tier-1 and large ecosystem partners, we identified two of key IP requirements for next generation automotive application: • Scalable compute is needed to address the range of processing capability for differing workloads in a power efficient manner. • Safety, combined with security and real-time response, is absolutely critical to avoid the risk of damage, or potentially fatal outcomes, if systems fail or are cyber-compromised. In the past year, Arm announced a new suite of CPU, GPU and ISP IP technology that delivers these building blocks. Cortex-A78AE is our highest performance CPU with safety, and includes a NEW Hybrid Mode safety capability. Mali-G78AE is our latest high performance GPU and our first GPU to address safety, and integrates a new Flexible partitioning feature. And Mali-C71AE is an important evolution of our Mali-C71 Image Signal Processor, bringing Safety Enablement to vision applications in autonomous systems. Used those fundamental building blocks, we will open up a huge range of new possibilities of functional utility and human safety. NXP, Renesas, Nvidia, STMicroelectronics and Samsung announced they used Arm automotive grade CPU, GPU and NPU. We believe that will more design-in in 2021. Recommended Reasons： Arm has long history on automotive area. Arm CPU continuously supports automotive market since 1996, the top 15 automotive chip makers license Arm IP, more than 60% IVI/ADS systems are based on Arm. The reason why lots of partners are using Arm’s solutions is because Arm continues to develop scalability, efficiency, high performance solutions for the industrials. Arm is also investing to enable the autonomous software ecosystem to leverage the capabilities of this new technology and speed development. Arm believes that autonomy will become the predominant workload of the future and transform industries of automotive and industrial – and we’re really excited to work with our ecosystem of partners to make this a reality. Arm is committed to the future of autonomous systems, and we will be further augmenting and expanding our technology offerings to enable this compute transformation.

• Exascend, Inc.

  

  Main advantages： Customization is at the heart of what we do. Exascend's background in industrial-grade and enterprise-class storage products gives us an unmatched edge in tackling the world’s most demanding storage applications. The second half of 2021 and 2022 so far have been a year of many great accomplishments for Exascend. Not only did we launch the market's first-ever-seen industrial-grade Gen4 E1.S SSD featuring high performance and low power, but we also rolled out the world's first industrial-grade CFexpress card. The Industrial CFexpress combines the flexibility of compact card storage with high-performance industrial-grade NAND flash – making it an ideal choice for applications that demand ruggedness and portability, including ADAS, data loggers, industrial automation and rugged edge equipment. Recommended Reasons： Exascend's approach to hardware and firmware is what makes our solutions so different. We are fully in control of our hardware and firmware solutions, building unique products and designing unique technologies from the ground up. This means is that we can optimize our products for a certain outcome at the deepest hardware and firmware levels, from selecting the perfect materials to writing the firmware source code. In other words, Exascend is not a module house that simply combines off-the-shelf components with turn-key solutions and calls it a day. We believe in going a few steps further – and our technological achievements show why that is the right approach to storage innovation.

• Kneron

  Main advantages： The autonomous vehicle market was valued at over $1 billion in 2019 and is predicted to grow to over $12 billion by 2026. This opportunity encourages innovative startups like Kneron to make a big play in this high growth vertical. Kneron, Weltrend and Elan/Avisonic have combined their expertise to make market-leading Advanced Driver-Assistance Systems (ADAS) for use in autonomous vehicles (AVs). ADAS use sensors in the vehicle such as radar and cameras to perceive the world around it and within the car. It then either provides information to the driver or takes automatic action based on what it perceives. Albert Liu, Founder and CEO of Kneron, says “We are pleased to announce another major partnership in the automotive industry, as we welcome strategic investment from Weltrend. This follows our announcement in January that we have partnered with and received investment from Foxconn to work on implementing our low-power, low-cost AI solutions in the automotive industry. Autonomous vehicles are a fertile innovation that can be positively impacted by the introduction of edge AI technologies, increasing driver and passenger safety.” Kneron is providing its first-generation AI chip, the KL520 for the ADAS, and this is combined with Weltrend’s own smart camera chip which powers optical flow computing algorithms, and Elan/Avisonic’s object detection algorithms. The KL520 is used in a full spectrum of IoT and smart devices. It can power everything from a Tesla to a toaster. The KL520 has a small power footprint which is vital in the automotive industry, where power efficiency is a key component. Kneron’s AI solutions combine low-latency and instant inferencing which makes them perfect for ADAS. The new ADAS resulted in a 70% improvement in the distance of detection. They are now able to identify not just an object, but also whether the object is coming closer, moving farther away or staying static. The ADAS can also now send an early alert if an object is moving towards the vehicle and decrease false alarms. This will demonstrably improve ease of parking and reduce crashes, increasing driver and passenger safety. Sam Lin, CEO of Weltrend, says “We are excited to partner with Kneron as we work to improve our ADAS for autonomous vehicles. Implementing Kneron’s AI technology will allow us to improve the efficacy of our systems while reducing the cost, thereby promoting wider adoption and increasing the performance and safety of autonomous vehicles.” Kneron has also partnered with Otus, a leading camera solutions provider to offer an off the shelf solution for cars that do not come equipped with ADAS. Otus provides a 360° dash cam that did not come equipped with ADAS. Otus upgraded the dash cam by equipping it with the KL520. The Otus dash cam could then identify objects and alert the driver. The Kneron-Otus partnership gives more drivers the opportunity to benefit from AI assistance. Recommended Reasons： Kneron's Reconfigurable Artificial Neural Network (RANN) technology RECONFIGURABLE SOLUTIONS Most AI models are limited to specific applications and frameworks. Kneron's Reconfigurable Artificial Neural Network (RANN) technology adapts in real-time to audio, 2D, or 3D recognition applications while also being compatible with mainstream AI frameworks and convolutional neural network (CNN) models. RANN Technology can: • Compute audio and images including 2D/3D visual recognition • Support AI frameworks: ONNX, TensorFlow, Keras, Caffe, PyTorch • Support CNN models: ResNet, GoogleNet, VGG16, LeNet, MobileNet, DenseNet, YOLO, Tiny YOLO, and more RANN Technology helps partners: • Lower costs by up to 20% • Create commercial applications • Customize edge AI to fit unique use cases TOTAL SYSTEM SOLUTIONS Kneron can customize integrated total system hardware + software solutions that are ideal for hardware makers and industry partners looking to instantly accelerate on-device edge AI computing affordably. Kneron's expertise in both hardware and software solutions sets us apart in the edge AI industry and consistently saves our partners time, energy, and money. Kneron's total system solutions are embodied by the KL520 AI SoC because it integrates Kneron's neural network algorithms to maximize power efficiency and performance for segments such as: • Smart home • Mobile • IoT • Security INTRODUCING KNEO KNEO is a private mesh intelligence network made up of Kneron powered devices that will personalize mobile AI for everyone, just as smartphones and mobile apps personalized mobile computing for all. It will create an open platform for AI application developers to build AI apps based on mainstream AI frameworks and models for consumers and businesses who use KNEO. Kneron Neural network Edge AI Open platform KNEO builds the security of blockchain technology on top of the privacy advantages of edge AI. We invite all AI app developers and device makers to join us in democratizing and transforming the future of AI. KNEO AI APP STORE KNEO's personal mobile AI platform will democratize AI to realize our vision of making AI accessible for everyone. The KNEO platform would give rise to AI apps being as common as mobile apps are today, and start a new world for AI app developers. KNEO's AI app store will be as common as mobile app stores are today by benefitting everyone in the ecosystem. • Developers build and upload AI apps onto the KNEO platform so they can accumulate users and monetize • Consumers download AI apps and install them on their KNEO device ecosystem for private and personal AI assistance • Service providers prescribe AI apps for patient health management, customer car maintenance, or client fitness regimens • Device makers sell more KNEO powered devices as the power of

• Molex

  

  Main advantages： Molex Automotive: Experience Counts For nearly 30 years, Molex has played a vital role in the automotive industry, especially in addressing demand for flawless interconnectivity of mobile devices and data services. In that time, the company has supplied more than 95% of engine control and powertrain connectivity solutions for a major automotive OEM. Molex brings its heritage in networking and longstanding reputation for product quality and customer collaboration to meet growing consumer needs across the automotive ecosystem, spanning electrification, Advanced Driver-Assistance Systems (ADAS), automotive high-speed networking, vehicle antenna systems, connected mobility solutions and vehicle-to-everything communications (V2X). Advancements to Vehicle to Everything (V2X) technology were accelerated in 2021, thanks to Molex’s creation of the first certified active V2X antenna system. Molex’s V2X antenna system provides a 360-degree view around the vehicle resulting in superior data transmitting performance between the vehicle and its environment, ultimately increasing road safety. Molex V2X antenna systems - https://www.molex.com/molex/industry/connected-mobility/v2x - was the first active 802.11p V2X antenna officially certified. This means the solution has undergone extensive testing to ensure effective operations against strict failure and malfunction standards. Without this regulatory certification, these automotive solutions would not be allowed to be activated in their markets. The compensator is a critical element of this overall RF system, making it essential to a compliant, properly controlled mechanism during operation. Molex delivered more than 825,000 V2X antenna systems to a top German Automotive manufacturer in 2021, to be integrated into the designs of several car series. Thanks to this solution, the same top German automotive manufacturer was honored by Euro NCAP, an independent organization dedicated to driving forward road safety in Europe, with the Advanced Award. This exclusive award is presented to manufacturers that take the initiative to introduce ground-breaking safety features. Molex V2X antenna system improves signal performance, allowing signals to be transmitted and received at the highest levels of performance, increasing road safety. In January 2021, Molex announced its accelerometer-based Road Noise Cancelling (RNC) sensor, the first product in a new family of automotive ANC sensors. https://www.molex.com/molex/news/display_news.jsp?channel=New&channelId=-8&oid=2823&pageTitle=Molex+Unveils+Major+Sensor+Innovations+in+Automotive+Active++Noise+Cancellation+to+Improve+Safety+and+Driving+Experiences - The new sensors, are the result of years of collaborative effort with some of the industry’s leading players. Including, Bose, the high-end audio equipment manufacturer, Analog Device and Silentium. The sensors play a critical role in combatting unwanted road, wind and HVAC car noise while reducing low-frequency sounds that increase driver fatigue. The RNC was the first road-noise cancelling product in a new Molex sensor family entered production. They are performance validated for reductions in noise, weight and cost. Delivering fewer design cycles and flexible sensor placement simplifies engineering. Molex teamed with Analog Devices and Silentium to advance automotive ecosystem In 2020, Molex received its first production order for an initial run of approximately 250,000 sensors to accommodate one of Bose’s first QuietComfort™ RNC customers. The Bose and Molex collaboration was recognized with an INFORMA Tech Automotive Award in September 2021 in the Collaborative Partnership of the Year Category. Molex’s global manufacturing footprint ramped sensor production as volumes scaled after the January 2021, launch of the accelerometer-based Road Noise Cancelling (RNC) sensor, the first product in a new family of Molex automotive ANC sensors. In 2021, Molex ultra-reliable connector solutions were selected by Bosch for its infotainment domain computing system built to bring new features to next generation vehicles. Chosen by Bosch to collaborate with other leading technology providers further signifies Molex’s products reliability and elite status in the marketplace. Bosch Information domain computer enables advanced in-vehicle features quickly and efficiently - Bosch Media Service US (bosch-press.com) Recommended Reasons： For nearly 30 years, Molex has played a vital role in the automotive industry, especially in addressing demand for flawless interconnectivity of mobile devices and data services. Molex works alongside its customer as detailed above to keep ahead of the curve to helps is customer identify and meet the challenges of the future. This collaborative approach is clearly illustrated in the results of the Global Automotive Survey on the ‘Car of the Future’ https://experience.molex.com/electronic-solutions/whats-next-in-the-automotive-industry/?utm_source=press-outreach&utm_medium=prrelease&utm_campaign=7011I000000fHCkQAM&utm_region=glb – conducted by Molex in January 2021. This survey highlighted that , 91% of those polled say cars purchased in 2030 will be fully electric or hybrid. That autonomous driving technology will be primarily for driver and passenger safety and that high-speed WiFi, wireless charging and car-to-car communication top features list, while software-defined vehicles among top initiatives at automobile companies. Armed with this kind of knowledge Molex is uniquely positioned to help its customers as the pace of change accelerates at an unprecedented rate and Molex remains re committed to providing insights to help its customers and partners stay ahead of the curve with original research, insights and solutions that drive not just compelling and informed decision making but also vehicles with innovative technology off the production lines. Molex experience extends to all corners of the automotive ecosystem. For decades, Molex’s role in the automotive industry has been elevated by the company’s heritage in the data center, telecom, networking and consumer electronics industries. Molex continues to further its mission to design and deliver critical electronics, connectivity, high-speed networking, data storage as well as power and signal solutions that form the central nervous system of tomorrow’s next-generation vehicle architectures.

• Macronix International Co., Ltd.

  

  Main advantages： Over the past year, Macronix International Co., Ltd. has furthered its success in the array of markets it serves with new, ground-breaking products and important certification of those products by globally recognized standards bodies. The company also moderated conference panels, hosted webinars and authored published articles -- all developed to educate the engineering community on such critical topics as device security and energy savings surround non-volatile memory. Additionally, Macronix has won a prestigious award for product excellence and been featured in leading technology publications. Over the past year, Macronix has: MX25UW high efficiency octaflash flash memory family been selected for NXP® Semiconductor’s S32Z and S32E real-time processors for safe integration of real-time applications; received PSA Certified Level 1 status for its MX75 NOR flash memory; became the Serial NOR flash memory manufacturer to bring 1.2V devices to mass production; increased consolidated net sales 57.4 percent over the previous fiscal year. Additionally, over the past year, Macronix Chairm and and CEO Miin Wu has won a number of awards for leadership and Macronix innovation: Presidential Innovation Award – the first for a Taiwan semiconductor company -- from President Tsai-Ing-wen, who praised Mr. Wu’s efforts to promote industrial innovation. He was also named Academician of the Industrial Technology Research Institute (ITRI), which cited his role in elevating the semiconductor industry in Taiwan to a level of first-class chip design. Additionally, Mr. Wu was recipient of the 2021 Harvard Business Review Digital Transformation Revolution Award, noting his pioneering work to promote the digital transformation of global semiconductor production. Furthermore, Mr. Wu received the Vision Summit lifetime Achievement Award at the 19th Global Views Leaders Forum, for his contributions to social education, cultivating scientific and creating a model for other entrepreneurs. Through his leadership and commitment to innovation, Mr. Wu has guided Macronix to become a NT$50billion company (2021 fiscal year). Recommended Reasons： No other company in the non-volatile-memory market has done more for vehicle safety than Macronix, through developing safety-first NVM products and advocating for safety through webinars and published articles. The company's stated guiding principles are: innovation, quality, efficiency, service and team work. With revenues of US$1,805 millions (in fiscal year 2021), Macronix is clearly the market leader in NOR flash, NAND flash and ROM. Since its strategic and CEO driven decision to enter into the Automotive Memory market in late 2009, Macronix has made huge strides in terms of market, customer, OEM Auto maker and Eco-system penetration. To date, Macronix has passed all critical customers and OEM audits, and is well recognized, by those customers, OEM’s and Chipset vendors alike, as an industry leader in the very demanding Automotive memory segment. As of today, Macronix has shipped more than 500 million automotive qualified (AEC-Q100 compliant) products to its customers. Given the challenges to enter into the automotive market the requirements for well-established systems to support the same, and the extensive product design-in to achieve mass production timescales, this more than 500 million units shipment milestone certainly represents a significant achievement and endorsement from the market. Macronix continues to emphasize on Research and Development and has 8,600+ patents up to Dec. 2021. Our technical papers were published and presented in major international conferences, such as IEDM and ISSCC. Macronix has been granted a large number of high-quality patents and continues its investment in advanced technology development. To provide the next generation of nonvolatile memory solutions, Macronix is jointly developing Phase Change memories along with its high technology global alliance partners. Macronix also announced the world's first Flash prospective technology, BE-SONOS™. Looking ahead, Macronix will continue its research efforts in advanced technology development focusing on nonvolatile memory products. We will continue to enhance our technologies, quality and service and dedicate ourselves to obtaining a superior industry position, higher sales growth, steady business operations, in turn increasing Taiwan's global competitiveness.

• NXP Semiconductors

  

  Main advantages： NXP is aiming to accelerate the shift to a more mobile sustainable future. Comprehensive system solutions for autonomy, connectivity and electrification – with safety and security built-in. Our value proposition includes: Solution portfolio Comprehensive System Solutions for fast time to market and scalability Innovation power In-house high-performance processing, security and mobile eco-system capabilities Automotive safety and reliability Leading with functional safety and security Zero defects methodology Recommended Reasons： NXP have the vision of Zero Road Accidents, Zero Emissions, and Zero Time Wasted. With our innovation technology, we're confident to lead the overall industry to make this vision a reality. NXP's leadership in technology and application are well known in the market.

• onsemi

  

  Main advantages： 1) onsemi's VE-Trac™ Direct SiC and VE-Trac™ B2 SiC are automotive-qualified modules, which feature differentiated transfer-molded packages and innovative sintering processes, providing better thermal performance, lower power losses, higher power and higher efficiency, to enable longer range and smaller batteries for electric vehicles, solving the challenge of using SiC in traction inverter and advancing electric vehicles transition from 400 V to 800 V . 2) onsemi continues to introduce new intelligent power solutions, including SiC, IGBT, high-voltage gate driver, high-voltage rectifier, super junction MOSFET, high-voltage DC-DC, and advanced packaging technologies such as single/dual-sided cool and dual-sided direct cool packaging, enabling higher efficiency, higher power density, and higher reliability for systems such as traction inverters, on board charging, 48 V, auxiliary motor control, and high-voltage load etc., to help accelerate the adoption of electric vehicle 3) With the acquisition of SiC manufacturer GT Advanced Technologies (GTAT), onsemi has become one of the world's few end-to-end SiC solution suppliers from substrate to module, giving us a unique advantage in SiC quality and assurance of supply to advance the EV revolution Recommended Reasons： onsemi is committed to providing a highly differentiated portfolio of innovative products and intelligent power and sensing technologies to drive the electric vehicle (EV) revolution and lead the way in creating a safer, cleaner and smarter automotive ecosystem. With a comprehensive portfolio of automotive-qualified products, onsemi's intelligent power technologies powering the electrification of the automotive industry, including advanced SiC, superjunction MOSFETs, and modular packaging technologies that allow for lighter and longer-range EV and enable efficient fast-charging systems. In particular, onsemi is uniquely positioned as one of the world's few end-to-end SiC solution suppliers from substrate to module. Moreover, with 50 years of technical accumulation and rich customer experience, the company is committed to providing more technically flexible and complete hardware platforms and field application support, which would bringing greater value to customers’ design and verification efforts that help automakers to reduce design and verification time to adapt to changing technical requirements.

• Silicon Motion, Inc.

  

  Main advantages： Silicon Motion provides dependable high-performance automotive-grade storage solutions, including controllers and single-chip solutions for in-vehicle infotainment, navigation, ADAS, DVR, and autonomous driving applications. As the world's leading supplier of NAND flash controllers, we're dedicated to providing a broad range of high-performance solutions that satisfies the strictest design requirements for quality, reliability, and safety. That's why Silicon Motion collaborates with the AECC and undergoes an exhaustive qualification process to ensure that PCIe Gen4 standards and new technologies meet the future demands of the connected vehicle ecosystem. We've designed our latest automotive-grade PCIe NVMe SSD controllers from the ground up with PCIe Gen4 technology and innovative hardware features optimized for true Gen4 performance, low power consumption, and advanced error correction combined with data path and EMI protection. Using 12nm process technology for high throughput, lower power consumption, and rigorous data protection, our controllers provide ultra-high performance and reliability for automotive applications — including a cost-effective PCIe NVMe SSD solution for automotive storage. Ideal for automotive computing environments, we now offer controllers with built-in SR-IOV capability, delivering a direct, high-speed PCIe interface supporting up to eight virtual machines that are capable of fulfilling multiple requirements and functions. Recommended Reasons： With over 20 years of experience in developing specialized processor ICs that manage NAND components, our expertise delivers best-in-class automotive-grade storage solutions. All of our automotive-grade flash products undergo rigorous testing to meet the qualifications that the industry and our customers demand, including AEC-Q100 compliance, ISO 26262, supplier chain certification by IATF 16949 certification, and ASPICE compliance SW development process. In addition, Silicon Motion provides product supply longevity to reduce costs for additional qualifications. The industry is rapidly transforming with technology driving innovation, automotive standards shaping requirements, and consumer preferences changing demands. Since the car on the road is now its own data center, the need for data storage has grown exponentially — and so has the role of NAND flash to support mission-critical functions in automotive applications and entertainment features. For future autonomous driving, the demand for fast, high-capacity storage propels the development of embedded products along with the requirement for a higher-end transmission system and a larger storage unit. As electronic content becomes a larger and larger part of the vehicle, storage technologies employing NAND flash must be able to ensure optimized performance, reliability, and longevity.

• SINTRONES TECHNOLOGY CORP.

  Main advantages： With the tenet of "achieving customer success," SINTRONES has won the affirmation and long-term adoption of many international well-known manufacturers for its in-vehicle computer solutions. It is highly competitive in providing solutions and has obtained many patents in many countries. It will continue to meet the application development needs of various intelligent transportation fields in the future. Recommended Reasons： As an industrial computer manufacturer in Taiwan, SINTRONES has the advantage of mastering the hardware design and manufacture of in-vehicle computers. With long-time experience and years of cooperation with end customers, SINTRONES won precious first-hand interaction and inspiration from customers, and finally designed products most suitable for the vehicle environment and use to create the impressive performance. Since its establishment in 2009, it has continued to accelerate growth. In response to the application of the 5G generation, SINTRONES has integrated the automatic activation module, including the removable SIM card, to provide dual-standby functions. End customers can easily replace the SIM card through these designs and simultaneously support different 5G telecom services. To provide users with the best experience, SINTRONES is also setting a new benchmark in this fiercely competitive 5G application market.

• SUNIX

  

  Main advantages： EVs use new powertrain concepts that require far higher requirements on transmission speed. Added complexity comes from new control units related to the DC/DC inverter, battery, charger, range extender etc.SUNIX has identified the trend of more demanding CANbus application will be intensively adopted by EV user case and emerging equipment in usage ecosystem, and rolled out a series of well-planned CANbus FD expansion solution in different form factor for your innovative application, such as IVI, charging station, battery-swapping station, AMR or V2X infrastructure...

• Texas Instruments

  

  Main advantages： Building on its innovation in battery management systems (BMS), including the introduction of its wireless BMS solution in 2021, Texas Instruments (TI) continues to empower automakers to design BMS architectures for new and emerging battery chemistries that help make EVs safer and more affordable. As electric vehicles (EVs) grow in popularity, advanced battery management systems are helping overcome some of the most critical barriers to widespread adoption: driving range, safety, performance, reliability and cost. Advancements in battery technology are a key factor for mainstream consumers. TI is at the forefront of that effort, driving automotive innovation forward with new technologies that enable engineers to work with multiple battery chemistries and configurations. These advancements are already bringing forth improvements in EV price, performance and reliability from both conventional and leading-edge battery technology. By leveraging TI’s high-precision battery monitors, such as the BQ79616-Q1, automakers can indicate a more accurate driving range. Thanks to their accuracy, TI’s battery monitors can spot early indications that a cell is at risk of over-depletion or overcharging and then disconnect the cell to avoid over-discharging or bleed off excess charge so that the entire pack of cells remains balanced during driving and charging. The devices also watch for rising battery temperature, which is another sign of overcharging or other problems. In addition, TI’s solutions offer multiple channel options in the same package, pin-to-pin compatibility and the complete reuse of established software This ability to scale across platforms decreases the cost of individual EVs and brings cars to market faster. Recommended Reasons： TI is helping carmakers make electric vehicles safer and more affordable, helping to pave the way for a greener future. As automakers consider new EV battery chemistries, battery management systems (BMS) with advanced semiconductor technologies are more critical than ever. With TI’s portfolio of high-precision battery monitors gives automakers the confidence to switch to emerging chemistries and thus making EVs more sustainable and affordable. TI is pushing the boundaries of voltage accuracy and is integrating more control capabilities into each chip to unlock the true potential of car manufacturers. In addition, at TI, research is being done to help ensure our BMS solutions are optimized to accurately support emerging battery types.

• Wolfspeed Taiwan Limited

  

  Main advantages： Many markets today are benefiting from the advantages of Silicon Carbide (SiC) technology, especially the automotive industry. With SiC’s performance improvements over traditional silicon (Si)-based components, systems are seeing lower power losses, faster switching, higher operating temperatures, greater power density, and overall much higher efficiency. Wolfspeed’s portfolio of SiC devices spans a wide range of power levels and applications that bridge the power continuum between lower-power, discrete-based applications through both familiar, industry-standard footprints as well as optimized footprints in higher-power modules. The newest member added to the high-power module family of devices is the EAB450M12XM3. Recommended Reasons： Wolfspeed’s power module product line (shown in Figure 2) includes WolfPACK modules that provide a baseplate-less, industry-standard footprint with up to 1.2kV and 200A operation, while the higher-power modules come in more optimized packaging and serve more demanding applications. All of the modules in this portfolio aim to achieve the same goal of maximizing power density, simplifying layout/assembly, enabling scalable systems and platforms, and minimizing costs of labor and system components while providing the highest level of reliability.

• Andes Technology

  

  Main advantages： As more and more international technology companies are embracing RISC-V and expanding their market and applications, Andes is determined to continue to drive the RISC-V momentum as the leading pure play processor IP vendor. By leveraging years of extensive experience helping customers achieve mass production of diversified products, Andes will support even more RISC-V SoC design teams to introduce innovative products for even wider range of applications. Based on the solid foundation of product portfolio, Andes will broaden it with more high-value products to address the demand for higher-performance, lower-power, more secure and safer RISC-V computing solutions and grow along with the booming market. New Milestones  Andes achieved record high annual revenue of NT$819 million in 2021, which represents 41 percent year-over-year growth.  The fourth quarter revenue hit record high of NT$269million.  Annual shipment of SoCs embedded with Andes CPU cores reached 3 billion in 2021 which represents over 50 percent year-over-year growth. Since inception, the cumulative shipments surpassed a remarkable record of 10 billion.  As of 2021, the cumulative number of IP license contracts exceeded 370. Design wins included many leading companies, such as MediaTek, Renesas, SK Telecom, EdgeQ, HPMicro, Kneron and many others  The applications of Andes’ licensees are diversified. The top five customer applications are AI, Touch Panel, Wireless/IoT, MCU and 5G in 2021.  Over 80,000 users of AndeSight™ IDE. Innovative Products  Andes RISC-V superscalar multicore A(X)45MP and vector Processor NX27V upgraded their spec and performance.  Andes released AndeSight™ IDE v5.0: a comprehensive software solution to accelerate RISC-V AI and IoT developments.  Andes launched AndesBoardFarm to enable SoC designers to explore and evaluate Andes’ RISC-V processors in online FPGA board collection.  COPILOT (Custom-OPtimized Instruction deveLOpment Tools™) v5.4 was upgraded with additional Streaming Port feature to tightly integrate Andes vector processor NX27V to external accelerators. Strategic Partnership  More than 500 ecosystem partners.  Ashling’s RiscFree™ Toolchain extended to support the broad range of Andes RISC-V CPU IPs.  Andes partnered with Codeplay Software to achieve software first SoC design for AI-based applications using RISC-V vector processors.  Andes and Cyberon collaborated to provide edge-computing voice recognition solution on DSP-capable RISC-V processors.  IAR Systems extended development tools performance capabilities for Andes RISC-V cores.  Andes partnered with PUFsecurity to integrate crypto coprocessor PUFiot into RISC-V AIoT security platform.  Andes and Rafael Microelectronics announced a strategic partnership to provide high power efficiency wireless IP solutions for IoT devices.  Andes collaborated with Rambus to offer secure solution for MCU and IoT applications.  Silex Insight and Andes Technology extended strategic partnership to deliver flexible and scalable root-of-trust security IP solution. Global Presence  Andes issued its overseas Global Depositary Receipt (GDR) on the Luxembourg Stock Exchange, making Andes the only international public RISC-V CPU IP supplier. The funding allows Andes to boost investing in R&D and expanding its RISC-V product lines, especially high-end products.  To serve the market with Andes growing portfolio, Andes’ design centers in Taiwan, United States and Canada launched an expansion plan to recruit 200 R&D talents in the coming 3-5 years to develop the next-generation RISC-V products.  Jonah McLeod, Marketing Director of Andes Technology USA Corp., was elected as Chair of Marketing Committee of RISC-V International Association to lead its members around the world to promote RISC-V applications and expand ecosystem. Awards & Accolades  Andes won “Mittelstand Award” held by Minister of Economic Affairs in Taiwan with its innovated and highly competitive technology.  Andes won “Featured IoT Cybersecurity Chip Supplier” of 2021 EE Awards Asia hosted by EE Times and EDN. Its vector processor IP NX27V also won “Best EDA/IP of the Year” in the product category.  Frankwell Lin, Chairman and CEO, was awarded “Outstanding Manager Award” by Professional Management Association of Hsinchu, Taiwan.  Dr. Charlie Su, President and CTO, won RISC-V Technical Contributor Award in recognition of his contribution as Vice Chair of the RISC-V International Technical Steering Committee. Event Presence  At 2021 RISC-V Summit, Andes presented four talks covering the hottest RISC-V technology development and applications, including Andes solution for datacenter, IOPMP, TVM auto-scheduler and Zephyr RTOS.  Andes hosted nearly 40 RISC-V webinars and meetups, including RISC-V CON Hsinchu and RISC-V CON China, to share new market trends and the latest technologies with 3,000+ RISC-V enthusiasts all over the world.  Andes joined more than 50 major industry events and presented over 80 technical talks around the world to promote and reach customers despite the pandemic. The events included AI Hardware Summit, AIoT Taiwan, China Semiconductor Executive Summit, ChipEx, ChipExpo, Clientron Automotive Forum, Cloud & Fog Computing Ecosystem Forum, COMPUTEX, CTHPC, DATE, EE Awards Asia Ceremony, ELEXCON, Embedded World, GSA Asia-Pacific Executive Forum: 5G panel, GSA Silicon Leadership Summit, ICCAD, IP SoC Day Grenoble, Linley Fall Conference, Micro-Electronics Wearables Forum, RISC-V Forum (Security/ Developer Tools/ Embedded Technologies/ Vector & Machine Learning), RISC-V Meetup (Austin/Boston), RISC-V Summit, RISC-V Taipei Day, RISC-V Tokyo Day (Spring/Fall), RISC-V Week, RISC-V World Conference China, SemIsrael, TechTaipei, TSMC OIP Forum (NA/CN/EMEA), TSMC Technology Symposium (NA/TW/EMEA), VLSI-CAD, VLSI-DAT and many others. Recommended Reasons： Focus on CPU IP The strategic technology of CPU IP is indispensable in SoC design. Andes Technology has been devoted to developing CPU IP technology for over 17 years and it is one of the few companies in the world that provides commercial CPU IP and has customers producing high-volume SoC constantly. As the evidence, the annual shipment of SoCs embedded with Andes CPU cores surpassed 3 billion in 2021 and the cumulative shipments hit the milestone of more than 10 billion. Andes was selected as EETimes' Silicon 60 Hot Startups to Watch in 2012 and received TSMC OIP Award “Partner of the Year” for New IP in 2015. In 2020, Andes was awarded “Most Outstanding Embedded Processor IP Supplier” by AI Global Media. Also, its NX27V vector processor IP of AndesCore™ V5 (RISC-V) series was awarded “Hsinchu Science Park Innovative Product Award” at 40th anniversary of the Hsinchu Science Park and “Outstanding Product Performance of the Year” by EETimes (Aspencore Group) at World Electronics Achievement Awards in 2020 as well as “Best EDA/IP of the Year” 2021 EE Awards Asia. Andes won “Mittelstand Award” held by Minister of Economic Affairs in Taiwan with its unique and highly competitive technology and “Featured IoT Cybersecurity Chip Supplier” of 2021 EE Awards. Comprehensive Product Lines Andes keeps driving innovation and launches comprehensive RISC-V CPU IP series, including entry-level 32-bit N22, mid-range N25F/D25F/A25/A27 and 64-bit NX25F/AX25/AX27 and multicore A(X)25MP, vector processor NX27V and the latest superscalar 45-series with 32-bit N45/D45/A45, 64-bit NX45/AX45, and multicore A45MP and AX45MP. Its world-leading RISC-V processor cores with DSP instruction set and vector extension become the best solutions for emerging applications such as 5G, AI/ML, ADAS, AR/VR, blockchain, cloud computing, data center, IoT, storage, security and wireless devices. High-quality Sales and Service Andes provides high-quality sales and technical service by establishing branches in Taiwan, USA and China as well as having professional agents in major IC design regions including Korea, Europe, Israel for sales and customer services. Its customers include world-class companies such as MediaTek and Renesas. The diverse applications range from audio, Bluetooth, datacenter accelerator, 5G Small Cells, gaming, GPS to ML, MCU, sensor fusion, SSD controller, touch controller, USB storage, voice recognition, Wi-Fi, wireless charging, etc. Active Role in RISC-V Strategic Global Planning Andes is the Founding Premier Member of RISC-V International Association (formerly known as RISC-V Foundation). Frankwell Lin, CEO of Andes, is the Board Director of RISC-V International. Charlie Su, President and CTO of Andes, was Vice Chair of RISC-V International Technical Steering Committee in 2021. Every year Andes hosts events including RISC-V CON, Meetup in Taiwan, China and USA as well as over 30 Chinese and English webinars which attracts audience around the world with more than 10 thousand views online. Andes also participates major industry exhibitions, such as Embedded World, DAC, TSMC Symposium and promotes them through social channels including Facebook, Twitter, LinkedIn, WeChat, YouTube, gaining exposure for RISC-V and the brand of Andes. Certification Test Andes Certified Engineer Test (ACET™) Program, hosted by Andes since 2013, issues nearly 200 certificates to engineers who pass the test every year as a reference of recommendation for recruitment in the industry. Fast Growing Business In the 100 Fastest Growing Companies of 2020 announced by CommonWealth Magazine in August 2020, Andes is ranked 35th. Emphasis on Corporate Responsibility With emphasis of corporate responsibility and sustainable values, Andes has devoted itself to developing low power/high performance green power-saving CPU in order to increase power efficiency and protect the environment. For industry–academia collaboration, Andes has provided AndesCore™ to universities around the world for courses, research projects and established joint laboratories with many universities. The total number of contracts with universities (mainly EE and CS departments in Taiwan, China and US) is over 150. Andes has also donated AndesCore™ and peripheral development platforms valued at tens of millions to numerous prestigious universities including NTU, NTHU, NCTU, NCKU in Taiwan. By establishing long term industry–academia collaboration, Andes aims to cultivate talents, communicate with higher education institutions and fulfill corporate responsibility.

• Arm

  

  Main advantages： Arm has involved in embedded market for over 20 years and has built a comprehensive ecosystem. Our strengths are as follows: 1. Comprehensive ecosystem for all Cortex-M CPU from hardware architecture, software platform, toolchain, etc to provide a developer-friendly environment. 2. A series of processor with ultra low power to address IoT market demand. 3. Addressing security concern with secure core, TrustZone and physical protection feature in IoT space. 4. Advanced ML enhancement with companion NPU processor for AIoT application. Arm launched Cortex-M85, Cortex-M55, Ethos-U55 and Ethos-U65 to extend the performance of Arm's AIoT portfolio for endpoint devices during the past 3 years and this low power endpoint solution has been widely adopted by many customers to assist for IoT product innovation. Recommended Reasons： Navigating the IoT landscape can seem complex for companies looking to implement the next IoT idea. However, thanks to 30+ years, over 1,000 partners and over 225 billion chips of experience in providing IP and enabling software platforms, Arm can help make those big IoT ideas a reality and a success. 1. As we move to networks of a trillion devices, Arm provides everything it takes to help build for the future. 2. Easy access to an unparalleled range of processor designs which has made Arm the leading architecture for IoT and embedded devices. 3. Unrivaled efficient processing capability, including AI-enhanced endpoint intelligence, end-to-end security and scalable solutions. Development platforms and tools for software developers that support a huge range of workloads, devices and clouds, making it easier and more efficient to create future devices. 4. An ecosystem of over 300 software partners ready to help accelerate product journeys wherever compute happens. From the smallest, power-constrained endpoints to global compute platforms spanning the edge of the network, Arm and our global ecosystem of partners can meet all requirements. 5. A common security language that the entire value chain can work towards helps ease security implementation, while reusable and consumable certifications encourage industry collaboration. As more and more customers adopt PSA Certified secrity requirement, it allows customers, cyber-security insurers and regulatory bodies to easily identify the security credentials of your product. PSA Certified is uniting the ecosystem under a common language, revolutionizing IoT security for all stakeholders in the IoT industry.

• ASIX Electronics Corporation

  Main advantages： ASIX Electronics Corporation launches most successful and innovative products, - The Greater China's First EtherCAT Slave Controller - The Greater China's First EtherCAT Slave Controller SoC - The newest Quad Port TSN Gigabit Ethernet PCIe NIC Card - The Greater China's First EtherCAT Slave Controller with Dual-Core MCU Recommended Reasons： ASIX Electronics Corporation focuses on developing high-integrated, easy-design and cost-efficient Ethernet-centric and interface silicon products. ASIX has successfully launched many most successful and innovative products applied in industrial/embedded networking, communication and connectivity applications.

• Flexxon Pte Ltd

  Main advantages： Since the official launch of the X-PHY® Cyber Secure SSD in April 2021, we have continued to grow our global presence and networks, while furthering the R&D for the continued integration of the X-PHY into a range of users. We already work with major distributors such as DigiKey, Future Electronics and World Micro to bring the X-PHY solution to users across the globe. Flexxon was also part of the Singapore delegation at the recent pretigious SelectUSA summit, which is a platform for leading technology companies to connect and establish ties for continued collaboration. We have applied for over 50 patents for the X-PHY, and to date, have been granted 17 patents internationally and counting. Flexxon and the X-PHY have received multiple international accolades, and has been actively engaged in industry thought leadership to contribute our expertise to conversations on cybersecurity and data protection. Awards: 2018 • Recipient of the Cyber Security Agency of Singapore’s (CSA) Cybersecurity Call for Innovation award. 2020 • Cybersecurity Awards 2020 finalist, by Association of Information Security Professionals (AiSP), Singapore 2021 • X-PHY® Cyber Secure Solid-State Drive (SSD) officially unveiled. The official launch event was officiated by Singapore’s Minister-in-Charge for the Smart Nation Initiative at the time, Dr Vivian Balakrishnan, senior management from the CSA, ESG, and Heliconia Capital Management. • GovWare x ICE71 Pitch Pit 2021 winner, CSA, Singapore • Black Unicorn Awards 2021 finalist, by Cyber Defense Magazine, USA 2022 • Global InfoSec Awards at the RSA Conference 2022, winner of three categories, USA: i. Editor’s Choice in Cybersecurity Artificial Intelligence ii. Cutting Edge in Data Security iii. Editor’s Choice in Endpoint Security Recommended Reasons： We have addressed a glaring gap in the cybersecurity industry with our multi-award winning flagship product, the X-PHY® Cyber Secure SSD. The X-PHY is the world’s first AI-embbeded firmwave-based cybersecurity solution, and has effectively augmented the cybersecurity landscape by placing defenses right at the core of a device - instead of relying on anti-virus software which can easily be bypassed. The X-PHY is highly intuitive and detects anomalies in behavioural data access patterns, while also monitoring for physical tampering. It effectively shuts down potential incursions in real-time, with round-the-clock monitoring to prevent critical data loss and exposure. Building on the X-PHY’s market-changing technology, Flexxon is developing an entire suite of products that will address gaps in cybersecurity for individuals, SMEs and major enterprises.

• Kameleon Security

  

  Main advantages： Kameleon Security, a semiconductor startup with an advanced hardware approach to computing system cybersecurity, revealed its commercial cyber protection chip, the industry’s first Proactive Security Processing Unit (ProSPU©). Kameleon showcased how the ProSPU safeguards servers and computing systems through a series of firmware and supply chain attack demonstrations at the Open Compute Project (OCP) Global Summit. Kameleon’s ProSPU is a dedicated security processor built directly into a system’s hardware to establish Root of Trust (RoT) from the very first boot process and create a trust anchor and system identity that can’t be accessed from the CPU. This isolates security defenses and the RoT from potential attackers and creates an architectural advantage against them. Unlike other Platform Firmware Resiliency (PFR) solutions, Kameleon’s ProSPU protection doesn’t stop at boot. The ProSPU protects the operating system and applications on the server during run-time, ensuring that the platform not only starts secure but stays secure throughout its lifecycle. Kameleon’s ProSPU is the first commercial solution to meet OCP security standards for RoT. “Kameleon is building the first proactive SPU to enforce system security throughout its lifecycle. Our partnership with Xilinx and our adherence to OCP standards position our unified hardware security infrastructure a step ahead of other PFR solutions as we change the way cybersecurity is done. Building security into the hardware, in an isolated implementation, means that Kameleon provides a true foundation of trust that can be extended all the way up the stack. We’re excited to showcase the unique platform benefits that can be achieved with our ProSPU at the OCP Global Summit next week,” said Jorge Myszne, co-founder and CEO of Kameleon. Kameleon and Xilinx previously announced a partnership that will provide seamless peripheral attestation for Xilinx devices. The ProSPU’s hardware trust anchor verifies compliance that the peripheral device has passed security protocols, attests the validity of the device, and takes measurements to validate the proper signing of the device firmware. These processes will also be demonstrated at the OCP Global Summit, where attendees are invited to Kameleon’s booth (C26) to get a first-look demonstration highlighting the full system RoT in a server architecture, utilizing Xilinx FPGAs. At OCP Global Summit, Kameleon demonstrated how the ProSPU detects and blocks attacks at all levels of the supply chain from initial provisioning on the factory floor to board assembly, where malicious hackers often attempt to replace the devices, all the way to the cloud service provider or data center server, and throughout all the transit and transportation between them, where bad actors attempt to replace the firmware, update malicious code to the firmware, or brick the server. Kameleon tracks the devices through the entire supply chain and maintains the RoT throughout the entire lifecycle. Integrating Kameleon’s ProSPU gives platform designers the benefit to implement PFR while complying with NIST 800-193 and OCP requirements with minimal effort, supporting both standard features such as System Identity, Platform Secure Boot, Peripheral Attestation, Secure A/B Firmware Updates, Platform Recovery and other features that are unique to Kameleon including support for cross-platform architectures (such as Intel, AMD and Arm), highly configurable and customizable security policies, and TPM functionality. Recommended Reasons： Kameleon is on a mission to bring a paradigm shift in secure architecture, tightly interconnecting hardware and software in terms of security, addressing the new computing architectures. The impact is a new security platform that provides an up-to-date hardware security infrastructure, so defenders get an inherent advantage over the attackers.

• Microchip Technology Inc.

  

  Main advantages： We provide total system solutions for creating smart, connected and secure Internet of Things (IoT) designs. This complete product offering simplifies the development of innovative wired and wireless systems, getting you to production faster and speeding up your revenue stream. Applications that leverage our solutions make use of an ecosystem that encompass smart processors, intelligent analog, certified wired and wireless connectivity and robust security. We also provide comprehensive design assistance through our ready-to-use software and tools, partnerships with the largest cloud computing companies and world-class support, making your journey from idea to cloud fast and easy. Recommended Reasons： The Microchip Advantages: 1. Expanding portfolio of leadership products​ 2. Industry-leading development tools​ 3. “Best in Class” lead times and consistent delivery performance​ 4. Quality leadership . . . the relentless quest for perfection!​ 5. Competitive pricing​ 6. Outstanding support through all phases of a project ​ 7. Consistent profitability and rock-solid financial strength​

• NXP Semiconductors

  

  Main advantages： Billions of intelligent, connected devices introduce new opportunities for how we work, consume, move and interact. They also introduce data privacy and security risks. At NXP, we believe that security is essential now more than ever. We have a strong history of providing solutions to ecosystems that require heightened security and privacy, from the edge to the cloud. Our deep engineering expertise, proven processes and understanding of emerging trends are just a few reasons why we deliver some of the most trusted solutions to meet your security needs. We understand that every use case is different—and the security should be as well. A broad portfolio with different product types, complemented by services, provides the scalability to address these varying security needs. Our solutions offer value and differentiation through innovative technologies, architectures and enablement. Microsoft is one of our partners in IOT Cybersecurity. Recommended Reasons： NXP Semiconductors is a leader in secure connectivity solutions for embedded applications, driving innovation in the automotive, industrial, and IoT, mobile, and communication infrastructure markets. As part of its commitment to improving security for the IoT, NXP now has nine PSA Certified Level 1 products and one PSA Certified Level 2 product, including power-efficient MCUs, crossover microcontrollers, and high-performance applications processors.

• Silicon Labs

  

  Main advantages： Silicon Labs (NASDAQ: SLAB) is a leading provider of silicon, software and solutions for a smarter, more connected world. Over the last 26 years, Silicon Labs has evolved from a semiconductor start-up committed to helping developers reduce the cost and complexity of their designs into a global leader in solutions for the Internet of Things (IoT) and infrastructure. The Austin, Texas based company holds more than 1,400 patents, and employ over 1,000 people around the globe. Silicon Labs is the market leader in IoT wireless connectivity, consistently outperforming the market at a projected 20-30% wireless year-over-year CAGR. The company possesses the industry's most comprehensive wireless portfolio, supporting the widest range of protocols, including Bluetooth, Matter, Proprietary, Thread, Wi-SUN, Wi-Fi, Zigbee and Z-Wave, and major ecosystems, such as Amazon, Google, Tuya and Xfinity. The company's connectivity solution built on an integrated hardware and software platform specifically designed for IoT development. Silicon Labs announced the BG24 and MG24 families of 2.4 GHz wireless SoCs for Bluetooth and Multiple-protocol operations, respectively, and a new software toolkit with Matter-Ready platform at the beginning of 2022. This new co-optimized hardware and software Matter-Ready platform will help bring AI/ML applications and wireless high performance to battery-powered edge devices and incorporate PSA Level 3 Secure Vault™ protection, ideal for diverse smart home, medical and industrial applications. The company has developed the industry's most comprehensive IoT ecosystem, serving tens of thousands of customers, thousands of applications and hundreds of leading partners, including organizations defining the next wave of technology such as CSA, Thread Group, Wi-SUN Alliance, and Amazon Sidewalk. • Announced new Bluetooth Location Services solution using accurate, low-power Bluetooth devices to simplify Angle of Arrival (AoA) and Angle of Departure (AoD) location services. Combining hardware and software, this new platform delivers industry-leading energy efficiency by using Silicon Labs' BG22 SiP modules and SoCs, which can operate for up to ten years on only a coin cell battery, with advanced software that can track assets, improve indoor navigation, and better locate tags with sub-meter accuracy. • Silicon Labs is an early supporter of Matter. We've written more than 20% of Matter's source code. Our latest Matter-Ready Platform includes BG24 and MG24 families of 2.4 GHz wireless SoCs brings AI and Machine Learning to the Edge of IoT. • Announced that Z-Wave 800 SoC and modules for the Z-Wave Smart Home and automation ecosystem. Expanding the company’s award-winning Series 2 platform, the EFR32ZG23 (ZG23) SoCs and ZGM230S modules provide developers with sub-GHz connectivity for Z-Wave Mesh and Z-Wave Long Range, and are ideal for smart home, multi-dwelling units (MDU), hospitality and lighting applications, supporting both end devices and gateways. • Silicon Labs' "Works With 2021" IoT Developer Conference attracted nearly 8,000 registrants from around the world. • Delivered the world's first sub-GHz wireless solutions that combine long-range RF and energy efficiency with certified Arm PSA Level 3 security to meet the global demand for high-performance, battery-powered IoT products. Expanding the company's award-winning Series 2 platform, EFR32FG23 (FG23) and EFR32ZG23 (ZG23) system-on-chip (SoC) solutions provide developers with flexible, multiprotocol sub-GHz connectivity options supporting a wide range of modulation schemes and advanced wireless technologies, including Amazon Sidewalk, mioty, Wireless M-Bus, Z-Wave and proprietary IoT networks. • Announced Unify Software Development Kit (SDK), which provides the common building blocks for connectivity across IoT ecosystems. IoT cloud and platform developers will now be able to design world-class capabilities into their devices and gateways with full confidence that those products will interoperate across current and emerging wireless protocols. The Unify SDK will offer ready-made protocol-specific translations for Z-Wave and Zigbee (available today) with plans for Bluetooth, Thread, OpenSync and Matter, dramatically simplifying IoT wireless network interoperability and supporting companies as they scale smart home, city, building and industry ecosystems. • Announced new Security Services, supporting IoT companies with the implementation of Zero Trust security architectures to meet emerging cybersecurity standards and combat the rising tide of threats. The new security offerings complement Silicon Labs' industry-leading Secure Vault™ technologies with a first-of-its-kind Custom Part Manufacturing Service (CPMS) for wireless SoCs and modules. CPMS is a secure provisioning service that helps IoT developers customize their connected products with advanced security features to safeguard hardware, software and ecosystems. The new offering also includes software development kit (SDK) support services for up to 10 years, covering an IoT product's entire lifecycle. Recommended Reasons： Silicon Labs is a leader in secure, intelligent wireless technology for a more connected world. Our integrated hardware and software platform, intuitive development tools, unmatched ecosystem, and robust support make us an ideal long-term partner in building advanced industrial, commercial, home, and life applications. We make it easy for developers to solve complex wireless challenges throughout the product lifecycle and get to market quickly with innovative solutions that transform industries, grow economies, and improve lives.

• Arrow Electronics

  

  Main advantages： Arrow ranks #104 in the 2021 Fortune 500. Arrow was also recognized as one of the “World’s Most Admired Companies” list for the 22nd time. With 2021 sales of US$12.28 billion, Arrow serves more than 18,000 customers in Asia-Pacific. Our strategic direction of guiding innovation forward is expressed in the company's Five Years Out brand platform. Five Years Out is a way of thinking about the tangible future, of bridging the gap between what's possible and the practical technologies to make it happen. Arrow's incredibly broad portfolio brings a unique vantage over the entire technology landscape to every conversation with every customer as we help them design, source, build and launch products that improve the quality of life for people around the world and make the benefits of innovation more accessible to all. Recommended Reasons： Arrow ranks #104 in the 2021 Fortune 500. Arrow was also recognized as one of the “World’s Most Admired Companies” list for the 22nd time. With 2021 sales of US$12.28 billion, Arrow serves more than 18,000 customers in Asia-Pacific. Our strategic direction of guiding innovation forward is expressed in the company's Five Years Out brand platform. Five Years Out is a way of thinking about the tangible future, of bridging the gap between what's possible and the practical technologies to make it happen. Arrow's incredibly broad portfolio brings a unique vantage over the entire technology landscape to every conversation with every customer as we help them design, source, build and launch products that improve the quality of life for people around the world and make the benefits of innovation more accessible to all.

• Avnet Asia Pacific

  

  Main advantages： As one of the world's largest and leading global technology solutions provider, Avnet leverages its product development ecosystem and global reach to accelerate our customers’ ability to provide various technology solutions to meet the global market changes. As the move towards net zero emissions gains traction around the world, we at Avnet monitor our energy and direct and indirect emissions at our major facilities. We focused on improving our emissions data and setting more ambitious goals. Currently, we stand at ESG Risk Rating of 10.2 (Low Risk) / Industry group – 26 out of 582 / Global Universe – 216 out of 14738. Our distribution centers in Hong Kong, Taiwan, Singapore are certified with ISO 14001 Environmental Management System since 2012, focusing on 3R (Reuse, Reduce & Recycle). Furthering our efforts in the realm of electric vehicles (EV) to drive a cleaner and greener environment, we have developed various automotive applications such as 77GHz Radar, Matrix LED Lighting, Smart Car Access and EV inverter, to bring affordable, assessable, compatible and high security and safety solutions to the market, accelerating transition to EV and benefit the masses. Recommended Reasons： 2021 marked the 100th anniversary of Avnet, making it one of only a handful of centennials in tech. From humble beginnings on New York’s famous Radio Row, Avnet has risen to become a global distributor firmly set at the center of the technology value chain and dedicated to helping its customers accelerate technological development. In the past one year, Avnet, a leading global technology solutions provider, has received multiple awards from its partners in the Asia Pacific region. These awards are a testament to Avnet’s outstanding performance in driving profitable growth and sales in the Asia Pacific region. They include awards from big players such as Infineon, Nordic, STM, TE, Xilinx, Yageo, Microchip, Epson, Etron, Bitmain, Exfo, Hytera and so on. Avnet Asia Pacific was also awarded Outstanding International Branded Distributor by ESM-China for 19 consecutive years.

• Digi-Key Electronics

  

  Main advantages： 即使面臨這些難以預測的市場條件，Digi-Key 仍持續投資策略性的規劃，來擴大倉儲負載量、以數位化與實際支持的角度來優化客戶的在地體驗，並增加數位產品、提升網路服務，同時拓展新市場。一切的努力都是為了更好地服務全球各地的客戶，提供最優質的採購體驗。兩年來，當整個世界在全球疫情肆虐下仍持續不斷地創新，Digi-Key 作為一家民營公司，除了使自己持續成長外，更完善其作為線上和目錄電子元件分銷商的商業戰略，為工程師提供最佳的支持，並嘗試更多元的投資，成為創新者所需的資源和一站式商店。 此外，倉庫基礎設施為Digi-Key 近年來最大的資本投資，新的產品配送中心擴建 (PDCe) 後，面積將接近Digi-Key 在 Thief River Falls 配送空間的四倍。PDCe這個夏天即將竣工，令人驚艷地，面積將達220萬平方英尺。 Recommended Reasons： Despite the past year bringing nearly every possible type of challenge to the electronic components industry – decreased production due to the pandemic, severe semiconductor shortages, extended shipping times due to delays at ports, natural disasters and everything in between – Digi-Key experienced significant global sales growth of around 65% in 2021 and they’re on track for continued significant growth in 2022. Sales and demand were strong in every region and segment, contributing to Digi-Key’s $4.7 billion in annual sales for the year. Recommended Reasons： Even throughout these unpredictable market conditions, Digi-Key has continued to invest in strategic initiatives to expand warehouse capacity, localize the customer experience both digitally and from a support standpoint, scale digital offerings and web services and expand into new markets, all to continue serving customers around the globe with the best possible purchasing experience. As the world continued to innovate amid a global pandemic over the past two years, Digi-Key’s status as a privately held company allowed it to continue to grow, refine its commercial strategy as a high-service distributor to best support engineers, and find more ways to invest in being the resource and one-stop shop innovators need. The biggest capital investment Digi-Key has made in recent years is in warehouse infrastructure. The new Product Distribution Center expansion (PDCe) will close to quadruple the footprint of Digi-Key’s distribution space in Thief River Falls. Due to be completed this summer, it’s a stunning 2.2 million square feet.

• EDOM Technology Co., Ltd.

  

  Main advantages： EDOM ranked #10 in the 2021 Semiconductor Distributors' Revenue(Gartner), #10 in the 2022 Top 100 Enterprises of Semiconductor Industry(CommonWealth), received countless trophies from manufactures, and reached the consolidated revenue at NT$108.236 billion in 2021. EDOM provides best-in-class distribution and solutions-based services to vendors, ODMs and OEMs around Asia and the world. With abundant product lines, strong technical support, and excellent logistics and operation, EDOM bridges the gap between manufactures and clients to provide a full range of services and solutions. Recommended Reasons： More than Distribution, EDOM is Your Best Solutions Partner. EDOM has years of experience serving established markets and anticipating the requirements for leading edge products and applications, including portable and wearable devices, wireline and wireless communications, Internet of Things (IoT), automotive, robotics, medical, industrial control, computers and many other applications, as well as deep technical experience in opto-electronics, digital, analog and mixed-signal applications. We are dedicated to providing one-stop service experience in the purpose of reducing time-to-market for innovative ideas to come closer to realities.

• Mouser Electronics

  

  Main advantages： Q: Key strengths and major achievements in the past year Q: Award and Patent Mouser Electronics, a Berkshire Hathaway company, is one of the industry’s top global semiconductor and electronic component distributors. Mouser distributes products from over 1200 industry-leading manufacturers to support the design and prototyping stages of new product development. Mouser also delivers no-minimum orders and same-day shipping along with unsurpassed customer service and localized worldwide support to design engineers and buyers, whether they need a single component or thousands of them. Mouser’s customer-focused distribution delivers tomorrow’s technology today. The company’s expansive line card consists of semiconductors, optoelectronics, embedded solutions, sensors, LED lighting and power, as well as passives, interconnects, electromechanical, circuit protection, enclosures, thermal management and wire/cable products. In other words, whatever parts engineers and buyers need for their designs, Mouser stocks them. Mouser.com provides access to millions of products from all the top brands engineers want and trust. The website quickly searches over 31 million products to locate more than 6.8 million part numbers available for easy online purchase. Mouser.com also provides millions of downloadable data sheets, application notes, and technical design information for research and engineering tools to speed design development. The site offers 21 language choices and accepts 34 different international currencies. Mouser.com also features numerous user-friendly tools, such as the Price and Availability Assistant, project manager with automatic re-order, FORTE the intelligent BOM tool, search accelerators and other time-saving services that streamline finding parts and simplify the ordering process. Selection, speed and accuracy are the foundation of the company’s 93,000 m² warehouse operations. Orders are processed 24/7 and ready to ship in 15 minutes on average for same-day shipping to more than 630,000 customers in 223 countries/territories. Mouser’s operations deliver a 5-Sigma confidence rating, or better than 99%. In 2021, Mouser Electronics introduced thousands of new technologies to help engineers in the industry speed technological research and development and launch new products to the market. Mouser Electronics has established a strong presence in the market. Revenue increased by 60%, customer count increased by 50% and the company won many industry honors and awards within three years, including the following: 2022 Industry Top Distributor Award of Year 2021 – HQEW, China 2021 Digital Innovation Award of the Year – International SCI-TECH Innovation Festival 2021 Outstanding International Branded Distributors — ASPENCORE 2021 Outstanding Distributor Award - China Finance Summit, China 2021 Industry Top Distributor Award of Year 2020 – HQEW, China 2020 Digital Innovation Award of the Year — International SCI-TECH Innovation Festival 2020 Outstanding International Branded Distributors — ASPENCORE 2020 Industry Influential Brand Award — China Finance Summit, China 2019 Most Satisfactory Overseas Franchised Distributor – ESMC, China 2019 Outstanding Brand Image Award – China Finance Summit, China 2018 Top 10 Brands of Electronic Components Industry Award – HQEW, China 2018 Top Component Distributor Award in China – HC360.Com, China 貿澤電子 （Mouser Electronics）是致力於快速引入新產品與 新技術的業界知名代理商。 一直以來，貿澤電子把為快速提供新產品和新技術給全球工程師作為首要任務，在這過程中，貿澤主打小批量但種類豐富齊全的行銷策略，並將所有產品集中在一個倉庫，擁有來自全球超過1200家廠商提供的680多萬種產品，並利用專業的客服團隊和物流，於第一時間為客戶找齊所需的元件，小到一個晶片當日快速發貨，滿足不同客戶需求。 在貿澤官網上，我們還為廣大使用者提供豐富的參考設計、技術與應用的資訊、以及各種工具等，方便使用者開發新設計。 不僅如此，讓他們感覺到Mouser是真正關注最新研發動向，能加速產品設計的代理商，並一步步實踐了Mouser為工程師帶來啟發新設計的最新產品和技術資訊的承諾。 貿澤電子不僅致力於用高效的方式向設計工程師和採購推廣新產品和新技術，更通過關注行業市場的發展和需求不斷地自我完善，鼓勵工程師在研發設計方面的創新，幫助物聯網、人工智慧、新能源等多個領域的發展，為廣大工程師創新創造提供全面及時的支援與服務。 貿澤電子統一倉庫，全球發貨，只要符合貿澤電子對供應商的資質審核需求，就能夠進入貿澤電子產品目錄，貿澤電子會根據市場需求狀況來進行備貨，貿澤電子聚焦於解決客戶在購買元器件中遇到的困難。 回顧2021，貿澤電子的全球合作供應商進一步增至超過1200家，產品線更加豐富，庫存也持續擴大。 在這一年裡，貿澤電子更新了上萬種產品，推出多項新的技術，幫助業內的工程師加快技術研發，上新產品上市速度，3年內貿澤電子的市場整體營收增長了超過60%，客戶也增加約50%，自身也獲得了多次業內榮譽獎項。 此外，我們致力於本土創新增值服務和技術支援，在品牌影響力方面有著獨特的企業價值。 憑藉貿澤電子在市場佔有率、品牌忠誠度、全球領導力等多項優異的表現，持續以出色的企業經營實力和品牌力，不斷推動產業創新，引領未來經濟發展。 所獲得亞洲區獎項有： 2022年6月份 《華強電子網》2021電子元器件行業優質供應商獎 2021年 12月份 《STIF2021國際科創節暨數位服務大會》2021年度數位化創新典範獎和2021年度數位化推動力人物獎 2021年11月份 《國際電子商情》2021全球分銷與供應鏈領袖峰會 - 全球電子元器件分銷商卓越表現獎 2021年7月份 《中國財經峰會》2021 傑出品牌形象獎 2021年 4月份 《《華強電子網》2021電子元器件行業優質供應商獎 2020年12月份《2020國際科創節暨全球數字大會》2020數位化創新大獎 2020年11月份 《2020年度全球電子元器件分銷商卓越表現獎》 - 十大最佳國際品牌分銷商 2020年8月份《中國財經峰會》2020行業影響力品牌獎 2019年11月份《國際電子商情》讀者最滿意海外授權販售者大獎 2019年7月份《中國財經峰會》2019傑出品牌形象獎 2019年4月份《華強電子網》2018電子元器件行業十大品牌企業大獎 2019年1月份《2018年度智慧安防產業峰會暨年度盛典》- 電子元器件優秀分銷商 2018年12月份 《慧聰電子網》電子行業傑出分銷商大獎 2018年11月份 《2018年度全球分銷商卓越表現獎》-十大最佳國際品牌分銷商 2018年11月份 《財經峰會冬季論壇》時代創變榜-2018年度影響力企業 2018年9月份 《中國創新與經濟融合發展大會》2018創新中國（行業）十大領軍企業 2018年9月份 《第13屆亞洲品牌盛典》 亞洲品牌500強 2018年7月份 《CEDA》2018服務工業與物聯網領域快速成長的授權販售者 2018年7月份 《第七屆中國財經峰會》2018傑出品牌形象獎 2018年3月份 《華強電子網》 2017電子元器件行業十大品牌企業大獎 2017年12月份 《慧聰電子網》電子行業傑出分銷商大獎 2017年10月份 《國際電子商情》讀者最滿意海外授權販售者大獎 2017年9月份《中國品牌影響力》2017中國影響力品牌 2017年9月份《亞洲品牌盛典》亞洲品牌500強 2017年7月份 《中國財經峰會》 傑出品牌形象獎 2017年4月份 《CITE》 2017十大增值分銷商 2017年3月份 《華強電子網》 2016電子元器件行業十大品牌企業大獎 Recommended Reasons： See the attachment 1

• Smith

  

  Main advantages： Smith’s revenues reached USD $3.4 billion in 2021. Sales forecasting for 2022 indicate accelerated growth and are expected to reach more than $5 billion. Smith has been ranked the #1 independent distributor of electronic components each year for the past 10 years. The company has operated without interruption throughout the COVID-19 pandemic, implementing stringent health and safety guidelines to protect their employees without impacting their unwavering commitment to quality. Smith launched the 4Cs quality framework, which outlines the four pillars of quality that serve as the foundation for Smith’s operations – comprehensiveness, consistency, continuousness, and certification. The company also launched a new virtual tour showcasing their flagship distribution center in Houston, Texas. This immersive 3D experience has allowed Smith to develop new business opportunities and give customers the chance to explore the company’s state-of-the-art facilities from the convenience of their desk. Smith continues to invest in new services and offerings, including expanded features in the Smith Customer App – the only order management app available from an independent distributor. Recent upgrades include faster access and near real-time order status visibility, quick access to Smith’s market updates, and Korean language support, in addition to English and Mandarin. More recently, Smith has expanded its operational hubs in Hong Kong and Houston, adding 60,000 more square feet of space to the company's global footprint. Additionally, Smith opened a new sales office in Berlin, Germany this past October, bringing the total number of locations worldwide to seventeen. Recommended Reasons： With more than 38 years in the industry, Smith continues to consistently reinvest in its people, processes, and tools to offer customers superior service – supported by well-trained employees, unmatched quality control, and strong IT infrastructure. Smith’s wide array of procurement and supply chain solutions can be tailored to the specific requirements of each customer, and its world-class laboratories and certified testing capabilities ensure quality for any scope of custom project. There is no other company with more experience or that is better positioned to help manage customers’ supply chain challenges.

• Velocity Electronics

  

  Main advantages： Velocity Electronics was founded in 1999 with a specific goal in mind: to build a company unlike any other in the business. A better company, one that customers can depend on for secure, aligned, and flexible component management solutions. A company filled with people committed to acting with integrity – toward customers, suppliers and each other. A company that proves that high ethical standards and great financial success are not contradictory – that, in fact, they are mutually inclusive. Velocity’s owners and the entire organization are dedicated to building long term partnerships. There is a marked difference working with Velocity Electronics. The Velocity team includes an international group of the industry’s most talented and experienced individuals. Recommended Reasons： On IC Supply Chain Management, we take pride in listening and understanding our customers’ challenges and expectations, then tailor our programs to ensure seamless alignment and flawless execution. We have very high ratings on helping our customer's solve their shortages and supply chain issues. Integrity, service, unsurpassed quality, innovation and commitment to continuous improvement are what you can expect from Velocity Electronics.

• WPG Holdings

  

  Main advantages： 1. WPG Holdings the largest electronics distributor in Asia and the world, serves as a franchise partner for about 250 worldwide suppliers. About 100 sales offices around the world, WPG achieved US$20. 65 billion in 2020 revenue.  2. Under the new manufacturing trend, we are committed to transforming into a Data-Driven enterprise, and build an online digital platform - WPG DADAWANT.  We are positioned as a LaaS (Logistics as a Service) provider to advocate smart logistics and assist our customers in facing the challenges of smart manufacturing. WPG expected to build trust with technologies and build a co-opetition eco-system together with the industry through “alliances”.  Moreover, we proactively promote the digital transformation based on the principle of “customer orientation, technology empowerment, collaborative ecosystem and era co-creation”. 3. Company | WPG Holdings Date | November 2021 Award | 2021 Electronic Component Distributor Excellence Award_Top 10 Best International Brand Distributors Source | ESM-China Distributor Awards Recommended Reasons： WPG Holdings the largest electronics distributor in Asia and the world, serves as a franchise partner for about 250 worldwide suppliers，about 100 sales offices around the world. We have been awarded by “Global Electronic Component Distributor Awards” for 21 consecutive years. WPG expected to build trust with technologies and build a co-opetition eco-system together with the industry through “alliances”.  Moreover, we proactively promote the digital transformation based on the principle of “customer orientation, technology empowerment, collaborative ecosystem and era co-creation”.

• WT

  

  Main advantages： WT currently serves as the distribution partner for over 80 global leading semiconductor partners and provides services to over 8,000 quality customers. The products we carry are broadly used in various fields, including communication, computing, consumer electronics, industrial & instrument, IoT, and automotive. WT's annual sales for 2021 totals around US$16 billion, an increase of 34% compared with 2020 period in terms of USD. According to the survey of Gartner, an international market research organization, WT is the fourth largest semiconductor distributor in the world and the second largest in Asia, accounting for 18.9% of the top 10 semiconductor distributors in Asia and 26.9% of the top four semiconductor distributors in Asia. In the past five years, WT's revenue grew at a 29% CAGR, which has outperformed the overall semiconductor market performance. In addition to the practice of management integrity, customer service, employee care, and shareholder interest, we devote ourselves to carrying out corporate social responsibilities of social welfare, environmental sustainability, and corporate governance. We published the fourth Sustainability Reports in 2021. Recommended Reasons： WT has solid field application engineering support capabilities with more than 600 excellent FAEs to help customers solving product problems quickly, and support customers' products for time-to-market. WT has extensive marketing and sales channels with over 40 regional offices in Asia. Therefore, WT can highly grasp market demand and technology trends and provide the most suitable supply chain services. This multi-regions and multi-sectors operation capability can better support customers' multi-regional manufacturing needs with completed supply chain management.

• ams OSRAM

  

  Main advantages： ams OSRAM has made significant progress since March 2021 with a range of key milestones achieved, demonstrating the commitment to become the leader in optical solutions. The combined ams OSRAM is driven by its employees’ collective vision to achieve its strategy in a global one team approach. Successfully applied the Group's leading and powerful technologies to key markets such as digitalization, smart living, energy efficiency and sustainability, including advanced dynamic automotive lighting, microLED display technology, AR/VR optical solutions, automotive sensing and horticultural LED lighting, etc. ; Besides, ams OSRAM also set up first key targets as of the group’s ESG strateg: to be Carbon Neutral by 2030 and to have 25% of leadership positions held by women in 2026. Recommended Reasons： Commitment to growth： Leader in optical solutions driven by secular growth trends in Automotive, Consumer and Industrial & Medical Path to strong sustainable profitability： Doubling of EBIT margin driven by portfolio optimization, manufacturing footprint consolidation, synergy realization and revenue growth Balanced and diversified business mix： Balanced application end-market exposure and diversified global customer base creates broadly supported earnings streams Prudent financial policy： De-lever based on strong operational cash flows and proceeds from divestments, while maintaining investment for growth Focus on long-term value generation： Re-invest in differentiating technology & innovation and related organic growth opportunities, in alignment with ESG focus

• Analog Devices, Inc.

  

  Main advantages： ADI recycled 23 percent of the water we used in 2021 and have set a goal to increase that proportion to 50 percent in 2025. Similarly, 39 percent of the energy used at our manufacturing sites came from renewables last year and we intend to increase that to 100 percent by 2025. ADI is continuing to focus on reducing its impact on the environment and has set goals to achieve carbon neutrality by 2030 and net zero emissions by 2050. ADI released a roadmap that outlines the strategies and actions to achieve these goals . Among these actions, the Company will transition to one hundred percent renewable energy across the Company’s operations by 2025 and addressing emissions across the full value chain, including Scope 3, by 2030. ADI has recently joined the UN Global Compact (UNGC), which is the world’s largest corporate sustainability initiative for companies and consists of more than 12,000 companies and 3,000 non-business signatories based in over 160 countries. Through the UNGC, ADI is focused on advancing universal practices for business strategies and operations. The company also signed the Business Ambition for 1.5°C pledge and is setting science-based targets aligned with limiting global temperature rise to 1.5°C above pre-industrial levels and reaching net zero emissions by 2050. ADI’s targets will be verified by the Science Based Targets initiative (SBTi). Recommended Reasons： ADI invests more than $1 billion in research and development each year, and in 2020, announced the industry’s first green bond of $400 million, enabling ADI to continue to invest in innovation that solves the world’s most difficult problems. Going forward, the company will put even greater focus on maximizing the sustainability impact of its technologies and solutions leveraging enhanced measurement and reporting structures. ADI also launched the Ocean and Climate Innovation Accelerator (OCIA) consortium. ADI has committed $3 million over three years towards the consortium which will focus on advancing knowledge of the ocean’s critical role in combatting climate change as well as developing new solutions at the intersection of oceans and climate.

• Arm

  

  Main advantages： Arm's energy-efficient processor designs and software platforms have enabled advanced computing in more than 225 billion chips and our technologies securely power products from the sensor to the smartphone and the supercomputer. In FY21, a record 29.2 billion chips were shipped. Together with 1,000+ technology partners, we are enabling artificial intelligence to work everywhere, and in cybersecurity, we are delivering the foundation for trust in the digital world. We have the world’s largest computing footprint and a unique understanding of the complete compute spectrum. The future is built on Arm. Recommended Reasons： Arm's Sustainability Vision is that we believe in the power of technology to build a better world for everyone. We want to drive positive change for people and planet, unlocking sustainable growth and enabling progress on the United Nations’ Global Goals. In 2020, we committed to taking a science-based approach to cut absolute emissions from our business operations by at least 42% to achieve net zero carbon by 2030 – 20 years ahead of the 2050 target outlined in the United Nations' Paris Climate Agreement. For unabated emissions, we will invest in accredited carbon sequestration projects while exploring ways to further reduce our emissions, even as we grow. By driving down energy consumption, we can reduce carbon emissions while maximizing impact, wherever compute happens. Arm is the leading technology provider of processor IP. Arm is offerng CPU, GPU, Neoverse, Ethos and SecurCore to address the performance, power, and cost requirements of every device—from IoT sensors to supercomputers, and from smartphones and laptops to autonomous vehicles.

• Cambridge GaN Devices

  

  Main advantages： The environmental need for solutions to resolve the world’s most significant challenges (energy consumption and CO2 emissions) inspires us to contribute to society by preserving nature with energy-efficient power solutions. With a mindset on pushing the limits of semiconductor (GaN) properties and an outstanding team of worldwide experts leveraging knowledge, IP, and decades of research, we demonstrate technological advancement by developing green solutions for everyday electronics, respecting our planet’s natural resources, and creating a more sustainable future for the generations to come. Recommended Reasons： We Commit to a Greener World and a Sustainable Future with Efficient Power Electronics Power semiconductors have become an essential part of our lives. They contribute to the technological advancement of humankind and have become sustainably critical when not combined with efficiency and energy-saving approaches. The compelling need to use the energy more efficiently is driving the industry and the regulators to set new efficiency standards which impact energy hungry applications such as DataCenter, requiring more efficient power semiconductors. CGD's GaN solutions for DataCenters allow to save more than 12 TWh per year which correspond to saving more than 9million metricTons of CO2. At CGD, we are acting today to put electronics on the green agenda and provide customers and end-consumers with advanced power solutions for a greener world and a more sustainable future.

• Chroma ATE Inc.

  

  Main advantages： As the global awareness of climate change mitigation has increased, the goal of net zero emissions by 2050 has been set. Chroma has started the move towards net zero with production and office environment inventory, production process enhancement, and green product design. In terms of climate change and GHG management, the Company complies with ISO 14064-1:2018 to keep track of the GHG emissions of headquarters and branches through inventory and results processes and a thorough understanding of greenhouse gas emissions based on the GHG inventory system. To boost the validity of our GHG inventory information and reporting as well as the quality of the GHG inventory, an unbiased third-party organization was commissioned to do an external verification of our inventory process to ensure complete inventory procedures and optimal data quality. We passed ISO 14064-1 GHG inventory certification in 2021.Chroma completed the expansion of plants and relocation of headquarters at the end of 2020. The concept and methods of green buildings have been implemented in the new headquarters in the aspects of ecology, energy conservation, waste reduction and health, and we earned an EEWH Gold mark. The global trend of net zero emissions and the introduction of carbon border mechanism in Europe and the US, and the transformation to net zero, is no longer just an environmental issue. It has now become an economic issue associated with the international competitiveness of every single company. Chroma, recognized by many top-tier international partners, constantly deploys green energy, has stimulated the business opportunities of the smart city, smart mobility, the smart grid and energy storage, and has developed testing solutions for industries related to green energy technologies. The Company has also leveraged the innovation of measuring technologies to develop multiple testing solutions capable of recovering power and meeting the requirements of green initiatives around the world. We have helped customers save substantial amounts of electricity expenses, and most importantly, we have reduced carbon emission by accelerating the transformation to net zero in the industry. From 2020 to 2021, the Company has assisted their customers in a total reduction of 78 thousand tons of carbon emission. Recommended Reasons： The global trend of net zero emissions and the introduction of carbon border mechanism in Europe and the US, and the transformation to net zero, is no longer just an environmental issue. It has now become an economic issue associated with the international competitiveness of every single company. Chroma, recognized by many top-tier international partners, constantly deploys green energy, has stimulated the business opportunities of the smart city, smart mobility, the smart grid and energy storage, and has developed testing solutions for industries related to green energy technologies. The Company has also leveraged the innovation of measuring technologies to develop multiple testing solutions capable of recovering power and meeting the requirements of green initiatives around the world. We have helped customers save substantial amounts of electricity expenses, and most importantly, we have reduced carbon emission by accelerating the transformation to net zero in the industry. From 2020 to 2021, the Company has assisted their customers in a total reduction of 78 thousand tons of carbon emission.

• Diodes Incorporated

  

  Main advantages： Diodes Incorporated (Diodes) launched a complete 65W High-Integration, Active Clamp Flyback (ACF), Power Delivery (PD), PD3.0 PPS charger reference design in 2021 with improved efficiency, higher power density, and lower standby power for reduced charger size applications. Key efficiency gains for ACF power topology attribute to the integration of ZVS (Zero-Voltage Switching) and leakage energy recycling (during main low-side switch off period). Alternative implementation approaches in the industry either adopt traditional Passive Clamp power with either DCM, CCM, or QR PWM operation modes (and with a RCD snubber circuit for magnetic flex suppression to relieve MOS switch stress), or ACF power with complicated high-side ACF switch control mechanisms. Diodes’ 65W ACF chargers, with either a MOS or GaN FET as the low-side switch, exemplify unique ACF power implementation with high-integration (High-Voltage Start-Up Circuit, X-Capacitor discharging) and a patented low-standby scheme (<20mW) for optimal system BOM (bill-of-materials). Recommended Reasons： Leveraging the design foundations of 65W ACF charger solutions, Diodes Incorporated launches a 140W PD3.1 EPR (Extended Power Range), 28V@5A, Ultra-High-Power-Density (UHPD), premium adaptor solution as a response to emerging and industry-leading requirements for premium gaming notebooks and multiple-port Type-C, PD charging applications. Traditionally, 140W adaptors adopt a two-stage power conversion implementation to meet higher efficiency requirements: a Boost PFC (Power Factor Correction) as the first stage, and an Isolation Resonant LLC power topology as the second stage. As the LLC topology is optimized for fixed voltage outputs only, system designers may add a Low-Voltage (LV) Buck stage after the LLC power stage to generate variable voltage output, as required by PD3.1 requirements (3.3V~21V, or ERP – 15V~28V). Alternatively, system designers may insert a High-Voltage (HV) Buck stage before the LLC power stage to optimize input voltage per PD output voltage requirements, with a rather complicated control scheme. Due to this added Buck stage, the LLC power stage suffered efficiency losses. Complexity of the added buck stage and control logic also tends to further increase system BOM and overall standby power. Using Diodes’ ACF power topology and high integration implementation, system designers can significantly reduce the total system component count from over 300 pieces (seen in industry-leading implementation) to 110 pieces. The 140W ACF PD3.1 premium adaptor reference design reduces the PCB size to 8.4 cm x 5.5cm x 2.2cm (3.31” * 2.17” * 0.87”), which may fit in a case’s volume of 140cm3 (8.54in3), resulting in a very high-power density (1W/cm3, or 16.4W/in3). The efficiency of the 140W PD3.1 adaptor can reach over 93% at 90VAC at full loading (28V@5A), with the total standby power less than 75mW (PFC < 55mW, ACF+PD3.1 < 20mW). Extending this 140W, Single-Type-C, PD3.1 port for Multiple-Type-C port, PD3.1 charging applications, system designers produce suitable adaptors to meet requirements of increased efficiency and reduced standby power of DoE Energy Star Level VI and Europe CoC Tier II for External Power Supply products. The benefits of reduced size, increased efficiency, and lower standby power with optimal system BOM enabled by Diodes’ 140W ACF PD3.1 reference design allows end-users to produce a more portable, energy-saving, environmentally friendly, and smaller charger and adaptor.

• Murata Manufacturing Co., Ltd.

  

  Main advantages： Known as the Worldwide No.1 component supplier, Murata not only offers total solutions but also dedicates to sustaining our environment. Our Kanazu Murata Manufacturing's Plant operates on 100 percent renewable energy starting from Nov. 2021, reducing the load on social infrastructure by deploying the largest storage battery system in the Hokuriku region. Following up, Philippine Manufacturing Co. of Murata, Inc, has become the first overseas production site switching all electricity consumed at the plant to green energy from January 1, 2022. The Murata Manufacturing Group is committed to promoting the use of renewable energy to combat climate change. Recommended Reasons： Murata is well aware that in recent years, the effects of climate change, such as rising sea levels and temperatures have become far more prevalent. To resolve this, it is important for us to work toward the realization of a sustainable society at a company level by implementing renewable energy and optimizing energy management. We ensure that we are meeting our overall targets for reducing greenhouse gases in an effort to solve global warming. We take on the responsibility not only as the leader in components industry, but also the leading company in promiting sustainable society.

• NXP Semiconductors

  

  Main advantages： As a company focused on innovation, NXP is known for our ability to solve problems and address societal challenges, and we are proud of the progress we’ve made since our founding in 2006 regarding our environment, social and governance (ESG) performance. Climate and Environment – In 2021 NXP reduced our normalized carbon footprint (Scope 1 & 2) by 11% compared to 2020. The company also realized an 11% decrease in normalized water consumption from 2020 and recycled 76% of its manufacturing waste. In early 2022, NXP formally committed to the Science Based Targets initiative (SBTi). Diversity, Equality and Inclusion – NXP hired nearly 8,000 new team members in 2021, including approximately 3,300 women. Women now represent 37% of NXP’s global workforce. Health and Safety – NXP maintained stringent protocols to protect team members in response to the COVID-19 pandemic. Achieved its lowest-ever injury rate of 0.08 Total Case Incident Rate (TCIR) for the second year in a row, well below the semiconductor industry average. Recommended Reasons： We use innovation to enable a better, safer, more secure, and sustainable world. We are passionate about technology and believe it can be a powerful catalyst for change. We also recognize that advances in technology can bring with them new challenges for sustainability. For this reason, we make the principals of sustainability — such as energy efficiency, safety, and security — central to our work in product development. To illustrate this approach, let's look at recent NXP innovations in the healthcare, automotive, industrial & IoT, mobile, and communication infrastructure markets HEALTHCARE – SMART MONITORING AND DATA MANAGEMENT As COVID–19 continues to disrupt lives and the global economy, technology companies such as NXP play a vital role in the battle against the pandemic. One of our healthcare solutions, used for Continuous Temperature Monitoring (CTM), offers a convenient way to track COVID–19 symptoms. The solution is built using an NXP NHS3100 NTAG®SmartSensor, an integrated circuit, optimized for temperature monitoring and logging, that includes an NFC interface and a direct connection to the battery. The high degree of integration yields a compact, energy–efficient solution that can be tailored for use in specific healthcare applications. AUTOMOTIVE – SMART SOLUTIONS FOR INCREASED PERFORMANCE NXP is helping global automakers transition their vehicle fleets from internal combustion engines to electric ones. Our smart solutions help manage the batteries that power hybrid and electric vehicles, resulting in higher overall efficiency. Our battery–management solutions can boost performance and extend the vehicle range of e–vehicles by 28%, while our platooning technology has been shown to deliver net fuel savings of up to 8% in hybrids. What’s more, our battery– management systems are supplemented by motor–control solutions that can increase fuel economy by up to 20%. INTELLIGENT EDGE – OPTIMIZING ENERGY THROUGH MACHINE LEARNING Devices in our edge–processing portfolio for automotive, industrial, and IoT offer excellent power efficiency and long–lasting battery life. They’re designed to handle data processing and machine learning at the edge of the network, reducing energy required to transmit data for processing in the cloud. Our smallest microcontrollers consume as little as one microwatt in certain standby conditions, which means they can provide years of battery life. Optimizing energy use at the chip level is becoming an increasingly crucial part of designing energy–efficient edge systems. NXP’s innovative Energy Flex architecture, designed to extend battery life and reduce energy waste in portable and plugged–in devices, makes our latest processors even more energy efficient, using a unique combination of techniques, including heterogeneous domain processing and 28nm FD– SOI process technology. GREEN INNOVATION BOND In May 2021, to help finance our development of ever-smarter chips that reduce energy consumption and emissions, we launched our second Green Innovation Bond. We expect the proceeds from this USD $1 billion bond will be fully allocated at the end of 2022 and invested in projects such as increasing the energy efficiency of power adapters, extending smart mobility, preventing emissions through automated and connected traffic solutions, and reducing the amount of power consumed by smart buildings, the edge processors of cloud services, and 5G cellular networks.

• Richtek Technology Corporation

  

  Main advantages： Richtek has launched the world's first power management IC optimized for image sensing modules in ADAS system, which is also the industry's first automotive power management chip ready to pass Automotive Safety Integrity Level ASILB qualification. Its supply voltage is 28V, and the output voltage is 3V without frequency reduction to meet the requirement of high system efficiency. Our Flyback Power Converter has the compact and minimal system circuit: the primary side is a single chip architecture without any additional components. Our innovative IC control technology is designed to realize the zero-voltage switching technology of the primary side. We provide you the best solution to achieve the ultimate light, thin, short, high efficiency and high power density charger. Compared with traditional chargers, the power density is increased by 3 times, so the size of a charger can be reduced by one-third as we aimed to improve. Recommended Reasons： With long-term experience in developing innovative power solutions for various applications, Richtek has been successful in winning the trust from the global well-known manufacturers/brands such as MediaTek, Huawei, Lenovo, Intel, AMD etc. We also have expended our expertise to new applications such as automotive, 5G etc. Moreover, we always listen to customers’ requirements to provide customised power solutions and technical services.

• STMicroelectronics

  

  Main advantages： Global results (Y2021) 1) -34% GHG emissions in absolute vs 2018 2) Inclusion in DJSI World and Europe indices 3) 90% of our suppliers at risk commited to RBA 4) 187 R&D partnerships 5) 51% of renewable electricity 6) 69% of new products classified as responsible products 7) -16% water consumption (vs 2020) 8) 90% of waste reused, recovered or recycled Local results (H1 2022) - Signed agreement with local partner SP Group to build Singapore's largest Industrial District Cooling System. When operational in 2025, to reduce up to 120,000 tons of carbon emission annually (equivalent to removing 109,090 cars off the roads) - Completion of full switch to LED lightings for front end manufacturing operations in AMK Recommended Reasons： In December 2020, ST committed to become carbon neutral by 2027. To achieve this ambitious target, we have built a comprehensive program looking at all aspects of our business and operations. Progress made in 2021 includes the reduction of our greenhouse gas emissions by 34% compared to 2018 despite the continued expansion of our manufacturing footprint, as well as the increase of renewable energies in the total energy mix we source from 40% to 46%. Sustainability has been in ST's DNA for more than 25 years and is an integral part of our value proposition. We are convinced that a sustainable culture is good for the planet, for our people, and for all our stakeholders.

• Wolfspeed Taiwan Limited

  

  Main advantages： The October 2021 statistics from the International Energy Agency (IEA), which comprises 30-member countries and eight country associations, reaffirm the push toward increasing efficiency in energy consumption. While national budgets for energy efficiency and renewables have continued to grow, the IEA notes that the share of the budgets dedicated to energy efficiency has jumped from 7% in 1990 to 26% in 2020. Wolfspeed new power plants cost over $500 million and two to six years to build, and the approximately 7% CAGR of the home appliance market outpaces the ability to bring new energy production online. Policymaking has therefore come to be dominated by discussions on efficient use of global resources. Greater China & Southeast Asia (GCSEA) is also emphasizing consumer appliance efficiency with new labelling and minimum energy-efficiency performance standards. For instance, on July 1, 2020, China implemented one of the world’s most stringent energy-efficiency requirements for room air conditioners by requiring them to be about 15% more efficient. Because the country is the largest buyer and manufacturer of these appliances, this could result in significant energy and carbon-footprint reduction. Recommended Reasons： With the largest market share in SiC technology, over 30 years of power innovation, and more than 17 years of diode and MOSFET production, Wolfspeed helps designers meet standards requirements in key applications, including motors and switch-mode power supplies (SMPS), that find use across many industries as well as in some of the fastest-growing segments, such as EV charging infrastructure. The company’s SiC devices far outperform conventional silicon (Si) components and set new standards for efficiency and reliability. To meet an incomparable breadth of design considerations, Wolfspeed delivers an equally wide Silicon Carbide portfolio comprising products that scale from 600 V through 1700 V with 3.3 kV and above in development, and from 1 A to nearly 1 kA in power modules. Whatever the power application, there is a Wolfspeed Silicon Carbide discrete product, smaller baseplate-less module built to industry standards, or an optimized-footprint high-power module that not only helps designers meet the latest standards but plan for upcoming requirements in their development roadmaps.

• Amazon Web Services

  

  Main advantages： Recommended Reasons： Amazon is guided by four principles: customer obsession rather than competitor focus, passion for invention, commitment to operational excellence, and long-term thinking. Customer reviews, 1-Click shopping, personalized recommendations, Prime, Fulfillment by Amazon, AWS (Amazon Web Services), Kindle Direct Publishing, Kindle, Fire tablets, Fire TV, Amazon Echo, and Alexa are some of the products and services pioneered by Amazon.

• Arm

  

  Main advantages： Optimizable for the cloud, edge, and 5G networks, Arm Neoverse delivers the speeds, energy efficiency, performance per watt and performance per dollar needed for tomorrow’s infrastructure and its customers. The Arm Neoverse families including V, N series and E series are designed to target the full breadth of the Infrastructure market. The use cases include HPC, HPC in the cloud, AI/ML-accelerated workloads, scale-out cloud, enterprise networking, smartNICs/DPUs, custom ASIC accelerators, 5G infrastructure, power and space-constrained edge locations, networking data plane processor, and 5G deployments for low power gateways. Recommended Reasons： By supporting to a broad range of infrastructure workloads, many leading enterprises have adopted Neoverse platform such as AWS, Oracle, Ampere, GIGABYTE, Google Cloud, Baidu, Microsoft, Tencent, etc to power the next-generation of high-performance computing.

• Exosite LLC

  

  Main advantages： [Key strengths] 1. Functionality: By listening to customers and bringing IoT connected applications to the market for over 10 years, we built a solution that can be leveraged by many different industrial and commercial use cases, no matter the machine, equipment or asset type. No other company offers the level of functionality and configurability in an Off-the-Shelf solution. 2. Low-barrier POC, Onboarding, Commercialization: Exosite’s pricing model, fast deployment, and onboarding packages get customers to a Proof-of-Concept in days. Our experienced team can help guide companies through the process to scale and commercialize. 3. Strong Reputation for 10+ Years: Exosite, founded in 2009, has been supporting customers on our industrial IoT platform and deploying connected solution into the market for greater than 10 years. We pride ourselves in our strong customer relationships and as a partner. [Major achievements] - US government vessel engine remote monitoring project - Japan CO2 monitoring for commercial buildings and schools - Baggage carousel motor predictive mantianance for airports. Recommended Reasons： 1. With Exosite, companies can start on our multi-tenant platform with their own whitelabled condition monitoring application, customized for their application use case. 2. Our conditional monitoring cloud software - ExoSense provides a code-less environment for configuring digital assets, rules, permissions, and visualizations - and can be learned in an afternoon. 3. We offer IoT Connector integrations for a multitude of gateways, connectivity platforms, and off-the-shelf hardware. Exosite works with sensor and wireless companies so that our Apps Engineers can provide options to our customers.

• Footprintku Inc.

  

  Main advantages： ▶Footprintku aligned with BizLink Holding Inc. and Ventec International to seamlessly integrate the electronics industry supply chain, and help product developers effectively reduce the cost and time in product development to enhance competitivenesses. ▶Footprintku has successfully acquired tier 1 clients in the industry at home and abroad with sustainable revenue growth. Recommended Reasons： To solve a long-standing problem of the component digitization process relying heavily on humans due to inadequate digital data in the electronics industry as well as filling the gap between up and downstream, Footprintku created a one-stop service platform, footprintku.com, combined with the concept of sharing economy and cloud service. A customized EDA Library service is provided with a unique AI and Automated Digitization Technology(AADT). In addition, an on-demand service with a huge gallery of ready-to-use digital data is also available to satisfy various requests. Footprintku.com effectively optimizes the electronics product design process and accelerates the digital transformation in the electronics industry. Without the limitation of time and location, this online EDA Library service platform greatly reduces the working time and avoids duplication of work. Moreover, it assists companies to improve effectivenesses and decrease unnecessary business costs to concentrate on product innovation and design to enter a new era in the electronics industry development.

• Andes Technology

  

  Main advantages： As more and more international technology companies are embracing RISC-V and expanding their market and applications, Andes is determined to continue to drive the RISC-V momentum as the leading pure play processor IP vendor. By leveraging years of extensive experience helping customers achieve mass production of diversified products, Andes will support even more RISC-V SoC design teams to introduce innovative products for even wider range of applications. Based on the solid foundation of product portfolio, Andes will broaden it with more high-value products to address the demand for higher-performance, lower-power, more secure and safer RISC-V computing solutions and grow along with the booming market. New Milestones  Andes achieved record high annual revenue of NT$819 million in 2021, which represents 41 percent year-over-year growth.  The fourth quarter revenue hit record high of NT$269million.  Annual shipment of SoCs embedded with Andes CPU cores reached 3 billion in 2021 which represents over 50 percent year-over-year growth. Since inception, the cumulative shipments surpassed a remarkable record of 10 billion.  As of 2021, the cumulative number of IP license contracts exceeded 370. Design wins included many leading companies, such as MediaTek, Renesas, SK Telecom, EdgeQ, HPMicro, Kneron and many others  The applications of Andes’ licensees are diversified. The top five customer applications are AI, Touch Panel, Wireless/IoT, MCU and 5G in 2021.  Over 80,000 users of AndeSight™ IDE. Innovative Products  Andes RISC-V superscalar multicore A(X)45MP and vector Processor NX27V upgraded their spec and performance.  Andes released AndeSight™ IDE v5.0: a comprehensive software solution to accelerate RISC-V AI and IoT developments.  Andes launched AndesBoardFarm to enable SoC designers to explore and evaluate Andes’ RISC-V processors in online FPGA board collection.  COPILOT (Custom-OPtimized Instruction deveLOpment Tools™) v5.4 was upgraded with additional Streaming Port feature to tightly integrate Andes vector processor NX27V to external accelerators. Strategic Partnership  More than 500 ecosystem partners.  Ashling’s RiscFree™ Toolchain extended to support the broad range of Andes RISC-V CPU IPs.  Andes partnered with Codeplay Software to achieve software first SoC design for AI-based applications using RISC-V vector processors.  Andes and Cyberon collaborated to provide edge-computing voice recognition solution on DSP-capable RISC-V processors.  IAR Systems extended development tools performance capabilities for Andes RISC-V cores.  Andes partnered with PUFsecurity to integrate crypto coprocessor PUFiot into RISC-V AIoT security platform.  Andes and Rafael Microelectronics announced a strategic partnership to provide high power efficiency wireless IP solutions for IoT devices.  Andes collaborated with Rambus to offer secure solution for MCU and IoT applications.  Silex Insight and Andes Technology extended strategic partnership to deliver flexible and scalable root-of-trust security IP solution. Global Presence  Andes issued its overseas Global Depositary Receipt (GDR) on the Luxembourg Stock Exchange, making Andes the only international public RISC-V CPU IP supplier. The funding allows Andes to boost investing in R&D and expanding its RISC-V product lines, especially high-end products.  To serve the market with Andes growing portfolio, Andes’ design centers in Taiwan, United States and Canada launched an expansion plan to recruit 200 R&D talents in the coming 3-5 years to develop the next-generation RISC-V products.  Jonah McLeod, Marketing Director of Andes Technology USA Corp., was elected as Chair of Marketing Committee of RISC-V International Association to lead its members around the world to promote RISC-V applications and expand ecosystem. Awards & Accolades  Andes won “Mittelstand Award” held by Minister of Economic Affairs in Taiwan with its innovated and highly competitive technology.  Andes won “Featured IoT Cybersecurity Chip Supplier” of 2021 EE Awards Asia hosted by EE Times and EDN. Its vector processor IP NX27V also won “Best EDA/IP of the Year” in the product category.  Frankwell Lin, Chairman and CEO, was awarded “Outstanding Manager Award” by Professional Management Association of Hsinchu, Taiwan.  Dr. Charlie Su, President and CTO, won RISC-V Technical Contributor Award in recognition of his contribution as Vice Chair of the RISC-V International Technical Steering Committee. Event Presence  At 2021 RISC-V Summit, Andes presented four talks covering the hottest RISC-V technology development and applications, including Andes solution for datacenter, IOPMP, TVM auto-scheduler and Zephyr RTOS.  Andes hosted nearly 40 RISC-V webinars and meetups, including RISC-V CON Hsinchu and RISC-V CON China, to share new market trends and the latest technologies with 3,000+ RISC-V enthusiasts all over the world.  Andes joined more than 50 major industry events and presented over 80 technical talks around the world to promote and reach customers despite the pandemic. The events included AI Hardware Summit, AIoT Taiwan, China Semiconductor Executive Summit, ChipEx, ChipExpo, Clientron Automotive Forum, Cloud & Fog Computing Ecosystem Forum, COMPUTEX, CTHPC, DATE, EE Awards Asia Ceremony, ELEXCON, Embedded World, GSA Asia-Pacific Executive Forum: 5G panel, GSA Silicon Leadership Summit, ICCAD, IP SoC Day Grenoble, Linley Fall Conference, Micro-Electronics Wearables Forum, RISC-V Forum (Security/ Developer Tools/ Embedded Technologies/ Vector & Machine Learning), RISC-V Meetup (Austin/Boston), RISC-V Summit, RISC-V Taipei Day, RISC-V Tokyo Day (Spring/Fall), RISC-V Week, RISC-V World Conference China, SemIsrael, TechTaipei, TSMC OIP Forum (NA/CN/EMEA), TSMC Technology Symposium (NA/TW/EMEA), VLSI-CAD, VLSI-DAT and many others. Recommended Reasons： Focus on CPU IP The strategic technology of CPU IP is indispensable in SoC design. Andes Technology has been devoted to developing CPU IP technology for over 17 years and it is one of the few companies in the world that provides commercial CPU IP and has customers producing high-volume SoC constantly. As the evidence, the annual shipment of SoCs embedded with Andes CPU cores surpassed 3 billion in 2021 and the cumulative shipments hit the milestone of more than 10 billion. Andes was selected as EETimes' Silicon 60 Hot Startups to Watch in 2012 and received TSMC OIP Award “Partner of the Year” for New IP in 2015. In 2020, Andes was awarded “Most Outstanding Embedded Processor IP Supplier” by AI Global Media. Also, its NX27V vector processor IP of AndesCore™ V5 (RISC-V) series was awarded “Hsinchu Science Park Innovative Product Award” at 40th anniversary of the Hsinchu Science Park and “Outstanding Product Performance of the Year” by EETimes (Aspencore Group) at World Electronics Achievement Awards in 2020 as well as “Best EDA/IP of the Year” 2021 EE Awards Asia. Andes won “Mittelstand Award” held by Minister of Economic Affairs in Taiwan with its unique and highly competitive technology and “Featured IoT Cybersecurity Chip Supplier” of 2021 EE Awards. Comprehensive Product Lines Andes keeps driving innovation and launches comprehensive RISC-V CPU IP series, including entry-level 32-bit N22, mid-range N25F/D25F/A25/A27 and 64-bit NX25F/AX25/AX27 and multicore A(X)25MP, vector processor NX27V and the latest superscalar 45-series with 32-bit N45/D45/A45, 64-bit NX45/AX45, and multicore A45MP and AX45MP. Its world-leading RISC-V processor cores with DSP instruction set and vector extension become the best solutions for emerging applications such as 5G, AI/ML, ADAS, AR/VR, blockchain, cloud computing, data center, IoT, storage, security and wireless devices. High-quality Sales and Service Andes provides high-quality sales and technical service by establishing branches in Taiwan, USA and China as well as having professional agents in major IC design regions including Korea, Europe, Israel for sales and customer services. Its customers include world-class companies such as MediaTek and Renesas. The diverse applications range from audio, Bluetooth, datacenter accelerator, 5G Small Cells, gaming, GPS to ML, MCU, sensor fusion, SSD controller, touch controller, USB storage, voice recognition, Wi-Fi, wireless charging, etc. Active Role in RISC-V Strategic Global Planning Andes is the Founding Premier Member of RISC-V International Association (formerly known as RISC-V Foundation). Frankwell Lin, CEO of Andes, is the Board Director of RISC-V International. Charlie Su, President and CTO of Andes, was Vice Chair of RISC-V International Technical Steering Committee in 2021. Every year Andes hosts events including RISC-V CON, Meetup in Taiwan, China and USA as well as over 30 Chinese and English webinars which attracts audience around the world with more than 10 thousand views online. Andes also participates major industry exhibitions, such as Embedded World, DAC, TSMC Symposium and promotes them through social channels including Facebook, Twitter, LinkedIn, WeChat, YouTube, gaining exposure for RISC-V and the brand of Andes. Certification Test Andes Certified Engineer Test (ACET™) Program, hosted by Andes since 2013, issues nearly 200 certificates to engineers who pass the test every year as a reference of recommendation for recruitment in the industry. Fast Growing Business In the 100 Fastest Growing Companies of 2020 announced by CommonWealth Magazine in August 2020, Andes is ranked 35th. Emphasis on Corporate Responsibility With emphasis of corporate responsibility and sustainable values, Andes has devoted itself to developing low power/high performance green power-saving CPU in order to increase power efficiency and protect the environment. For industry–academia collaboration, Andes has provided AndesCore™ to universities around the world for courses, research projects and established joint laboratories with many universities. The total number of contracts with universities (mainly EE and CS departments in Taiwan, China and US) is over 150. Andes has also donated AndesCore™ and peripheral development platforms valued at tens of millions to numerous prestigious universities including NTU, NTHU, NCTU, NCKU in Taiwan. By establishing long term industry–academia collaboration, Andes aims to cultivate talents, communicate with higher education institutions and fulfill corporate responsibility.

• Arm

  

  Main advantages： Arm technology is defining the future of computing. Our energy-efficient processor designs and software platforms have enabled advanced computing in more than 225 billion chips and our technologies securely power products from the sensor to the smartphone and the supercomputer. In FY21, a record 29.2 billion chips were shipped. Together with 1,000+ technology partners, we are enabling artificial intelligence to work everywhere, and in cybersecurity, we are delivering the foundation for trust in the digital world. We have the world’s largest computing footprint and a unique understanding of the complete compute spectrum. The future is built on Arm. Recommended Reasons： 1. Arm is the leading technology provider of processor IP. Arm is offerng CPU, GPU, Neoverse, Ethos and SecurCore to address the performance, power, and cost requirements of every device—from IoT sensors to supercomputers, and from smartphones and laptops to autonomous vehicles. 2. Arm Mali GPUs provide the ultimate visual experience across a wide range of devices, scaling from entry-level smartphones to visually stunning, high-performance Android OS-based tablets and Smart TVs. Our Mali Camera series of ISP brings next-gen camera and image signal technologies to automotive, consumer, and embedded devices. 3. Arm System IP enables designers to build Arm AMBA systems that are high performance, power efficient and reliable. Configurable for many different applications. It's the right choice for your system whether it is a high-efficiency IoT endpoint or a high-performance server SoC. 4. Arm provides a range of security IP products designed to protect against a variety of different attacks, even physical attacks. Arm security IP extends across the system with processors and subsystem protection (both hardware and software), as well as acceleration and offloading. 5. Arm development tools and design services help worldwide engineers deliver market-leading products that fully explore the capabilities of their Arm-based systems including Keil MDK, Arm Mobile Studio, etc.

• Cadence Desgn Systems, Inc.

  

  Main advantages： Key strengths and major achievements in the past years: To power the technologies and products of the future, the world’s most creative companies require end-to-end solutions to deliver chips, IP, packages, PCBs, and systems to meet demanding design requirements. Cadence has continuously evolved over time to address the world’s most pressing design challenge and has formulated its Intelligent System Design™ strategy, which empowers customers achieve the following: • Design Excellence: Lets users create and package the biggest, most complex digital SoCs, and the fastest, most compact analog/RFICs. • System Innovation: Enables designers to deliver performance-optimized, secure electronic systems, from chip to package to board, software and case. • Pervasive Intelligence: Allows the compute of intelligent decisions on target workloads in specialized processors from the cloud to the edge. Cadence has deep expertise in computational software, offering a broad portfolio of design solutions, which bring the world’s most innovative products to life. Major achievements 1.100 Best Companies to Work For by Fortune and Great Place to Work: Cadence named to the list for the eighth year in a row, appearing at #38 in 2022 2.100 Best ESG Companies: Recognized by Investor's Business Daily in 2021 for profitability along with ethical and socially responsible business practices 3.TSMC OIP Partner of the Year: Cadence received four Open Innovation Platform Partner of the Year awards from TSMC for 4nm design infrastructure, 3DFabric design solution, cloud-based productivity solution and DSP IP collaborations 4.Great Place To Work Best Workplaces™ in Taiwan 2020 5.Best EDA Product in EEAwards Asia 2021 6.International Partner Office Award from the Ministry of Economic Affairs (MOEA) 2021 Recommended Reasons： Cadence transforms the way people design next-generation chips and systems. The company provides the expertise and software, hardware and IP required for the entire electronics ecosystem, from chip design to chip packaging to boards and to systems. Cadence is a pivotal leader in computational software and enables electronic systems and semiconductor companies to create innovative products that transform the way people live, work and play. Cadence products enable the world’s leading electronics providers to optimize power, space, and energy needs for the most dynamic market applications, including consumer, hyperscale computing 5G communications automotive, aerospace, industrial and healthcare. It is the company’s culture of innovation that drives the development of new products, socially responsible business practices and the long-term success of Cadence customers worldwide.

• Exascend, Inc.

  

  Main advantages： Customization is at the heart of what we do. Exascend's background in industrial-grade and enterprise-class storage products gives us an unmatched edge in tackling the world’s most demanding storage applications. The second half of 2021 and 2022 so far have been a year of many great accomplishments for Exascend. Not only did we launch the market's first-ever-seen industrial-grade Gen4 E1.S SSD featuring high performance and low power, but we also rolled out the world's first industrial-grade CFexpress card. The Industrial CFexpress combines the flexibility of compact card storage with high-performance industrial-grade NAND flash – making it an ideal choice for applications that demand ruggedness and portability, including ADAS, data loggers, industrial automation and rugged edge equipment. Recommended Reasons： Exascend's approach to hardware and firmware is what makes our solutions so different. We are fully in control of our hardware and firmware solutions, building unique products and designing unique technologies from the ground up. This means is that we can optimize our products for a certain outcome at the deepest hardware and firmware levels, from selecting the perfect materials to writing the firmware source code. In other words, Exascend is not a module house that simply combines off-the-shelf components with turn-key solutions and calls it a day. We believe in going a few steps further – and our technological achievements show why that is the right approach to storage innovation.

• GaN Systems

  

  Main advantages： This past year has been one of significant growth for GaN Systems. The demand for higher performing, more efficient power electronics continues to grow exponentially, and traditional silicon solutions cannot keep up. GaN Systems is the global leader in GaN power semiconductors with the most extensive transistors portfolio that uniquely addresses the needs of today’s most demanding industries, including consumer electronics, data center servers, and power supplies, renewable energy systems, industrial motors, and automotive electronics. In November 2021 GaN Systems announced a $150 million growth capital fund round to accelerate innovation and adoption of GaN technology across its automotive, consumer, industrial and enterprise markets. Fidelity Management & Research LLC led the fundraising round with Vitesco Technologies and BMW i. Also in November 2021, GaN Systems it was ranked 266 on the Deloitte Technology Fast 500, a ranking of the 500 fastest-growing technology, media, telecommunications, life sciences, fintech and energy tech companies in North America. The results show that GaN Systems, a 485% growth, ranked #1 in the semiconductor sector. In September 2021, GaN Systems announced a Capacity Agreement with BMW Group for GaN Systems’ high-performance, automotive-grade GaN power transistors, which increase the efficiency and power density in electric vehicles. The guaranteed volumes by GaN Systems are a key building block for reliability in the supply chain for automotive players like BMW. GaN Systems has added technology veterans across all key disciplines, including engineering, sales, and marketing. The company is strengthening its in-house capabilities with system-level expert engineering, and design teams focused on power conversion from 30W to 150kW in packages ranging from discrete chips to high power modules, application expertise in consumer chargers, data centers PSUs, and automotive powertrain. GaN Systems has seen acceptance beyond consumer electronics into automotive, industrial, data center, and renewable energy industries. In addition to unlocking the value of smaller, lighter, more efficient, and lower-cost power electronics, GaN has become a vital component to reducing companies’ environmental impact. It is enabling them to create more energy-efficient power electronics that require fewer scarce resources and materials. During this past year the world’s smallest fast-charging GaN charger was unveiled using GaN Systems technology – giving consumers what they are demanding, smaller, sleeker, higher efficiency and faster-charging devices for their laptops, smartphones and other devices. GaN Systems’ transistors for high frequency WPT applications are enabling a world without wires. The old wireless chargers use low frequency WPT technology, and are anything but wire-free. In fact, wireless mobile phone chargers can often be seen as little more than an extension to an electrical outlet. High frequency WPT technology has always been the best option for wireless charging solutions, and GaN-based transistors have always been the best option for high frequency applications. This year GaN Systems transistors have enabled new levels of innovation in wireless power, with a wide range of GaN powered consumer products being introduced to the market, including high-power wireless charging for autonomous aerial, mobile, marine, and industrial robots and drones. The latest GaN enabled innovations include in-cabin wireless charging for automotive interiors that are capable of powering multiple devices beyond 15W of power—without requiring physical contact with a charging pad. Other innovative applications include cordless power tools, safety and inspection drones, and through-wall data solutions that can provide power and data through walls for applications ranging from televisions to 5G. Other significant achievements: In June 2022, GaN Systems introduced a new transistor to its portfolio. The GS-065-018-2-L expands the company’s high-performance, low-cost transistor portfolio and features lower on-resistance, increased robustness and thermal performance, and an 850V VDS (transient) rating. The GS-065-018-2-L is a 650V, 18A, 78 mΩ bottom-side cooled transistor ideal for smaller and lighter consumer adapters for laptops and gaming consoles and higher power density and efficiency in televisions and server SMPS. Lower RDS(on) means lower power loss and higher power rating, resulting in higher efficiency and power density. The 78 mΩ transistor—is the perfect addition to industry favorites from GaN Systems, the 150 mΩ GS-065-011-2-L, and 50 mΩ GS-065-030-2-L. This new product targets 100W – 800W adapters, consumer and industrial power supplies, LED drivers, Bridgeless Totem Pole PFC circuits and motor drives. In August 2021 GaN Systems introduced two new transistors in the industry’s broadest portfolio of GaN power transistors. The GS-065-011-2-L allows users to reduce the cost per watt of delivered powered in 45W to 150W applications and the GS-065-030-2-L is the first GaN product on the market that enables designers to get the advantages of low-cost GaN in applications up to the 3,000W power level. The demand for higher performing, more efficient power electronics is growing exponentially, and traditional silicon solutions cannot keep up. Silicon has reached its limits and Gallium Nitride is taking over to enable smaller platforms to run cooler and use fewer materials. GaN Systems continues to widen its reach worldwide as customers in automotive, consumer electronics, data centers, and industrial and renewable industries seek ways to improve or create more sustainable and energy-efficient power systems that use fewer materials. GaN is vital in creating these products, delivering greater energy conversion efficiency and power density than legacy Silicon-based power systems. Recommended Reasons： We live in a data and energy driven world increasingly defined by power-reliant industries including data centers, electric vehicles, renewable energy systems, industrial motors, and consumer electronics. These businesses have long faced formidable and universal challenges around energy wasted in power conversion, as well as the size limitations placed on overall product design by the old generation ecosystem of power system components. Silicon has reached its limits and Gallium Nitride is the clear and undisputed solution to enable smaller platforms to run cooler and use fewer materials. GaN Systems’ approach to a new generation of GaN power transistors is leading an industry-changing shift in both the short-term and ‘near future’ relationship between technology’s power systems and energy–creating significant product and system-wide changes. Design engineers are building power systems that are: • one-quarter the power loss • one-quarter the size • one-quarter the weight • and less expensive than silicon-based solutions As a result of this unique approach, the market has responded, and GaN Systems has reported significant growth. The GaN Systems Taiwan office has seen exponential growth with 3X expansion of it’s office. GaN Systems’ Ottawa headquarters and engineering hub have also grown by 3X and are expected to reach 200 employees in the coming year. The company has doubled its overall headcount in 2021 across Asia, Europe, and North America. It is on target to double again in 2022. Gan Systems is the leader in GaN power semiconductors and is first in these five areas - driving change for customers and the semiconductor industry: • High Power Applications – With demand for electricity growing at unprecedented rates GaN Systems is the first to deliver high-power capabilities for the most compact and elegant designs • Product Breadth – Gan Systems is the first to provide a full breadth of power solutions to specific to markets such as electric vehicles, data centers, renewable energy, consumer electronics chargers, audio amplifiers and speakers. • Reliability – GaN Systems is the first to demonstrate that their power transistors increase the performance and reduce the cost of power electronics systems in comparison to Silicon and SiC-based approaches. • Packaging – GaN Systems is the first to overcome the heat challenge with a proprietary embedded packaging solution – GaNPx – to address the thermal challenge in medium and high-power applications innovation. • Supply Chain – GaN Systems is the first to prioritize the creation of a robust and resilient supply chain for its products through partnerships and co-location decisions with leading global chip manufacturers and foundries SMC, USI, and ASE. GaN Systems is dedicated to make a positive impact in the world by the ways we use our natural resources and bring greater energy efficiency into an increasingly electrified world. Additionally, GaN Systems is committed to fostering the education and careers of young engineers. For eight years, GaN Systems along with China Power Supply Society and Hefel University, has hosted the “GaN Systems Cup.” Fifty teams from China’s top universities are selected to enter. GaN Systems continues to invest in education knowing that these engineers are helping to define the future of the power electronics industry and they will drive innovation in energy conservation, emission reduction and new energy utilization.

• Imagination Technologies

  

  Main advantages： In 2021 many businesses took significant steps towards post-pandemic recovery. However, after unprecedented shifts in markets, supply chains and customer behaviour, it has become clear that companies need to adapt to not only grow but to thrive. Imagination Technologies has shown outstanding resilience and adaptability during 2021 by focusing on two key pillars to help aid recovery and development. The first pillar is company’s culture, which has been consolidated through extensive support to facilitate new and safe ways of work for employees. From the start of the pandemic the company has offered COVID support by facilitating home working with a country specific approach, focusing on engaging employees digitally and offering wellbeing benefits. In 2021 Imagination focused on launching its official global hybrid working programme, allowing more flexibility for its employees. Secondly, Imagination’s Leadership, has seen a series of major appointments that drove growth across all areas of the business. Simon Beresford-Wylie, the company’s newly appointed CEO, set out to create a clear and actionable Mission, Vision and Strategy for Imagination, uniting the business and giving it direction. The executive management board was rebuilt, with the appointments of Tim Mamtora (CIO), Tim Whitfield (COE) and more. Imagination has also attracted several world-class non-executive directors to further strengthen the leadership team; these include Carol Chesney, Didier Lamouche and Sir Peter Bonfield. This two-pronged plan not only helped Imagination adapt to the new normal, but also resulted in significant growth across the year – with overall revenues increasing >20%% YOY, and profit margins closing at >20%, and very strong growth in EBITDA. In addition, the 2021 Employee Engagement Survey has seen notable improvement in response rate, engagement score and a 26-point growth in Employee Net Promoter Score. During the past 12 months, Imagination has shown a true drive for innovation, launching the market-first Level 4 ray tracing GPU, the IMG CXT, as well as its first RISC-V licensable real-time CPU cores. In addition, Imagination has also launched its Open Access program, aimed at enabling start-ups and scale-ups with access to IP without licensing fees in order to create innovative SoC designs and further push technological innovation . Recommended Reasons： Imagination has shown significant growth through its focus on company culture and strategic appointments: • Collaborative company culture – keen focus on meeting the remote and flexible working demands of employees, while providing COVID support and building strong CSR • Focusing on building strong leadership, with notable results in employee perceptions as well as business metrics • Resilience and growth vs 2020 • In H1 2021 Imagination signed over 35 licensees across segments including automotive, datacentre and desktop, mobile, and DTV. • Imagination has a 35.1% share in smartphone graphics processing unit (GPU) (source: TSR) and is the largest GPU supplier to the automotive industry with approx. 51% share (source: Gartner) and over a quarter of a billion automotive units shipped across more than 300 models (source: customer data).

• MosChip Technologies Limited

  

  Main advantages： MosChip provide high-quality and value-added Design Services, IPs “with excellent product and service quality", MosChip is one of the oldest publicly-traded companies with a steady growth & plan towards future. We are the destiantion especially when the customer needs customization in the IP unlike other providers. MosChip provides the customized IPs to its customers making is influential for many Entrepreneurs, Research & Development centres, Institutes & startups. We have also collaborated with Brainchip to Demonstrate Capabilities of Neural Processor IP & ASICs for Smart Edge Devices. 1. We are recognized as the India's Top 150 Fastest-Growing Companies for 2022 by "Economic Times & Statista. 2. We are also recognized as the Top 500 Asia-Pacific Region's High-Growth Companies for 2022 by The Financial Times & Statista" Recommended Reasons： In terms of technology, manpower & growth, MosChip has been exponential. We have recently released 2 IPs, we have almost doubled our engineers since the last year, We ae workign on multiple ODC models from across the globe & even the financial growth has been onward & upward. MosChip is now onboarded a set of new leadership & Board that has a focused strategy towards its vision. We have some great leaders, product lineup, upgraded design services & few exciting collaborations. Team MosChip is confident that it is posied to grow to its highest level of the career in the next few years for sure & the same has been the impression fro our growing stakeholders.

• Media.app Co. Ltd

  

  Main advantages： Key: 1. Self-developed 3D engine to support real physical collision 2. The only metaverse in the world that supports multiple chains 3. Spherical 360° live streaming interaction 4. Integrate redeem functions, virtual and real integration 5. The first in Asia to have built-in advertising billboards in the Metaverse (placement) achievement： 180,000+ hits/month, Unique visitors: 4000/month Recommended Reasons： International-level NFT project, supported by Silicon Valley VC and won international awards. Recognized by many international projects to reach strategic partners. At this stage, 7 IPs, 26 merchants, 8 large institutions have settled in MediaVerse, and they are gradually expanding. MediaVerse hits several "firsts" and "onlys" Features: 1. Self-developed 3D engine to support real physical collision 2. The only metaverse in the world that supports multiple chains 3. Spherical 360° live streaming interaction 4. Integrate redeem functions, virtual and real integration 5. The first in Asia to have built-in advertising billboards in the Metaverse (placement)

• NXP Semiconductors

  

  Main advantages： As a company focused on innovation, NXP is known for our ability to solve problems and address societal challenges, and we are proud of the progress we’ve made since our founding in 2006 regarding our environment, social and governance (ESG) performance. Climate and Environment – In 2021 NXP reduced our normalized carbon footprint (Scope 1 & 2) by 11% compared to 2020. The company also realized an 11% decrease in normalized water consumption from 2020 and recycled 76% of its manufacturing waste. In early 2022, NXP formally committed to the Science Based Targets initiative (SBTi). Diversity, Equality and Inclusion – NXP hired nearly 8,000 new team members in 2021, including approximately 3,300 women. Women now represent 37% of NXP’s global workforce. Health and Safety – NXP maintained stringent protocols to protect team members in response to the COVID-19 pandemic. Achieved its lowest-ever injury rate of 0.08 Total Case Incident Rate (TCIR) for the second year in a row, well below the semiconductor industry average. Recommended Reasons： We use innovation to enable a better, safer, more secure, and sustainable world. We are passionate about technology and believe it can be a powerful catalyst for change. We also recognize that advances in technology can bring with them new challenges for sustainability. For this reason, we make the principals of sustainability — such as energy efficiency, safety, and security — central to our work in product development. To illustrate this approach, let's look at recent NXP innovations in the healthcare, automotive, industrial & IoT, mobile, and communication infrastructure markets HEALTHCARE – SMART MONITORING AND DATA MANAGEMENT As COVID–19 continues to disrupt lives and the global economy, technology companies such as NXP play a vital role in the battle against the pandemic. One of our healthcare solutions, used for Continuous Temperature Monitoring (CTM), offers a convenient way to track COVID–19 symptoms. The solution is built using an NXP NHS3100 NTAG®SmartSensor, an integrated circuit, optimized for temperature monitoring and logging, that includes an NFC interface and a direct connection to the battery. The high degree of integration yields a compact, energy–efficient solution that can be tailored for use in specific healthcare applications. AUTOMOTIVE – SMART SOLUTIONS FOR INCREASED PERFORMANCE NXP is helping global automakers transition their vehicle fleets from internal combustion engines to electric ones. Our smart solutions help manage the batteries that power hybrid and electric vehicles, resulting in higher overall efficiency. Our battery–management solutions can boost performance and extend the vehicle range of e–vehicles by 28%, while our platooning technology has been shown to deliver net fuel savings of up to 8% in hybrids. What’s more, our battery– management systems are supplemented by motor–control solutions that can increase fuel economy by up to 20%. INTELLIGENT EDGE – OPTIMIZING ENERGY THROUGH MACHINE LEARNING Devices in our edge–processing portfolio for automotive, industrial, and IoT offer excellent power efficiency and long–lasting battery life. They’re designed to handle data processing and machine learning at the edge of the network, reducing energy required to transmit data for processing in the cloud. Our smallest microcontrollers consume as little as one microwatt in certain standby conditions, which means they can provide years of battery life. Optimizing energy use at the chip level is becoming an increasingly crucial part of designing energy–efficient edge systems. NXP’s innovative Energy Flex architecture, designed to extend battery life and reduce energy waste in portable and plugged–in devices, makes our latest processors even more energy efficient, using a unique combination of techniques, including heterogeneous domain processing and 28nm FD– SOI process technology. GREEN INNOVATION BOND In May 2021, to help finance our development of ever-smarter chips that reduce energy consumption and emissions, we launched our second Green Innovation Bond. We expect the proceeds from this USD $1 billion bond will be fully allocated at the end of 2022 and invested in projects such as increasing the energy efficiency of power adapters, extending smart mobility, preventing emissions through automated and connected traffic solutions, and reducing the amount of power consumed by smart buildings, the edge processors of cloud services, and 5G cellular networks.

• UnaBiz Co., Ltd.

  

  Main advantages： UnaBiz invests in Massive IoT technology R&D and productisation with the goal to lower the cost of adoption, and enable IoT to become viable, accessible & scalable. ( Example: go from tracking trolleys today to tracing parcels and envelopes tomorrow, always with a positive ROI for the custom) We provide high quality custom designed IoT solutions that are energy-efficient, scalable and simple to deploy at a fraction of conventional cost Recommended Reasons： Massive IoT enables businesses to become more carbon neutral and achieve their ESG goals by increasing efficiency and productivity while reducing carbon footprint, for instance by saving millions of kms travelled and reduce overall energy consumption.

• Vayyar

  

  Main advantages： Founded with a vision of detecting early-stage breast cancer using RF technology, Vayyar has since expanded its business into senior care, automotive, retail, public safety, and other industries. The company provides solutions powered by its leading-edge system-on-chip, proprietary software stack, and breakthrough Machine Learning algorithms. In the automotive space, Vayyar manufactures 4D imaging radar-based platforms that transform safety across the in-cabin, ADAS and motorcycle (ARAS) domains. The company’s ARAS platform is in mass production for deployment on Piaggio Group’s motorbikes, providing exceptional safety for the world’s most at-risk road users. Vayyar has also secured supply contracts with automakers from Japan and Vietnam and is in advanced engagements with almost every other OEM and supplier for both in-cabin and ADAS. In senior care, the company offers Vayyar Care, a unique remote monitoring solution, integrated with the world’s leading nurse call systems, that protects the aging population with automatic fall detection and data that drives predictive behavioral analytics. Vayyar recently signed a Joint Venture agreement with Haier subsidiary HCH Ventures, leveraging its senior care technology to address the 4 trillion yuan (625B USD) “silver tech” market in China. Vayyar has also established a large-scale partnership with Amazon for remote health, safety, and security monitoring. Vayyar’s sensors are being integrated with the world’s leading smart building solutions, provide a new level of situational awareness for consumer robotics products, and are deployed across the retail sector, enabling real-time inventory monitoring, advanced shopper analytics, and interactive advertising. Recommended Reasons： Users should vote for Vayyar because of its track record of providing transformative solutions across so many different verticals. The company offers the world’s most accurate in-car monitoring platform, designed to prevent the hot car deaths that claim the lives of around 40 children each year in the U.S. alone. The platform simultaneously supports enhanced seat belt reminders that ensure all vehicle occupants buckle up, and smart airbags that deploy with the correct force for the size of each occupant, minimizing the risk of airbag impact injuries. Vayyar is the first and only 4D imaging radar in mass production for motorcycle safety, has secured supply contracts with multiple OEMs for its multifunctional in-cabin platform, and is set to revolutionize the ADAS and AV domains with its multirange offering that simultaneously supports numerous lifesaving SRR, MRR and LRR applications. Vayyar Care, the company’s cutt0ng-edge remote monitoring solution, is integrated with the world’s leading nurse call systems and deployed in leading care facilities and private homes around the world. It provides automatic fall detection that eliminates the risk of a “long lie,” when failure to provide prompt assistance leads to severe complications and death in around half of cases. The solution also gathers rich behavioral data that gives caregivers precious insights into people’s mobility, mental health, and overall wellbeing. Having recently secured Series E funding, taking its valuation to well over 1 billion USD, Vayyar is on the verge of realizing its vision of using radar-on-chip technology to make a genuine impact on everyone’s lives.

• AMICCOM Electronics Corporation

  2.4GHz low power wireless RF SOC for IoT application

  

  AMICCOM Electronics Corporation (AMICCOM) announced a new 2.4GHz wireless transceiver SOC named A8131M0. The A8131M0 supports data rate 250kbps ~ 2Mbps with FSK modulation. This chip integrates high performance ARM® Cortex®-M0, built-in 128Kbyte/256Kbyte Flash Memory, 32Kbytes SRAM, 23 GPIOs and various digital interfaces. 2-wire ICE can be developed with Keil C. The maximum TX Power of A8131M0 is +5dBm, the receiving sensitivity is -90dBm (@2 Mbps FSK), the maximum Link budget is 95dB so that the transmission distance can reach 100 meters. The A8131M0 also integrates a DC-DC converter to provide efficient power applications. With input voltage 3.3V for DC-DC converter, A8131M0 RX mode current is 8.3mA, TX mode current is 10.3mA (+5dBm). It also supports programmable RF output power (-30dBm ~ +5dBm) and programmable data rate (250kbps ~ 2Mbps). The MCU core of A8131M0 is ARM® Cortex®-M0, which can provide fast computing, user can adjust the MCU speed according to the overall power consumption requirements. A8131M0 has a flexible power management system, the current consumption in deep sleep mode is 300nA and the current consumption in sleep mode with internal timer (32KHz) turned-on is 1.2uA. Moreover, the accuracy of internal timer (32KHz) after calibration can reach +/- 0.2 %. The A8131M0 has a built-in AES128 co-processor which provides data protection and security. All above features make A8131M0 suitable for various low-power IOT applications. A8131M0 is equipped with a variety of digital interfaces such as UART, I2C, SPI. It has 7 PWM outputs, two 32-bit timers and one 32-bit dual mode timer. These interfaces share pins with 23 GPIOs, which can be used according to user’s application requirements. A8131M0 is also equipped with 12bit ADC, which provides up to 7 channels for external signal measurement. Overall, the A8131M0 is a wireless transceiver SOC with high performance and low power consumption. It has excellent RF performance with 5dBm output power amplifier, and supports a variety of digital interfaces and I/O. All functions are integrated in the QFN5x5 package.

• Analog Devices, Inc.

  ADRV9002

  

  The ADRV9002 is a highly integrated RF transceiver that has dual-channel transmitters, dual-channel receivers, integrated synthesizers, and digital signal processing functions. The ADRV9002 is a high performance, highly linear, high dynamic range transceiver designed for performance vs. power consumption system optimization. The device is configurable and ideally suited to demanding, low power, portable and battery powered equipment. The ADRV9002 operates from 30 MHz to 6000 MHz and covers the UHF, VHF, industrial, scientific, and medical (ISM) bands, and cellular frequency bands in narrow-band (kHz) and wideband operation up to 40 MHz. The ADRV9002 is capable of both TDD and FDD operation. The transceiver consists of direct conversion signal paths with state-of-the-art noise figure and linearity. Each complete receiver and transmitter subsystem includes dc offset correction, quadrature error correction (QEC), and programmable digital filters, which eliminate the need for these functions in the digital baseband. In addition, several auxiliary functions, such as auxiliary analog-to-digital converters (ADCs), auxiliary digital-to-analog converters (DACs), and general-purpose inputs/outputs (GPIOs), are integrated to provide additional monitoring and control capability.

• GigaDevice

  GD32W515 Series of Wi-Fi MCUs

  

  The GD32W515 series of Wi-Fi MCUs continue to use the Arm® Cortex®-M33 core, supports the DSP instruction extension and single-precision FPU, a maximum frequency of 180MHz, up to 2048KB of on-chip Flash, 448KB of SRAM, and up to 32MB of external Flash. It integrated with a 2.4GHz single-stream IEEE802.11b/g/n MAC/Baseband/RF radio frequency module on-chip. The built-in TrustZone architecture to create a reliable hardware execution environment for secure data storage, and continues the perfect compatibility of software and hardware in the GD32 MCU family. The wireless GD32W515 series has a maximum transmit power of 21 dBm, a signal receiving sensitivity of -97.6 dBm, and a total link budget of 118.6 dBm to provide leading class baseband and radio frequency performance. It also has a superior anti-interference ability. The adjacent channel rejection (ACR) value is as high as 48dB, which can effectively prevent strong signal interference and improve the stability of signal reception. This series of MCU supports high transmission rates with Iperf throughput of up to 50Mbps, and in laboratory test conditions, the throughput reached up to 80Mbps. The RF module is fully integrated on-chip to simplify designs, effectively reducing the number of external components and thus saving BOM costs. The chip has built-in rich peripheral resources including one 12-bit ADC, four general-purpose 16-bit timers, two general-purpose 32-bit timers, one basic timer, one PWM advanced timer, and a series of communication interfaces: up to two SPIs, one SDIO, two I2Cs, three USARTs, one I2S, USB2.0 FS, and Wi-Fi wireless interface. Other peripherals include TrustZone control unit, digital camera interface, touch sensing interface, Quad SPI Flash Interface, and a new High-performance Digital Filter. It can be used for external Σ-Δ modulation to achieve high-precision audio signal processing. The GD32W515 series products provide wireless connectivity development options for various application needs such as smart home, industrial IoT, and consumer electronics.

• Gwell Technology Co., Ltd.

  GW-BT52832QFAA-PA

  

  GW-BT52832QFAA-PA is developed by Nordic nRF52832 IC which incorporates a powerful, highly flexible ultra-low power multiprotocol SoC ideally suited for Bluetooth 5, ANT and 2.4GHz proprietary applications. GW-BT52832QFAA-PA with Power Amplifier (PA) designed in for longer transmission distance.

• Nordic Semiconductor

  Power Profiler Kit II

  

  Power Profiler Kit II (PPK2) supports both Nordic short-range wireless and low power cellular IoT solutions, and custom hardware, samples 10x faster than previous model, and enables simultaneous measurement of long-duration average and instantaneous current The PPK2 enables easy and affordable power measurement during wireless product development with nRF51, nRF52, and nRF53 Series multiprotocol short-range wireless Systems-on-Chip (SoCs) and the nRF91 Series low power cellular IoT System-in-Package (SiP). The Kit supports power profiling of systems up to 1A at a resolution that typically varies between 100nA and 1mA depending on the measurement range. 1A support provides sufficient margin for extra circuit draw. Supported systems include Nordic Semiconductor’s LTE-M, NB-IoT, Bluetooth® Low energy (LE), Bluetooth mesh, IEEE802.15.4, Thread, Zigbee, and 2.4 GHz proprietary products. The PPK2 is powered from a standard 5V USB port. The external device under test (DUT) can either be powered from an external source or optionally from the 1A capable power supply built into the PPK2. The voltage range for both options is 0.8 to 5V. This allows the PPK2 to measure and optionally supply current for developers’ custom designs without requiring an external power source. The associated PC software is bundled as a separate app inside Nordic’s cross-platform development software, ‘nRF Connect for Desktop’. The app provides a unified GUI for the PPK2, and provides several ways of assessing the power consumption, both instantaneous and averaged over a set time period. The user can set up the PPK2 to take readings over an extended duration, while simultaneously zooming in on a millisecond interval of interest. Over both these time periods the user can select points for instantaneous measurement as well as areas over which to average current consumption. Measured data can also be exported for post processing. The cost efficient PPK2 tool provides a simple method for hardware and software engineers to measure average and dynamic power consumption in embedded solutions.

• NXP Semiconductors

  IW612 Tri-Radio Device

  

  Unique Design, Special Feature, Function or Technology Used NXP’s IW612 secure tri-radio single-chip solution supports Wi-Fi 6, Bluetooth 5.2, and IEEE 802.15.4 wireless protocols, including the new groundbreaking Matter connectivity protocol. A new secure IoT connectivity standard for smart homes, Matter aims to unify how devices communicate, independent of the manufacturer or wireless technology. Our new IW612 device enables seamless, secure connectivity for smart home, smart energy, industrial automation, and automotive gateways, providing unprecedented coexistence, performance, and radio integration. As a single-chip solution, the IW612 integrates three of the industry’s leading connectivity radios onto a single device for the first time, delivering robust radio performance and integrating a high-performance RF front end. The IW612’s RF front end includes low-noise amplifiers, power amps, and switches for reduced BOM and footprint. Why This Product Is Significant There have been multiple connectivity standards that are unable to operate in coordination with each other—until now. Matter as a new IoT connectivity standard will help with the realization of smart homes by reducing fragmentation. Matter creates more connections between more objects, which simplifies development for manufacturers and compatibility for consumers. NXP is advancing IoT connectivity with the industry’s first secure IW612 tri-radio single-chip solution by improving smart home connectivity through seamless connections of smart devices across protocols and ecosystems, simplifying development and reducing cost and board space. For smart home applications, the IW612 can be used for border routers, bridges, and gateways that require connecting Thread or Bluetooth devices to the cloud using the integrated Wi-Fi 6 radio. The device enables communication between Matter devices, regardless of whether the devices use Wi-Fi or Thread. This allows Matter-over-Wi-Fi products to control and monitor Matter-over-Thread devices, and vice versa, for seamless interoperability.

• onsemi

  Secure RSL15 Wireless MCU

  

  1) Enabled with Bluetooth® Low Energy wireless connectivity, the RSL15 offers enhanced security and processing capabilities with innovative smart sensing features, and addresses the growing demand of connected industrial applications for security with the industry’s lowest power consumption. 2) The RSL15 supports a number of new capabilities provided by the Bluetooth 5.2 specification, including longer range, higher data transmissions and localization through angle of arrival (AoA) and angle of departure (AoD). onsemi has also developed an innovative smart sensing feature that allows the Arm Cortex®-M33 processor to remain in a deep sleep mode while still monitoring sensor interfaces. With these advanced new features, the RSL15 will continue the success of the RSL10 radio family, which has been integrated into a variety of industrial automation applications including connected asset tracking, smart retail and IoT edge nodes. 3) While preserving its state-of-the-art power consumption, the RSL15 is designed with Arm®TrustZone® technology to establish device root of trust as well as Arm CryptoCell™-312 technology to protect the authenticity, integrity and confidentiality of code and data. This PSA Level 1 certified design enhances the security measures already offered as part of the Bluetooth protocol, providing assurance at both the application and software levels. 4) From beacons for contact tracing to trackable asset tags, there are millions of connected devices globally operating off of small batteries. By setting a new record in Bluetooth 5.2 energy efficiency in the EEMBC ULPMark™ CoreMark program, the RSL15 will help these applications, amongst many others, achieve a battery life greater than they ever thought to be possible. 5) The ability to protect against cyber threats is an essential differentiator for manufacturers choosing a wireless microcontroller for industrial IoT applications. With its advanced system-level security features and class-leading energy efficiency, the RSL15 provides a comprehensive wireless solution that OEMs and consumers can rely on.

• RichWave Technology Corporation

  Ultra-high isolation switch supporting LAA and Wi-Fi coexistence

  

  The RTC66015 is a new CSP design of double-pole, double-throw (DPDT) high isolation switch. It supports antenna switching in the frequency band form 100MHz to 8.5 GHz. In addition to WiFi applications, its wide frequency band performance can support antenna sapping of IoT and UBW related applications. It also has ultra-high isolation performance of more than 55dB, which can effectively eliminate the interference from the adjacent channel signal or frequency band. It has been successfully applied to the LAA/Wi-Fi coexistence mode to improve the spectrum efficiency. It has also become the key component of Qualcomm's next-generation 5G/Wi-Fi 7 platform for smart phone application.

• Silicon Labs

  Bluetooth AoA & AoD Location Services Solution

  

  New Bluetooth Location Services solution using accurate, low-power Bluetooth devices to simplify Angle of Arrival (AoA) and Angle of Departure (AoD) location services. Combining hardware and software, this new platform delivers industry-leading energy efficiency by using Silicon Labs' BG22 SiP modules and SoCs, which can operate for up to ten years on only a coin cell battery, with advanced software that can track assets, improve indoor navigation, and better locate tags with sub-meter accuracy. Silicon Labs has developed new advanced software, designed to maximize the location-finding capabilities of our BG22 series of SoCs and SiP modules. The new features are comprised of the following: • Asynchronous continued tone extension (CTE) broadcasts from the device to the locator. Asynchronous broadcast eliminates the need for synchronized transmission timings between the device and locator, thereby enabling the locators to track a large number of assets simultaneously and multiple locators to simultaneous to see the same asset at the same time for triangulation. • Broad spectrum CTE broadcast across all 37 channels to reduce interference by moving the CTE transmissions from advertisement to data channels. These new features enhance Silicon Labs' Bluetooth software portfolio, one of the most comprehensive set of solutions available for accelerating development of direction-finding applications. With additional development tools specifically designed to accelerate development of direction-finding applications. Silicon Labs' portfolio positions developers and designers to build a wide range of IoT location service applications that can meet the unique needs of every environment and deployment. This new software runs on the BG22 family of Bluetooth low energy (LE) SoCs and SiPs, the smallest in Silicon Labs' portfolio. This product family combines best-in-class, ultra-low transmit and receive power (4.1 mA TX at 0 dBm, 3.6 mA RX) with a high-performance, low-power ARM® Cortex®-M33 core (27 µA/MHz active, 1.2 µA sleep). Altogether, these deliver industry-leading energy efficiency that can extend coin-cell battery life up to ten years.

• Texas Instruments

  CC2662R-Q1

  

  Using a new wireless protocol, developed specifically for the wireless BMS use case, TI’s wireless BMS functional safety concept addresses communication error detection and security. The proprietary protocol via the SimpleLink™ 2.4 GHz CC2662R-Q1 wireless MCU enables a robust and scalable data exchange between a host system processor and the newly announced BQ79616-Q1 battery monitor and balancer. Now automotive engineers can securely enable the industry’s best network availability. Rivaling wired connections, TI’s wireless protocol for BMS via the CC2662R-Q1 wireless MCU offers the industry’s highest network availability of greater than 99.999% and a network restart of 300-ms maximum availability. With this wireless MCU, dedicated time slots that provide high throughput and low latency protect data from loss or corruption while enabling multiple battery cells to send voltage and temperature data to the main MCU with ±2-mV accuracy and a network packet error rate of less than 10-7. Automakers can mitigate potential threats with security enablers from TI such as key exchange and refreshment; unique device authentication; debug security; software IP protection with a joint test action group (JTAG) lock; Advanced Encryption Standard (AES) 128-bit cryptographic acceleration and message integrity checks. Additionally, modern EVs are subject to multiple sources of wireless interference. They’re noisy and battery modules are surrounded by metal enclosures which can affect signal propagation. Our wireless protocol is designed specifically to address the automotive battery use case. The 2.4-GHz solution, enabled by the CC2662R-Q1 wireless MCU, helps mitigate interference and creates a more reliable connection so you are able to start your vehicle and manage your battery on-demand in real-time.

• Wolfspeed Taiwan Limited

  Wolfspeed Power Amplifier Module - mMIMO

  

  MIMO is found on some 4G base stations, typically uses two or more transmitters and receivers to send and receive more data at once, mMIMO extends that concept by significantly increasing the number of antennas on a single array. mMIMO relies on multipath signal propagation due to reflections from structures in the environment. With radio channel estimation and signal processing techniques, the spatial diversity due to multipath propagation is leveraged to enable communication between base stations and multiple users in the same time and frequency resource. The main benefits of mMIMO are: Network Capacity: mMIMO increases network capacity and data throughput by splitting data packets over multiple signal paths as well as allowing simultaneous multiple users through the use of multi-user MIMO (MU-MIMO). Better Coverage: Beamforming with mMIMO enables dynamic coverage for moving users by adjusting signal paths and, therefore, coverage to suit user location. When establishing a long-term 5G base station supply chain for RF components, it is important to choose a reliable GaN on SiC component vendor. The market leader in this area is Wolfspeed. With over 3,700 patents issued to Wolfspeed, market analysis firm Yole Développement sees the company in the strongest IP position, especially for GaN HEMTs on SiC substrates. And Wolfspeed continues to invest heavily in R&D — spend rose by 24 percent in fiscal 2019 to reach $157.9 million.

• A-China Semiconductor Ltd

  MCU007

  

  a 32 -bit microcontroller with PUF (physical uncloneable function) security function, each MCU has its own ID (like a fingerprint) which uses the physical differences on the silicon process to generate random garbled code and hardware it on the chip. It is unpredicatable, reliable, and durable, also easier for mass production. Applications inculde firmware protection, smart locks, car keys, IoT authentication, anti-fake, branding, licensing, tag, match with blockchain technology, and many other applications concerning security like NFT and cryptocurrency.

• Artery Technology

  Artery AT32F435/437 High Performance MCU

  

  High performance AT32F437 series, ARM® Cortex®-M4 core, up to 288 MHz CPU. Featuring internal FPU, DSP and MPU, it is provided with rich peripherals and flexible clock control mechanism for a wide range of applications. It supports up to 4032 KB Flash and 512 KB SRAM, suitable for higher computation and larger memory including industrial automation, motor control, IoT and consumer electronics.

• ASIX Electronics Corporation

  AX58400 EtherCAT Slave Controller with Dual-Core MCU

  ASIX AX58400 EtherCAT Slave Controller with Dual-Core MCU is equipped with the highest-performing 480MHz ARM® Cortex®-M7 core, 240MHz ARM® Cortex®-M4 core, and EtherCAT Slave Controller integrated with two embedded Fast Ethernet PHYs, and is suitable for various industrial Ethernet applications.

• GigaDevice

  GD32F470 Series of High-performance MCUs

  

  GD32F470 Series of High Performance MCUs is the most powerful ARM® Cortex®-M4 core-based product in the GD32 MCU product family. Its main frequency is up to 240MHz, which is a relatively high performance in the industry. GD32F4 new product has 512KB to 3072KB on-chip Flash, and the zero waiting area is increased to 1024KB. It also has 256KB to 768KB of SRAM to cover an extended range of differentiated market applications with high performance, real-time processing, and high storage capacity. To undertake the rich peripheral resources of the GD32F4 series, the GD32F470 series provides up to 4x USARTs, 4x UARTs, 3x I2Cs, 6x SPIs, 2x I2Ss, 2x CAN2.0B, 1x SDIO interface, 1x 10/100M B Ethernet controller, and is equipped with two USB2.0 OTG interfaces, including full-speed and high-speed, which can provide various transmission modes such as Device, HOST, and OTG. It also has 3x 12-bit high-speed ADCs with a sampling rate of up to 2.6M SPS, providing up to 24 reusable channels, and 2x 12-bit DACs. The 32-bit bus interface EXMC also supports the expansion of external SDRAM memory. It can perform large-capacity data cache and advanced interface control flexibly and conveniently with higher cost performance. The built-in TFT LCD controller and hardware graphics accelerator IPA to realize LCD driving and significantly improve the display quality. In addition, it has an 8-bit to 14-bit Camera video interface, which is convenient for connecting digital cameras and realizing image acquisition and transmission. Adoption of the 40nm advanced process can meet the requirements of the increasing sophistication of the MCU control system, achieving lower power consumption, effectively extending the life of the end device while enhancing system reliability and safety, and reducing the silicon area of a single chip to achieve better cost-effectiveness.

• Himax Technologies,inc.

  HX8880-E02-BLT40

  

  HX8880-E02 : This Timing Controller can support high resolution auto-mobile panels.(up to 14K1K) with multi interfaces , like eDP , LVDS , P2P or Mini_LVDS. The world's first mass-produced IC with the following functions: 1.Support local dimming / Dual cell function for high contrast purpose . 2.Support Over Drive function for fast response time. 3.Support Demura function for Panel uniformity. Those function are quite leading features in Automotive solutions. For its good quality and specification , right now a couple of award projects on going. According to those multi-interfaces and functions designs , This Tcon will continue to be accepted and design in Automotive products.

• Microchip Technology Inc.

  PIC® MCU (PIC16F17146)

  

  Microchip’s 8-bit PIC® microcontrollers (MCUs) offer embedded designers simple solutions to their most common problems with processing power, ability to easily communicate with other chips, and analog peripherals that have been built to be exceptionally configurable without having to make changes to the Printed Circuit Board (PCB). These devices combine ASIC-like capabilities with a simple development experience that extends traditional MCU capabilities and allows them to be configured as smart peripheral chips. Smart peripherals, like the software-controlled op amp found on the PIC16F171 family, the Multi-Voltage I/O (MVIO) and Analog-to-Digital Converter with Computation (ADCC) add value to applications that otherwise would not use traditional MCUs. Microchip’s PIC MCUs are incredibly easy to design with and their support network enables our customers to accelerate their time to revenue. The 8-bit MCU portfolio is pin-to-pin compatible, which allows an alternate PIC or AVR® MCU to be selected when more performance is needed or when a customer wants to maximize product availability while minimizing redesign requirements.

• Nuvoton Technology Corporation

  NuMicro® M460 Series

  Arm® Cortex®-M4 core Runs up to 200 MHz Operating voltage: 1.8 V ~ 3.6 V Sub Series: M467: Ethernet + Crypto + CAN FD + USB HS/FS OTG M463: CAN FD + Crypto + USB HS/FS OTG Features: Secure Boot/ HyperBus Interface/ Key Store Protection/ Fractional Audio PLL Secure Boot: The Secure Bootloader is a bootable code pre-written in the M460 Mask ROM. It is tamper-proof due to the Read-Only feature of Mask ROM. For ensuring the running firmware is legal, we use two methods to accomplish it: 1. Use hardware crypto sha256 engine to check firmware integrity. 2. Use ROTPK stored in the Key Store OTP to verify the signature of the firmware.

• NXP Semiconductors

  MCX General-Purpose MCUs

  

  The MCX portfolio is a comprehensive selection of Arm® Cortex®-M based MCUs, offering expanded scalability with breakthrough product capabilities, simplified system design and a developer-focused experience through the widely adopted MCUXpresso suite of software and tools. The new simplified system design offers optimal enablement and intelligent peripherals for the intelligent edge including machine learning, wireless, voice, motor control, analog and more. The MCX portfolio is part of NXP’s EdgeVerse™ edge computing platform.

• Silicon Labs

  Ultra-Low Power and High Performance EFM32PG23 32-bit MCU

  

  Though small in size, the EFM32PG23 (PG23) has features that make it useful in many applications, including an Arm Cortex-M33 that can run up to 80 MHz with only 21µA / MHz operating current. In sleep mode, the PG23 can get as low as 1.03 µA. With efficiencies like that, and its LESENSE low-energy sensor interface, the PG23 works extremely well in battery-powered applications. There is also plenty of memory for most algorithms, with up to 512 kB of flash and up to 64 kB of RAM. In addition to a good collection of serial communication peripherals, the PG23 has an LCD controller, a keypad scanner, and a die temperature sensor. To sense signals at the edge, the PG23 has two analog comparators and an analog-to-digital converter with flexible resolution allowing 12, 16, or 20-bit output. Developers can also change modes on the ADC to get 2 Msps in high-speed mode or focus on accuracy and get up to 16 bits ENOB in the high accuracy mode. The improved accuracy makes the PG23 a good choice for some consumer medical or test and measurement applications. The software compatibility with the FG23 and ZG23 families of wireless SoCs is a compelling feature with some of our customers, including some of the leading providers of automation systems for homes and businesses. Security is becoming a critical aspect of many applications, especially those in industrial operations or systems where there are wireless connections. With the most secure MCU available, the PG23 offers confidence to the designer for any application. The combination of best-in-class security, precision analog capabilities, and the excellent low power performance makes the PG23 the ideal MCU for a variety of IoT applications.

• Solomon Systech Limited

  SPD2010 Touch Display Driver Integation IC

  

  1st TDDI solution on IoT application in the world High Integration SPD2010 is a Touch Display Driver Integrated (TDDI) IC supporting from 454RGBx454 to 200RGBx200. It drives a-Si in-cell panel with touch functions. As no external touch sensor needed High Quality SPD2010 supports 16M color display with CABC functions. SSL has introduced new dual gate feed-through compensation driving scheme to enhance the uniformity of the display. Low Power Consumption In order to decrease the power consumption on sensing the gesture during the sleep mode, SPD2010 enable configurable low scan function during sleep mode with display off. Due to touch block has been integrated, SPD2010 can fully control the scan process to detect the gesture with lowest power consumption.

• SUNIX

  Serial/Parallel Cards

  

  No.1 in Global Sales SUNIX Serial/Parallel Cards, with the highly reliable SUNIX chip, are approved by Microsoft WHQL. Use the “Gold Card,” the most popular Serial/Parallel Card in the world Self-Branded IC Bring the world’s first Single Chip 16-port RS-232/422/485 under your roof. With 15 individual IC chipsets have been introduced as of 2016, SUNIX impressive design capability on IC and electronic circuitry which can tailor your special I/O communication design needs. WHQL Certified Our products satisfy strict X86/X64 Microsoft WHQL certifications, ensuring full compatibility with Microsoft Windows. Robust Drivers We employ our own in-house software design team so that our chips support the latest mainstream operating system like Microsoft Windows and Linux as well as other specialty operating systems. More than 80 Patents SUNIX’s ability to innovate and push the envelope is evidenced by the 80+ invention, design, and utility patents awarded to our professional, reliable products.

• Texas Instruments

  Sitara AM243x

  

  Sitara™ AM243x MCUs, the first devices in the AM2x portfolio, feature up to four real-time Arm® Cortex®-R5F cores, each running up to 800 MHz. The AM243x MCUs also integrate sensing and actuation peripherals that enable low-latency real-time processing and control for factory automation. The integrated communications accelerators on the AM243x devices simplify industrial networking, supporting multiple gigabit industrial Ethernet protocols and time-sensitive networking (TSN), and providing certified protocol stacks to support common industrial protocols such as EtherNet/IP™, EtherCAT®, PROFINET®, IO-Link Master and more. The AM243x devices include security features such as programmable security keys and flexible firewall configurations, and integrated functional safety mechanisms, diagnostics and collateral help enable system integrators to target up to Safety Integrity Level (SIL) 3. The Sitara MCU architecture is flexible to adjust to support the latest standards.

• Alpha and Omega Semiconductor Limited

  AONP36332

  

  The new AONP36332 is an extension to the XSPairFET™ lineup which is designed with the latest bottom source packaging technology. The AONP36332 has lower switch node ringing due to lower parasitic inductance. AONP36332 has integrated high-side and low-side MOSFETs (3.7mOhms and 4.7mOhms maximum on-resistance, respectively) within a DFN3.3x3.3 symmetric XSPairFET™ package. The low-side MOSFET source is connected directly to the exposed pad on the PCB to enhance thermal dissipation. Using an existing notebook design under conditions, 15V input voltage, with 8.4V output voltage, and a 6A output load condition operating at 1MHz, the AONP36332 can achieve 97 percent efficiency. “Type-C has a wide market acceptance and with the significant performance improvement, the AONP36332 is ideal for buck-boost in Type-C applications,” said Peter H. Wilson, Marketing Director of MOSFET product line at AOS.

• Analog Devices, Inc.

  LTC2949

  

  The LTC2949 is a high precision current, voltage, temperature, charge and energy meter for electrical and hybrid vehicles and other isolated current sense applications. It infers charge and energy flowing in and out of the battery pack by monitoring simultaneously the voltage drop over up to two sense resistors and the battery pack voltage. Low offset ΔΣ ADCs ensure accurate measurement of voltage and current with insignificant power loss. Continuous integration of current and power ensures lossless tracking of charge and energy delivered or received by the battery pack. The built-in serial interface can be configured to support isolated isoSPI communication to the host or as SPI interface. The LTC2949 features 12 internally buffered high impedance inputs (V1 to V12) for measuring voltages from external sensors or resistor dividers allowing to measure temperatures, HV-Link voltages, chassis isolation and supervise contactor states. LTC2949 has up to five programmable digital outputs which can be set to ground, supply or toggling at 400kHz. Programmable threshold and tracking registers reduce digital traffic to the host.

• Boréas Technologies

  BOS0614

  

• Bourns

  Bourns® IsoMOV™ Hybrid Protectors

  

  Bourns® IsoMOV™ hybrid protection components fully combine the classic GDT and MOV in a totally new design. This single-package solution provides a symbiotic relationship where the GDT blocks leakage currents through the MOV that would otherwise lead to premature failure of the MOV device. It also allows the MOV to prevent follow-on current after a surge that might damage the GDT. Bourns® IsoMOV™ Component Features: - Space-saving form factor - Ultra-low leakage current - Lower clamping voltage - Isolation GDT extends MOV life - Passes ring-wave requirement - State-of-the-art surge ratings - High temperature rating - Graceful end-of-life failure mode - UL Listed UL 1449 Type 4 CA - RoHS compliant Boosting its design flexibility for engineers, IsoMOV™ protector surge ratings are comparable to the next larger size conventional MOV device. This gives designers the flexibility to select an IsoMOV™ protector that is smaller than the MOV option or upgrading to an IsoMOV™ protector of the same size to enhance the surge capability of their protection scheme.

• Bravotek Electronics Co, Ltd.

  BV8001, PMIC for Camera Module

  

  BV8001 is a highly integrated PMIC applied with Bravotek patented technology ── SIMO, single-inductor multiple -output. This SIMO power converter architecture provides space savings while maintaining high efficiency, which is a idea fit for compact devices integrating functionality. In a traditional multi-channel power solution, each switching regulator needs a separate inductor for each output, making lots of space occupied by large and costly inductors. Another option is using linear regulators (LDOs), they are tiny but very lossy. However, BV8001 with the SIMO architecture provides the best solution for compact devices, it generates multi-railed switching power by using only one inductor and thus reduce the BOM cost at the same time. Compared with common PMICs, power solution with BV8001 reduce 3~4 inductors, shrink space footprint more than 21%, and 80% component cost is saved.

• Cambridge GaN Devices

  ICeGaN™ - H1 Series 650V

  

  CGD’s H1 Series are SINGLE CHIP eMode HEMT, with 3 V threshold voltage, real 0 V turnOFF, and a revolutionary gate concept that can be operated up to 20 V. No cascode, no complex multi-chip configurations, no thermally complex integrated solutions: a single chip with embedded proprietary logic which enables pairing with std gate drivers or controllers. All products are available in low profile, state-of-the-art DFN packages. All this without sacrificing superior GaN performance as well as the flexibility which the designers require from a transistor: easy paralleling and obviously the highest robustness. CGD equipped these devices with integrated current sense function which enables ground connection for all H1 Series transistors, thus enabling further cooling optimisation. All CGD's H1 Series transistors also come with low profile, low inductance DFN packages which incorporate a Kelvin pin for optimised high frequency, low noise operation. KEY FEATURES • NormOFF GaN, 1 chip • Highly reliable gate concept • No needs for negative gate voltages to Turn Off • Built-in clamping structure • Uncompromised GaN switching performance or RDS(on) • Additional Smart Sense&Protection Features KEY BENEFITS • Easy design-in • Enables use of standard MOSFET drivers and/or controllers without driving/clamping circuits • Enables direct connection to ground for optimized cooling • Allows slew rate (dV/dt) control • Suitable for all hard and soft switching topologies

• Diodes Incorporated

  AP7387

  

  The DIODES™ AP7387 from Diodes Incorporated is a CMOS LDO capable of a wide input voltage and suited for industrial applications. The device supports a 5V to 60V input voltage range with an industry-leading low quiescent current of 2µA, which offers the significant benefit of an always-on voltage regulator in battery-powered systems. The AP7387 has a high PSRR of 70dB at 1kHz, plus a fast line/load transient response, which mitigates sudden changes in input voltage and load current. Both attributes make the AP7387 well-suited to noise-sensitive applications.

• Elevation Semiconductor

  HL9550/52/54 GaN Integrated Primary Side PWM Controller for Flyback Converter

  The HL9550/52/54 is the primary flyback controller family of devices integrated with GaN. It is a flyback PWM controller that operates in a quasi-resonant (QR) and continuous conduction mode (CCM) to significantly enhance system efficiency and power density. The control method is based on the load conditions: for heavy load, the valley switching with fixed blanking time is applied; and for medium load, the valley switching with variable blanking time is applied to optimize efficiency. The HL9550/52/54 offers constant output voltage (CV) regulation through opto-coupler feedback controller with shunt regulator. In addition, it incorporates 700V with 170-450 GaN power FET to provide high efficiency solution and integrated HV startup. The brown-in voltage is programmed by external DMAG pin resistor. Features: Max power output 65W to 30W Integrated eMode GaN Power FET Low 170 - 450mΩ Rds(on) resistance High average efficiency by QR and CCM switching operation Wide VDD operating ranges up to 77V Smart driver and frequency hopping for better EMI performance Ultra-low standby power consumption (<20mW) Integrated over-voltage protection (OVP), under-voltage protection (UVP), and over-temperature protection (OTP). Programmable thermal shunt down protection through external NTC (SD) Programmable brown-in protection and brown-out protection Integrated high-voltage (HV) startup to reduce external components Limit power source (LPS) with adaptive constant current protection (CC) Cycle by cycle current pulse limit (VCS_LIM) Current sense short circuit protection (CSSP) Secondary side diode short protection (SSSP) Accurate protection behavior for auto-restart, latch, and long auto-restart mode

• GigaDevice

  GD32F470 Series of High-performance MCUs

  

  The GD30WS8805 is a highly integrated, programmable power management chip with low quiescent current. It integrates six major functions of charging, discharging, communication, protection, earbud detection and LDO. It is ideal for wearables and low power battery powered devices. In terms of charging management, it can supply power to the charging case battery, earbud battery and MCU to achieve three-in-one charging management. It can also jointly work with the GD32 MCU to freely configure the constant current, constant voltage and other parameters during the charging process through the I2C bus. And then realize the intelligent control of the TWS power management system. GD30WS8805 has built-in switching charger and synchronous boost converter, supports up to 1.2A charging current, the charging current can be designed through I2C programming, supports 4.1V, 4.2V, 4.35V, 4.4V battery applications, the working current in sleep mode is less than 5uA, supports headset entry and exit detection, and communicates with headsets. The chip has a 0.6A boost output with an efficiency of up to 95%, and supports power path management with programmable output current limit. The built-in synchronous boost converter has a fixed 5V output, and the chip has a built-in 12-bit ADC for battery power measurement. It has a 3.3V low-noise LDO and an output current of 50mA for powering other chips.

• Leadtrend Technology Corporation

  PD 3.1 total solution (LD7798+LD8526+LD6617)

  

  The USB IF announced on May 26, 2021 the release of the USB Power Delivery (USB PD) Revision 3.1 specification, USB PD was limited to 100W via a solution based on 20V using USB Type-C rated at 5A. the updated USB PD protocol and power supply definition, this extends the applicability of USB PD to a large number of applications to 240W, The new USB PD architecture defines a much more stringent power negotiation protocol that helps to ensure that access to and use of this higher power capability to suitable more diffident devices, Leadtrend has launched the total solution LD7798+LD8526+LD6617 for USB PD 3.1 SPR & EPR 28V 140W application, the detail information as following. 1. PWM/PFC Combo IC: The LD7798BG/IG/OG features transition mode Power Factor Correction (PFC) voltage mode controller and Quasi-Resonant (QR) current mode controller for high power application. 2. PD IC: The LD6617 is a highly integrated USB Power Delivery (USB PD) controller that supports USB PD 3.1 SPR & EPR 28V/36V specification. The LD6617 is a specially designed IC for USB Type-C power source applications such as power adapters, wall chargers, car chargers, etc. An 8-bit MCU is embedded to handle PD protocol and device manager with built-in Bi-phase Mark Coding (BMC) PHY for USB PD 3.1 SPR & EPR 28V/36V specification or other proprietary protocols (e.g.QC2.0/QC3.0) 3. SR IC: LD8526 is a secondary side synchronous rectification (SR) driver IC. It is suited for flyback low side and high side synchronous rectification in CCM, DCM and QR mode

• Microchip Technology Inc.

  3.3 kV Silicon Carbide (SiC) Power Devices

  

  Microchip’s 3.3 kV SiC power devices include MOSFETs with the industry’s lowest on-resistance [RDS(on)] of 25 mOhm and SBDs with the industry’s highest current rating of 90 amps. These new levels of performance enable designers to take advantage of ruggedness, reliability and performance. Designers can simplify their designs, create higher-power systems and use fewer paralleled components for smaller, lighter and more efficient power solutions, including electrified transportation, renewable energy, aerospace and industrial applications. Many silicon-based designs have reached their limits in efficiency improvements, system cost reduction and application innovation. While high-voltage SiC provides a proven alternative to achieve these results, until now, the availability of 3.3 kV SiC power devices was limited. The 3.3 kV SiC power products allows customers to move to high-voltage SiC with ease, speed and confidence and benefit from the many advantages of this exciting technology over silicon-based designs.

• M3tek

  MT2600

  With fast technical advancement, supercapacitor manufacturers are making significant improvement on cost, energy density, power density and leakage current constantly. Supercapacitor shows advantages for applications with harsh operating environment, high backup power, long cycle life and long standby time and It can operate with wide temperature range from -40 to 85℃. The MT2600 is a complete solution for system with backup storage capacitor or capacitor bank. It integrated input over voltage; over current protection circuit; a reverse blocking switch and super capacitor charging control circuit. It also has built-in cell balance to provide protection over two cell super capacitor system. When the main supply is present and above the minimum system supply voltage, system will draw power from input supply. At the same time, integrated linear charger charges the storage element at up to 300mA current. Once the storage element is charged, the circuit draws only 2.5μA of current while it maintains the super capacitor or other storage element in its ready state. When the main supply is removed, the integrated reverse blocking switch will block current flow from system rail to input. Linear charger will be turned on to provide power to system rail with low resistance path with up to 2A current. Integrated cell balancing circuit will keep monitoring the cell voltage when charging and keep the two cells voltage at same level. The MT2600 is externally programmable for input current limit, input over voltage, charge current limit, charge voltage limit. It provides a flag signal when input supply is unplugged. MT2600 simplifies the charger and discharger design and making them a popular choice compared to batteries.

• Monolithic Power Systems, Inc

  MP5990GMA-xxxx-Z

  

  MP5990 is a fully integrated, PMBus compatible, compact hot-swap protection device for 4V to 16V operation input voltage range. It contains a hot-swap controller and a 1mΩ power MOSFET, which allow it to operate as a standalone device. MP5990 can also operate as a hot-swap controller in parallel with the multi-phase MP5991 to support high current application. The device can achieve up to 50A of continuous output current (IOUT) per device at room temperature, and up to 60A of continuous IOUT with airflow. MP5990 provides rich programmable fault protections, includes: 1. Programmable VIN UV warning, UVP, OV warning, OVP; 2. Programmable load current OC warning, OCP and SCP; 3. Programmable OT warning and OTP; 4. Power MOSFET gate, source, and drain short detection; Multiple operation modes are available, including no action, latch mode and hiccup mode with programmable retry time. When fault occurs, MP5990 has an output pin to report the fault type, which assists the user to locate the fault event quickly. MP5990 also provides rich pins to indicate operation status, such as fault report output (GOK), VIN under-voltage warning (VIN_UVW#), output over-current warning (D_OC), power good (PG) and PMBus alert (ALT#). MP5990 monitors and reports fault statuses through the PMBus interface. The PMBus interface provides high precision VIN, input current (IIN), input energy (EIN), output voltage (VOUT), IOUT, input power (PIN), output power (POUT) and junction temperature (Tj) telemetry. Among them, the major parameter IOUT report error range is within ±1%. MP5990 still provide built-in NVM to store custom configurations, and exists NVM write protection, the fault status is auto-recorded into the NVM once fault occurs.

• NXP Semiconductors

  BMS (MPC5775E microcontroller + FS65 functional safety SBC)

  

  The combination of NXP’s MPC5775E microcontroller + FS65 functional safety SBC is suitable for implementing this type of architecture. While the doer is implemented into Core 0 (Non-Lockstep) of the MPC5775E MCU, the safety manager (checker) is implemented into the lockstep Core 1. The common cause of failure between the two cores is detected with a combination of safety mechanisms inside the MPC5775E MCU itself, or inside the external FS65 functional safety SBC. These mechanisms can include the fault collection and control unit (FCCU), the clock monitoring unit, the power management unit, the MPU, and the clock, power, memory and software execution within the FSSBC. Safety manager failures are detected by external monitoring of the FS65 SBC, which brings the system into safe state by directly controlling the motor interface.

• onsemi

  High Power Totem Pole PFC Controller NCP1681

  

  1) NCP1681 is dedicated to bridgeless totem pole PFC (TP PFC) topology. It operates on universal mains input (90 – 265 Vac), extending the benefits of code-free TP PFC design into kilowatt power. NCP1681 targets ultra-high density high power offline power supplies, including server, high performance computing, telecom, industrial and OLED TV. 2) The bridgeless totem pole PFC topology eliminates the diode bridge present at the input of a conventional PFC circuit, significantly improving power-stage efficiency. 3) The NCP1681 provides control signals for a fast-switching leg driven at the pulse-width-modulation (PWM) switching frequency and a second leg that operates at the ac-line frequency. The controller can be used with nearly any switching device, from conventional super junction silicon MOSFETs to Wide Bandgap devices based on silicon carbide (SiC) or gallium nitride (GaN) transistors. 4) The NCP1681 simplifies the design of bridgeless TP PFC by employing a novel current-limiting architecture and line phase-detection mechanism. The cycle-by-cycle current limit is realized without the need for a Hall Effect sensor. The NCP1681 can be configured to work in either fixed frequency continuous conduction mode (CCM) or multi-mode operation, where the controller naturally transitions between CCM and critical conduction mode (CrM) for optimal performance across power levels. Challenging efficiency standards such as ‘80Plus’ or ‘CoC Tier 2’, that require high efficiency over a wide load range, can also be met, while reducing design time and cost, thereby delivering solutions to market quickly. At high line, NCP1681 TP PFC solutions will achieve close to 99% efficiency.

• PANJIT International Inc.

  PANJIT SGT MV MOSFET Gen.2

  

  PANJIT MV MOSFET Gen.2 adopted Shielding Gate Trench (SGT) structure which has Switching performance over Standard Trench & Planar structure while maintaining stable Electrical Field. Feature: - Dramatically reduced Rsp (Specific on-resistance) and optimized S/W performance - Increased power density - Much lower Qg, Qoss & Qrr - Softer body-diode for superior low noise switching - Lower Vds spike, smaller ringing and no shoot-through Another key feature of PANJIT MV MOSFET Gen.2 is optimized FOM (Rdson * Qg & Rdson * Qoss) . So, it would reduce switching loss and conduction loss while getting excellent efficiency performance and easy to reach save energy goal. PANJIT has released MV MOSFET Gen.2 by 100V/ 4.4 mΩ~5 mΩ, and other products will be released in 2022. (Total 45 devices) 100V: Rdson: 1.5mΩ to 44mΩ by Different packages (DFN5060/3333 / TO packages) 80V: Rdson: 1.2mΩ to 11mΩ by Different packages (DFN5060/3333 / TO packages) 60V: Rdson: 0.8mΩ to 10mΩ by Different packages (DFN5060/3333 / TO packages) PANJIT MV MOSFET Gen.2 are recommended for high efficiency power conversion system such as Server Power, Telecom Power(Brick Power) , Automotive applications (such as 48V DC/DC converter/ BCM/ Lighting) &Gaming PC Power. Below is the system level efficiency test result compared with Tier one competitor. System: 48Vin to 14Vo, 15A (210W) DC/DC converter Target Device: PANJIT PSMQC038N10LS2 (100V / 3.8mΩ) Competitor O-xxxxx3D6N10MCL (100V / 3.6mΩ) Efficiency: PANJIT PSMQC038N10LS2 showed 0.5% higher efficiency at 210W Thermal: PANJIT PSMQC038N10LS2 showed 10℃ lower than competitor at 210W

• Richtek Technology Corporation

  High Voltage Smart Cap Divider and Direct Charge Charger

  

  This fast charging power charger supports the latest specification, 2 times of voltage charging which has been applied in some worldwide renown mobile phone manufacturers. Featuring high voltage tolerance, it can charge two batteries in series and support 3.5V low-voltage battery voltage for high-voltage boost mode. With the unique superior pattern of built-in start-up with load, it can be applied in a wide range of applications. The high-efficiency switching capacitor driver circuit makes the total efficiency up to 98%. The controller controls the voltage and current of the input terminal through the charging communication protocol to achieve charging and discharging at twice of voltage. Since 5A large current is used for fast charging in smartphones, our single chip product can provide complete and programmable multiple hardware protection functions. It provides high safety to use 2 times of charging/discharging for the new specification under the complete protection.

• STMicroelectronics

  ST-ONE power-supply controller

  

  All-In-One Solution - Configurable Primary+Secondary digital controller with Galvanic Isolation The ST-ONE is world’s first digital controller to integrate a programmable offline power-supply controller based on ARM Cortex M0+ core, a high voltage start-up circuit, an Active Clamp Flyback Controller, and USB Power Delivery (USB-PD) circuitry in one package. Such a system is specifically designed to control ZVS non-complementary active clamp flyback converters to create high power density chargers and adapters with USB-PD interface. The device includes an active clamp flyback controller and its HV startup on the primary side, a microcontroller and all the peripherals required to control the conversion and the USB-PD communication on the secondary side. The two sides are connected through an embedded galvanically isolated dual communication channel. By using a novel non-complementary control technique and specifically designed power modes the device allows to reach both high efficiency and low no load power consumption. MAIN BENEFITS: ST-ONE, sets to increase energy efficiency in a wide variety of ac-dc adapters, fully compliant with USB-PD 3.1, including laptop and smartphone chargers. New adapters built with ST-ONE can reduce both CO2 emissions and the quantity of plastics consumed. The ST-ONE chip is optimized for controlling power supplies that recover energy normally dissipated as heat from conventional circuits. It also simplifies circuit design with a significant reduction in the number of components, enabling this type of power supply to become more robust, affordable and more widely adopted throughout the market. Also using the MasterGaN integrated power stage with advanced wide-bandgap transistors and optimized drivers, adapters operate at elevated switching frequencies and thus permit smaller-size magnetic components to maximize power density. ST also provides the reference design, EVLONE65W (https://www.st.com/en/evaluation-tools/evlone65w.html?icmp=tt27268_gl_pron_jun2022), enables a 65-Watt USB-C adapter of the same size and weight (less than 70g in a 37cm3) of a standard 20-Watt smartphone charger to handle the demands of charging a laptop. This unit achieves the world’s highest power density, packing more than 1.8 Watts of power per cubic centimetre. KEY APPLICATIONS: Smartphone/tablet AC/DC chargers Notebook adapters AC/DC USB-C PD chargers Wall-plug USB-C PD chargers High power density SMPS up to 100W KEY FEATURES: Low part count, All-in-one platform Proprietary Active Clamp secondary side digital control High frequency operation up to 1 Mhz (ext. drivers for GaN) High power density ~30w/inch3 Embedded USB-PD 3, QC3 … management Embedded physical layer Firmware flexibility for upgrade HV start-up and X-Cap discharge for no-load consumption Brown in/out function Optimized synchronous rectification digital control Complete set of protections for safe operations Flexibility, programmability and communication functions Digital Power embedded Flash Firmware programmable Embedded 6.4 kV galvanic isolation

• Texas Instruments

  LMG3525R030-Q1

  

  The LMG3525R030-Q1 is the industry’s first automotive GaN FET with integrated driver, protection and active power management. In high-voltage, high-density applications, minimizing board space is an important design consideration. As electronic systems are getting smaller, the components inside them must also get smaller and sit closer together. TI’s new GaN FETs integrate a fast-switching driver, plus internal protection and temperature sensing, enabling engineers to achieve high performance while reducing board space for their power management designs. This integration, plus the high power density of TI’s GaN technology, enables engineers to eliminate more than 10 components typically required for discrete solutions. Additionally, each of the new 30-mΩ FETs can support up to 4 kW of power conversion when applied in a half-bridge configuration. GaN offers the advantage of fast switching, which enables smaller, lighter and more efficient power systems. Historically, the trade-off with gaining fast switching capability is higher power losses. To avoid this trade-off, the new GaN FETs feature TI’s ideal diode mode to reduce power losses. For example, in PFCs, ideal diode mode reduces third-quadrant losses by up to 66% compared to discrete GaN and SiC metal oxide silicon FETs (MOSFETs). Ideal diode mode also eliminates the need for adaptive dead-time control, reducing firmware complexity and development time. Offering 23% lower thermal impedance than the nearest competitive packaging, the TI GaN FET packaging allows engineers to use smaller heat sinks while simplifying thermal designs. The new devices provide maximum thermal design flexibility, no matter the application, with the ability to choose from either a bottom- or top-side-cooled package. In addition, the FETs’ integrated digital temperature reporting enables active power management, allowing engineers to optimize system thermal performance under varying loads and operating conditions.

• Weltrend Semiconductor, Inc.

  USB PD 3.1 Controller

  

  The WT6676F and WT6677F are industry's first USB Power Delivery (USB PD) controllers that support the USB PD Revision 3.1 specification. The WT6676F supports output voltages of up to 28V/36V while the WT6677F supports that of 28V/36V/48V. The USB PD 3.1 specification is a major update on USB PD specification that allows delivering up to 240W of power over USB Type-C® cable and connector that supports more applications with higher power requirements such as larger notebook PCs, wireless hand tools, wireless household appliances, electrical bicycles and etc. Prior to this update, USB PD 3.0 is limited to 100W. The WT6676F and WT6677F are highly integrated USB PD controllers that support USB PD 3.1 Standard Power Range (SPR) and Extended Power Range (EPR) specification as well as Qualcomm® Quick ChargeTM 4, Quick Charge 4+, and Quick Charge 5 technologies. It is designed for USB Type-C power source applications such as power adapters, wall chargers, car chargers, power strip, and etc. The WT6676F and WT6677F both minimize external components by integrating USB PD baseband PHY, USB Type-C detection, shunt regulator, voltage and current monitors, NMOS load switch driver, an 8-bit MCU and VCONN power to allow small form factor and low BOM cost. Wide operation range (3.3V to 45V/55V) supports 5V to 36V/48V USB PD 3.1 SPR and EPR specification. A Multi-Time-Programmable ROM is provided for program code and user configuration data.

• Wolfspeed Taiwan Limited

  Wolfspeed Wolfpack Gen 3 Module

  

  Wolfspeed’s WolfPACK modules are all about choice and flexibility. In the past, design engineers had limited options for their medium-power applications. It often came down to choosing either a higher-current module that was overkill for the design or creating a system that used multiple discrete components arranged in series and parallel, leading to increased design complexity. Wolfspeed WolfPACK changes all of that, and here’s how: For starters, the heart and soul of these new modules are Wolfspeed Silicon Carbide devices, which means it is built upon the same technology that has made Wolfspeed the world’s most trusted manufacturer of Silicon Carbide technology. With Wolfspeed WolfPACK, you get the same reliability and quality you’ve come to expect from Wolfspeed Silicon Carbide devices. Wolfspeed WolfPACK modules make system design flexible, using press-fit pins to make both prototyping and manufacturing easy. Press-fit pins are far more reliable than both traditional hand soldering and automatic soldering. With the introduction of Wolfspeed WolfPACK modules, our power portfolio now covers the entire spectrum of applications, providing choice to designers in diverse applications — from single-kilowatt designs to megawatt systems. These modules offer tremendous performance and proven Silicon Carbide reliability based on their flexibility, scalability, and because they are built with the backbone of Wolfspeed’s industry-leading Silicon Carbide technology.

• Cadence Desgn Systems, Inc.

  Cadence® Integrity™ 3D-IC Platform

  

  The Cadence® Integrity™ 3D-IC Platform is the new high-capacity, unified design and analysis platform for designing multiple chiplets. Built on the infrastructure of Cadence’s leading digital implementation solution, the Innovus™ Implementation System, the platform allows system-level designers to plan, implement, and analyze any type of stacked die system for a variety of packaging styles (2.5D or 3D). Integrity 3D-IC is the industry’s first integrated system- and SoC-level solution that enables system analysis, including co-design, with Cadence’s Virtuoso® and Allegro® analog and package implementation environments. Key Features and Benefits: 1. Common cockpit and database: Lets SoC and package design teams co-optimize the complete system concurrently, allowing system-level feedback to be incorporated efficiently. 2. Complete planning system: Incorporates a complete 3D-IC stack planning system for all types of 3D designs, enabling customers to manage and implement native 3D stacking. 3. Seamless implementation tool integration: Provides ease of use through direct script-based integration with the Cadence Innovus™ Implementation System for high-capacity digital designs with 3D die partitioning, optimization and timing flows. 4. Integrated system-level analysis capabilities: Enables robust 3D-IC design through early electrothermal and cross-die STA, which allows early system-level feedback for system-driven PPA. 5. Co-design with the Virtuoso® Design Environment and Allegro packaging technologies: Allows engineers to seamlessly move design data from Cadence analog and packaging environments to different parts of the system through the hierarchical database, enabling faster design closure and improved productivity. 6. Easy-to-use interface: Includes a powerful user cockpit with a flow manager that provides designers with a uniform, interactive way to run relevant system-level 3D system analysis flows.

• S2C Limited

  Prodigy Logic Matrix

  Prodigy™ Logic Matrix is a high-density FPGA prototyping platform architected from the ground up to meet today's needs for both large design scale and operation performance. Optimized for space and connectivity, Logic Matrix is designed for multi-system expansion to support billions of ASIC gate capacity. This platform is ideal for addressing the ever-increasing complexity and performance requirements in large-scale SoC designs for applications such as 5G, data center, AI/ML, and autonomous driving. 1. Industry leading density and capacity-up to 3.136 billion ASIC gates in single standard server rack 2. Hierarchical connectivity to support ­flexible topology and hyperscale design at prototyping performance 3. Highly modular design to simplify deployment, maintenance, and expansion in standard server racks 4. Multi-usages: early software development, full system prototyping, high performance regression

• Siemens EDA

  mPower Power Integrity Solution

  

  Siemens Digital Industries Software new mPower™ power integrity software for analog, digital and mixed signal IC designs mPower is the industry’s first and only IC power integrity verification solution to provide virtually unlimited scalability for analog, digital, and mixed signal ICs, enabling comprehensive power, electromigration (EM) and voltage drop (IR) analysis for even the largest IC designs. mPower software delivers power integrity analysis for all versions of 2D designs, in addition to 2.5/3D IC implementations at any scale, and it easily integrates into existing design flows. Using mPower, IC designers can more quickly and thoroughly verify that their designs meet power-related design goals -- capabilities that can help IC customers dramatically boost quality, enhance reliability and speed time to market. Customers using mPower have seen overall runtime improvements vs. their current solution, ranging from 2X faster to actually completing first-pass EM/IR analysis of large analog IP blocks, which was previously impossible. In addition to its exceptional analog functionality, Siemens’ new digital mPower scalable EM/IR engines also provide “no compromise” analysis for all-digital IC designs. The digital solution easily integrates into existing design flows, provides world-class power analysis functionality, and requires low per-machine memory – all while allowing designers to complete verification for even the largest digital designs.

• Texas Instruments

  PSpice® for TI

  

  Many of today’s hardware engineers face increased demands to produce accurate designs on tight project timelines. Failure to reliably test a design could lead to a costly setback in the production timeline, making simulation software a critical part of every engineer’s design process. PSpice® for TI, a new custom version of the Cadence PSpice simulator, helps engineers speed time to market with system-level circuit simulation and verification. PSpice for TI goes beyond the analytic capabilities of many other simulators on the market, enabling designers to reduce the risk of circuit errors with full validation of system-level designs before prototype. With a built-in library of nearly 6,000 analog power and signal chain models, PSpice for TI makes it easy to select, evaluate and verify components for new designs and provides open access to one of the industry’s largest IC model libraries. Advanced analytic capabilities include automatic measurements and post-processing, as well as Monte Carlo and worst-case analysis, which are easily accessible from the GUI, enabling engineers to fully validate their designs over a wide range of operating conditions and device tolerances with just a few clicks. After completing validation of a simulated design in PSpice for TI, users can open the design in commercial versions of PSpice Designer, and then transfer the design to other Cadence printed circuit board (PCB) tools such as OrCAD/Allegro PCB Designer without having to recreate their schematic. Product evaluation takes less time with synchronized library updates, which eliminate the need to manually import the latest individual TI models. The tool also connects engineers to the documentation and expertise they need to easily select, simulate and purchase TI products that meet their design needs with quick access to TI data sheets, product information, reference design test circuits and relevant search queries from TI E2E™ technical support forums.

• Analog Devices, Inc.

  DS28E30

  

  The DS28E30 provides a highly secure and easily deployed turnkey authentication solution based on the FIPS-186 ECDSA standard. The secure authenticator combines ECDSA challenge and response authentication with secured EEPROM for the storage of the keys and user data. The device provides a core set of cryptographic tools derived from integrated blocks including an asymmetric hardware engine, a true random number generator (TRNG), 3Kb of secure EEPROM, a decrement-only counter, and a unique 64-bit ROM identification number (ROM ID). The ECC public/private key capabilities operate from the NIST-defined P-256 curve to provide a FIPS 186-compliant ECDSA signature generation function to support a bidirectional asymmetric key authentication model. The unique ROM ID is used as a fundamental input parameter for cryptographic operations and serves as an electronic serial number within the application. In addition, authenticity of the chip can be verified with a Maxim-provided public key certificate. The device communicates over the single-contact 1-Wire® bus at overdrive speed. The communication follows the 1-Wire protocol with the ROM ID acting as a node address in the case of a multidevice 1-Wire network.

• Andes Technology

  45MP series

  

  The multiprocessor A(X)45MP, members of the highly successful 45-series processors, are welcomed by the market since introduced in 2021. A45MP (32-bit) and AX45MP (64-bit) multicore CPU IP are 8-stage superscalar processors based on AndeStar™ V5 architecture. Both support RISC-V standard “G (IMA-FD)” extensions, “C” 16-bit compression instructions, DSP/SIMD ‘P’ extension (draft), execution efficiency of branch prediction, plus Andes Custom Extension™ (ACE) to add user-defined instructions. In addition, both implement MMU (Memory Management Unit) for Linux based applications, and MemBoost with high volume of outstanding data accesses, I/D cache prefetches and data cache write optimization greatly boost the memory operation performance with higher bandwidth and lower latencies. The A(X)45MP symmetric multiprocessor supports up to 8 cores (AX45MP) and a level-2 cache controller with instruction and data prefetch. Coherence manger implements MESI protocol to manage level-1 cache coherence. Other features include ECC for level-1/2 memory soft error protection, Platform-Level Interrupt Controller (PLIC) with enhancements for vectored dispatch and priority-based preemption, CoDense™, StackSafe™ for software quality improvement, and QuickNap™, PowerBrake, and WFI for power management. A(X)45MP are adopted by industry leaders in diversified applications, ranging from high-end MCU, video processing, WiFi 7, 5G base station, AI accelerators, to enterprise-grade storage devices. An example is the general-purpose MPU (Microprocessor Units) SoC from Renesas.

• Arm

  Arm Cortex-X2

  

  With the release of Arm v9 architecture, new experiences for the entire ecosystem can be unlocked, from AI-enabled interactive use cases designed for mobile to rich 8K content that will make you forget you’re watching TV. All of this are built up from Armv9 Cortex CPUs, and at the heart of these solutions is Arm’s new premium core, the Cortex-X2. Cortex-X2 has been designed to deliver best-in class solutions for a wide range of consumer devices, bring the ultimate performance to laptops, great gaming experiences on mobiles. The design concept is to maximize performance on single-thread/burst workloads, 30% performance improvement over today’s flagship Android smartphone really bring your daily life usage to a different level. With the new NEON which is the heart of DSP and ML workloads, the faster response of ML use cases shall thanks to up to 4x performance enhancement by Bfloat16 format support and pipeline enhancement. Security is not compromised, Cortex-X2 protect your devices from different kind of attacks through bunch of new security features like Memory Tagging Extension to protect memory attack, Secure EL2 isolate your Trusted Execution Environment to prevent leakage, Pointer Authentication and Branch Target Identifier dramatically reduce the gadgets which can be used for Return Oriented Programming and Jump Oriented Programming attacks, all of these are the secure foundation to your usage. In addition to brute force performance, we wanted to build a CPU solution that was easily scalable across segments : from smartphones to laptops. We achieve this goal by ensuring performance scaling with upto 8 Cortex-X2 cores in a single DSU cluster and larger L3 cache support of upto 16 MegaBytes. Cortex-X2 had taken the center stages of smartphones and laptops in our day to day life. So far the high-performance and low-power Cortex-X2 has been widely adopted by many flagship smartphones.

• CEVA

  PentaG2

  

  PentaG2 is the only 5GNR baseband IP platform in the market. PentaG2 can dramatically jumpstart new modem development, improve time to market and reduce risk. PentaG2 is a comprehensive hardware/software IP platform that combines advanced DSPs with special purpose accelerators, to deliver a 4X improvement in power efficiency versus its predecessor, and dramatic power consumption improvement over SDR-based solutions. PentaG2 is both scalable and flexible, and serves a wide range of 4G and 5G use cases. It is also the first IP platform targeting cost effective 5G RedCap (reduced capability). PentaG2 is a comprehensive hardware/software IP platform that combines advanced DSPs with special purpose accelerators, to deliver a 4X improvement in power efficiency versus its predecessor. PentaG2 includes a complete set of programmable accelerators and coprocessors, constituting end-to-end in-line signal processing chains. PentaG2 is CEVA’s second-gen 5G platform for mobile broadband and IoT, and for reducing entry barriers for handset OEMs looking to internalize 5G modem design. PentaG2 is a comprehensive hardware/software IP platform, combining advanced DSPs with specialized accelerators, to deliver 4X improvement in power efficiency versus its predecessor. reducing the time-to-market, risk, effort and cost for customers. The scalable PentaG2 platform addresses a full gamut of use cases, from RedCap, NR-Sidelink and C-V2X, through to high end eMBB for handsets, CPE/FWA Terminals and mmWave and URLLC for XR headsets We can see opportunities for 5G deployment in AR/VR, URLLC, C-V2X, wearables and industrial. These new verticals open the door to semiconductor companies and OEMs to develop application-specific 5G modems in-house rather than relying on traditional, costly cellular modems from incumbent cellular vendors. PentaG2 bridges the design gap to develop a 5G modem by providing the full baseband processing platform in a cost and power efficient solution, which can also be leveraged by handset OEMs looking to internalize their 5G modem design.

• Global Unichip Corporation

  GUC's HBM3 IP

  

  GUC's HBM3 CoWoS platform, using in-house interposer design and TSMC CoWoS assembly, has been silicon proven and adopted in customer's SoC design. GUC's N7 HBM3 IP speed achieves 7.2Gbps; max bandwidth 900GB. N3E and N5 HBM3 IP speed achieves 8.4Gbps; max bandwidth 1000GB. GUC's HBM3 IP supports all TSMC CoWoS (CoWoS-S/R/L) package type.

• Hexas Technology Corporation

  Innovative IP : FanFET

  

  FanFET is an innovative, infrastructural device in the semiconductor industry. The 3D structure of FanFET has the characteristics of vertical current and stackable multi-layer and the fan-shaped form is beneficial to adjust the area ratio between the active area and the isolation. Furthermore, FanFET technology only uses DUV lithographic equipment to make the alignment and transfer of critical patterns clear. The application of FanFET is not only for non-volatile 3D-NAND flash memory, but also for DRAM development and production. The feature size of FanFET 3D-NAND Flash is 2F2. In the node technology of 20nm. Through the authorization of IP of 3D-NAND flash, customers can quickly implement technology development and mass production of stacks with more than 100 layers, the density is equivalent to GAA's 200 layers, regardless of the circuit design of various multi-level cells and reliability requirements of the product. As a result, the density of FanFET 3D-NAND Flash is about 2 times that of GAA 3D-NAND Flash. The feature size of FanFET DRAM is 3.5F2~5 F2. With the authorization of DRAM IP, under a specific arrangement of active area, customers can quickly introduce product development and mass-produce DRAM with a stacked FanFET DRAM, irrespective of the flexible design of circuit and reliability requirements of the product. Therefore, the density of FanFET DRAM is about 15% to 30% higher than that of buried WL RCAT DRAM. Therefore, FanFET technology can be applied to commodity products of 3D-NAND flash, DRAM, and more advanced technologies such as Tera-scale 3D-NAND flash memory chips, high bandwidth memory (HBM) of high speed and low power, and high performance chips in-memory computing.

• Imagination Technologies

  IMG CXT GPU

  

  The IMG CXT is a significant milestone in graphics processing technology. The first and only mobile GPU core with Level 4 (RTLS) ray tracing capabilities, it features a new PowerVR Photon architecture that brings high-performance, desktop-quality ray traced visuals to the palm of users’ hands. This is achieved through an industry-first GPU block called the Ray Acceleration Cluster, that performs ray tracing tasks at level higher than any other GPU. IMG CXT represents the ultimate solution for mobile gaming and graphics, with up to 50% more compute and geometry performance per core compared to the previous generation IMG BXT. Delivering up to 1.5TFLOPS of FPPF32 performance per core as well as a significant leap in performance, CXT represents the next generation in GPU with applications across markets. It’s the ultimate solution for mobile gaming and graphics with up to 50% more compute and geometry performance per core versus the previous generation. IMG CXT also features market-leading low bandwidth, combining Imagination’s tile based deferred rendering (TBDR) architecture with an advanced configurable cache infrastructure and the Imagination Image Compression (IMGIC) technology. The GPU is scalable to cloud, data centre and PC markets, thanks to its multi-core design. This enables it to deliver up to 9TFLOPS of FP32 rasterised performance and over 7.2GRay/s of ray traced performance at 2.5x the power efficiency of current solutions. CXT’s ray tracing capability allows developers to create more realistic looking digital environments with accurate lighting, natural shadows, and reflections – helping ground characters and objects into a 3D scene. The brand-new Photon architecture represents a decade of development in making ray tracing not just viable, but rapid, in low-power embedded devices such as smartphones. This offers several silicon blocks dedicated to accelerated ray tracing in a far more power-efficient manner than what is possible in the desktop space.

• Kameleon Security

  Kameleon ProSPU

  

  Kameleon’s Proactive Security Processing Unit (ProSPU) is the world’s first processor designed to enforce system’s security throughout its lifecycle. The ProSPU is a Hardware Root of Trust (RoT), controlling the system boot and performing platform and peripheral attestation. Kameleon can extend the ROT role for HW based runtime security by dynamically protecting and securing the computing platform and applications on it. Integrating Kameleon’s ProSPU enables platform designers to implement Platform Firmware Resiliency and comply with the NIST 800-193 and OCP requirements with minimal effort. In addition, when deployed on Linux-based systems, it makes the platforms resilient to a wide range of software attacks such as malware, ransomware, and rootkit

• NXP Semiconductors

  i.MX 93 Applications Processor

  

  The i.MX 93 applications processors are the first in the i.MX portfolio to integrate the scalable Arm Cortex-A55 core, bringing performance and energy efficiency to Linux®-based edge applications and the Arm Ethos™-U65 microNPU, enabling developers to create more capable, cost-effective and energy-efficient ML applications. Optimizing performance and power efficiency for Industrial, IoT and automotive devices, i.MX 93 processors are built with NXP’s innovative Energy Flex architecture. The SoCs offer a rich set of peripherals targeting automotive, industrial and consumer IoT market segments Part of the EdgeVerse™ portfolio of intelligent edge solutions, the i.MX 93 family will be offered in commercial, industrial, extended industrial and automotive level qualification and backed by NXP’s product longevity program.

• Texas Instruments

  Jacinto™ 7 processor platform

  

  The Jacinto 7 processor platform brings enhanced deep learning capabilities and advanced networking to solve design challenges in ADAS and automotive gateway applications. The TDA4VM processors for ADAS and DRA829V processors for gateway systems are the first two devices in the portfolio. These devices include specialized on-chip accelerators designed to segment and expedite computer vision, deep learning and other data-intensive tasks, allowing the car to more accurately perceive and react to the world around it. Supporting sensor fusion from cameras, LIDARs, radars and other sensors, the Jacinto 7 devices are able to accept inputs from multiple sources to not only create the most accurate vision of the world around the car, but also to utilize machine learning intelligence to help the car and driver best react to that world. Designed for L2 and L3 automated functions, these devices are targeted for applications ranging from automatic emergency braking and lane keep assist to more accurate autonomous parking and highway autopilot. The first two devices, TDA4VM processors for ADAS and DRA829V processors for gateway systems, include specialized on-chip accelerators to segment and expedite data-intensive tasks, like computer vision and deep learning. Additionally, TDA4VM and DRA829V processors incorporate a functional safety microcontroller, making it possible for original equipment manufacturers (OEMs) and Tier-1 suppliers to support both ASIL-D safety-critical tasks and convenience features with one chip. Both devices share a single software platform, which alleviates system complexity and cost by enabling developers to reuse their software investment across multiple vehicle domains.

• Apacer Technology Inc.

  CoreSnapshot SSD Technology

  

   As 5G high-speed networking applications roll out worldwide, AIoT edge devices are more commonly exposed to attacks by hackers. This is why Apacer developed CoreSnapshot, which integrates hardware, software, cloud, and BIOS partners.  Enterprises can perform complete backups and restore SSDs in a variety of ways. An SSD with CoreSnapshot installed divides its capacity into two sections – a user area and a backup area. All data is then written to both sections identically. If corrupt data is later written to the user portion, or the devices is attacked by a hacker, the device connected to the SSD may experience a blue screen of death. The administrator can use a hardware or software trigger to recover the SSD, swapping the backup area for the user area in less than 1 second.  Since the data in the backup area was never exposed to the corrupt data or the hacking intrusion, the device will then boot normally and full functionality will be restored without any losses due to downtime. CoreSnapshot can help avoid the expensive RMA (Return/Reject Material Authorization) and related costs of onsite service support for clients.

• AP Memory

  Ultra High Speed (UHS) PSRAM Ultra Low Swing (ULS) PSRAM

  

  AP Memory’s new UHS/ULS products serve as a memory solution that supports high density and low power consumption, meeting the needs of modern IoT applications such as new generation edge computing, smart home, smart wearable device, 5G communication, Timing Controller (TCON), etc. AP Memory is the first in the industry to introduce UHS/ULS PSRAM memory. Compared to traditional PSRAM and DRAM memory solution, UHS/ULS product series provides advanced memory features such as high transfer rate (~5x more bandwidth compare to PSRAM), low power consumption (~3x less compare to DRAM) and low pin count (3x less compare to DRAM). AP Memory’s UHS/ULS product series enable design simplification while meeting form factor constraints and upgrade system and function performance of compacted IoT applications. When operating at the highest frequency at 1066Mhz, the power consumption of UHS product can save power consumption up to 40% comparing to LPDRAM, with power consumption at a very low level of 62mW, which significantly improves wearable devices’ battery life. Furthermore, the newly released ULS products uses lower I/O voltages compare to traditional PSRAMs, further reducing memory power consumption, making ULS a new advantageous option for ultra-low-power memory solution. On top of this, as System on Chip (SoC) continues to migrate to advanced node process, the I/O voltage of SoC is gradually decreasing. UHS/ULS products can interconnect with SoC without a voltage converter, and due to its low pin count feature, it further reduces the complexity and cost of IoT product design. Both the UHS products, with density from 64Mb to 512Mb, and the 32Mb ULS product are offered in KGD (Known Good Die) for commercial (-25°C~85°C) and industrial grade application (-40°C~105°C). AP Memory supports customized service according to customers’ needs, providing RDL and WLCSP packaging application for end products at different levels such as component, module or system.

• Exascend, Inc.

  PI4 series E1.S SSD

  

  The PI4 series is Exascend’s flagship industrial-grade SSD lineup, available in the U.2, M.2 (2280, 2242 and 2230) and E1.S form factors, featuring Exascend’s trademark storage technologies and wide temperature-support for operation in -40 to 85 °C (-40 to 85 °C) industrial environments. Launched in December 2021, the PI4 series E1.S SSD is the world’s first rugged SSD in the enterprise E1.S form factor – combining enterprise-class performance and storage density with a thoroughly tough design ideal for extreme environments.

• Macronix International Co., Ltd.

  Macronix Ultra-Low-Power 1.2V Serial NOR Flash Memory

  

  Macronix Ultra-Low-Power 1.2V Serial NOR flash memory, MX25S Family, is the industry's first 1.2V Serial NOR flash memory in mass production. MX25S memories are ideal for IoT, communications and consumer-goods applications that rely on ultra-low power consumption. ** Consuming 50 percent less power than 1.8V products Macronix 1.2V SPI NOR flash MX25S features several important breakthroughs. First, it consumes 50 percent less power than the 1.8V series, which means the deep power down current of MX25S is reduced to 0.05uA and the active current can be as low as 0.27mA (1 MHz). Furthermore, because SPI NOR flash is commonly used to store boot code, the speed of code access is acritical consideration. Supporting an impressive 120 MHz clock rate, the MX25S stands out from the other 1.2V ultra-low-power NOR flash products currently on the market. The MX25S family's expected wide adoption in mainstream applications will be due not only to its low voltage but also its ability to maintain an impressive high data rate. This dual benefit of power savings and high data rate was the impetus of Macronix launching this new 1.2V low-voltage product line. ** Enabling simpler system design and better cost advantage The use of Macronix's 1.2V low-voltage NOR flash eliminates the need for some components due to the use of a standard I/O voltage. Implementing a standard streamlined I/O voltage design presents advantages in cost reduction and design flexibility. It allows a design that works in combination with the MCU, DRAM and multi-axis sensors also operating at low voltages. ** The MX25S family's standout features include: • Serial NOR flash interface • 1.2V (1.14V-1.6V) Vcc (wide Vcc range Vcc for covering various use scenarios and battery voltage ranges) • Ultra-low power consumption • Ultra-low deep power-down current of 0.05uA (the lowest DPD current of 1.2V NOR Flash in the industry to-date) • Ultra-low active current of 0.8mA • Quad I/O 120MHz supported (the highest speed 1.2V NOR Flash in the industry to-date) • Innovative Volatile bit to switch between ultra-low power mode and high-performance mode • Program/erase suspend and resume functions supported

• Silicon Motion, Inc.

  Ferri-UFS

  

  Ferri-UFS expand its product portfolio with SM672 UFS 3.1 solution. With a high-speed serial-link-based MIPI M-PHY HS-Gear4 x 2-lane, the SM672 enables high performance, high capacity and lower power embedded storage to meet the most stringent quality and reliability demands from industrial and automotive applications. The new features of UFS 3.1 include: 1. Write Booster：Designed to increase write speeds by using a pseudo-SLC cache. 2. Deep Sleep：The UFS 3.1 will consume lesser power thanks to voltage regulators that are used for both storage and other functions. 3. Performance Throttling Notification：Enable the UFS device to inform the host about performance throttling. The new automobiles are increasingly incorporating advanced driver assistance and infotainment features that require highly reliable, high speed storage solutions. Ferri-UFS is ideally suited to enable high-performance, high reliability storage and better power efficiency embedded storage for Automotive. Ferri-UFS undergo rigorous testing to meet the qualifications that the industry and our customers demand, including AEC-Q100 compliance, ISO 26262, supplier chain certification by IATF 16949 certification, and ASPICE compliance SW development process. In addition, Silicon Motion provides product supply longevity to reduce costs for additional qualifications.

• Anritsu Company, Inc.

  MT8000A Radio Communication Test Station

  

  The all-in-one MT8000A Radio Communication Test Station platform supports RF tests, protocol tests, application tests, and beam verification and characterization tests. In addition to supporting the NSA and SA base station simulation functions required for development of 5G chipsets and user equipment, it supports all frequency bands operated for 5G services, from the FR1 frequencies (600 MHz, 2.5 GHz, 3.5 GHz, 4.5 GHz, and the unlicensed 6-GHz band) to the FR2 frequencies (24, 28, 39, and 43 GHz). Moreover, it also supports the latest 3GPP Release 16 technology, as well as features such as 4x4 MIMO in FR1, and 8CC and 256QAM in FR2, which are in high demand for high-speed broadband communication. In addition, the MT8000A has a user interface with excellent operability, including software for setting various test parameters. The many versatile measurement-module configurations support a flexible and efficient test environment that can be tailored to customers’ future testing needs.

• Chroma ATE Inc.

  Regenerative Grid Simulator (Chroma Model 61815)

  

  Chroma 61815 regenerative grid simulator achieves high power density design with 3U form factor and maximum output power of 15kVA which can significantly reduce the amount of occupied space, by implementing advanced digital control design and next generation thermal processing technology. The 61815 core design is leveraged on bidirectional power conversion technology with energy regenerative capability. This bidirectional power conversion design not only supports the regenerative function for AC Source mode, but also uses the state of the art algorithm technology to develop regenerative AC Load mode by leveraging on the same hardware. This greatly increases the value of the product as user can choose to set the 61815 as an AC Source or AC Load. The 61815 provides user with the versatility in power test solution with main features, such as: wide output voltage range, single/three phase output mode, DC output capability, energy regenerative function and fast output voltage transient characteristics.

• Granite River Labs Inc.

  GRL USB Type-C® Power Delivery Tester and Analyzer – EPR (GRL-USB-PD-C2-EPR)

  

  C2-EPR is an integrated USB Power Delivery Compliance Tester. As Power Delivery charging rates increase and connectivity becomes more complex, the technology is also becoming more expensive and time-consuming to test and validate. C2-EPR can turn it around and takes users beyond traditional compliance to enjoy an easier and faster testing experience. C2-EPR automates the process, providing USB Power Delivery compliance testing at up to 240W at the push of a button. A comprehensive API portfolio enables users to run sample scripts, or program them in C# and Python. Key Features include: 1. Supports the latest USB Power Delivery 3.1 Specification as both a Source and Sink for complete testing and validation. The unit is also fully backwards compatible with the legacy 100W Power Delivery Specification. 2. The solution easily emulates a Source or a Sink in two ports using the Power Suite Pro application. An extensive selection of API’s and sample scripts is provided free-of-charge, and users can write their own scripts in C# and Python. 3. A unique Get Capability Feature helps users to quickly and easily understand the capabilities of any power delivery product. 4. Fully Automated Compliance mode and intuitive software helps navigate the software very easily. The compliance tests can be executed with just a few clicks. 5. Except for the USB PD compliance test, C2-EPR supports DisplayPort and Thunderbolt alternate modes. Includes Vconn and Vbus simultaneous loading. Integrates Qualcomm® Quick Charge test. 6. Only tester all over the world fully integrated 6-in-1 functions supporting 240W EPR valiations - protocol analyzer, protocol exerciser, e-Load, power supply, built-in scope and DMM.

• Keysight Technologies

  Radar Scene Emulator

  

  Keysight’s Radar Scene Emulator (RSE) tests the performance and response of radar-based ADAS/AD software against complex scenarios in a lab environment that includes near and far targets across a contiguous field of view (FOV). The RSE provides a deterministic environment for in-lab testing of complex scenes that today can be tested only on the road, if at all. It enables accelerated learning of ADAS/AD algorithms by testing decisions earlier against complex, repeatable, high-density scenes, with objects either stationary or in motion. Keysight’s first-to-market technology combines hundreds of miniature RF front ends into a scalable traffic emulation screen representing objects with up to 512-rixel resolution and distances as close as 1.5 meter. Each rixel has independent attributes: speed, direction, distance from the ego vehicle, and angle. The Radar Scene Emulator eliminates gaps in radar vision and enables training algorithms to detect and differentiate multiple objects in dense, complex scenes. Therefore, AV decisions can be made based on the complete picture. ▪ Thoroughly validate radar sensors and systems with 512 independent targets with a continuous horizontal FOV of +/-70° and vertical of +/-15° ▪ Generate static and dynamic targets at ranges of 1.5 m to 300 m and with velocities of 0 to 400 kph ▪ Test real-world complexity. Testing radar sensors against a limited number of targets provides an incomplete view of driving scenarios and masks the complexity of the real-world. Testing earlier for corner case scenes minimizes risk. ▪ Accelerate learning. Test more scenarios, sooner, with a high density of objects (stationary or in motion), while eliminating inefficiencies from robotic automation. Achieve greater confidence in ADAS functionality. ▪ Detect gaps or misbehavior in ADAS software via rendering based on dynamic resolution adaptation ▪ Generate realistic driving scenarios such as high-speed cross traffic with multiple targets Watch video (https://www.youtube.com/watch?v=01PiIIev8SI)

• NI

  Data Studio

  

  Product Vision •Improves product time to market, product quality, and NPI cost •Specifically designed for verification, validation and production data •Web interface and server side computing to improve cross team collaboration •Scalable architecture to grow from a single team to an entire enterprise •Open data access and API’s for visualization and analysis •Integrated workflows specifically for semiconductor product development and test tasks More info. please check here: https://youtu.be/zzr1pM2Ee9Y

• Rohde & Schwarz

  R&S®SMCV100B

  

  The R&S®SMCV100B vector signal generator is the first multistandard platform for automotive, broadcast, navigation and wireless applications. With just the initial purchase of the base unit, memory, bandwidth, frequency range and output power level can be upgraded and unlocked instantly via software keycodes. This concept applies also to signal generation standards, granting users ultimate flexibility to meet current and future test standards across multiple applications all on a single instrument, ultimately saving cost and space for users.

• Teledyne LeCroy

  CXL Compliance Testing

  

  Teledyne LeCroy offer fully automated compliance testing systems based on the V1.1/2.0 specification provided by the CXL Alliance for CXL 1.1/2.0 compliance testing, and provides performance and indicators for technicians developing based on the CXL specification. verification assistance. The CXL compliance test package was built using the Teledyne LeCroy Link Expert tool, which provides a fast, consistent, and easy-to-use menu design interface that allows users to test their devices as defined by the Compute Express Link Consortium V1.1/2.0 specification . We also provide major developers such as Intel in the pre-validation and plug-in testing, but take the role of test debugging and specification approval, and contribute to the popularization of CXL technology This solution combines a Summit T516, T54 or M5x protocol analyzer, the Summit Z516 protocol generator and a PCI Express test platform for testing device-side equipment. This solution can be used for CXL system side such as server and CXL device side equipment test verification function.

• Tektronix

  2 Series MSO

  

  The Scope that Works Where You Do The 2 Series MSO is so small, it's kind of a big deal. Weighing in at less than 1.8kg and just 40mm thin. This tiny, yet mighty scope can go seamlessly from bench to field and back again. Plus, with the battery option giving you hours of cordless power, you'll discover a whole new level of freedom on the job. • 70 MHz - 500 MHz bandwidth range • 10.1-inch touchscreen display • 2 or 4 analog channels • 2.5 GS/s max sample rate • 8 hours of unplugged testing with optional battery pack • 50 MHz AFG, 4-bit DPG for simulating the circuit under test Modern Touchscreen with Simple Controls The 2 Series MSO shares the same award-winning touchscreen interface and simplified control panel as our other oscilloscopes. With the intuitive feel of a mobile device, you'll be debugging your designs in no time. Software for Remote Work and Team Collaboration Engineers around the world are quickly adopting a remote-based work culture which brings a set of unique challenges to those that rely on a collaborative environment. Natively integrated software tools like TekDrive and TekScope allow you to collaborate, troubleshoot and debug your designs across time zones.

• ams OSRAM

  Vegalas RGB Laser module

  

  • New Vegalas surface-mount module halves the size of projection light engine in smart aug-mented reality/ mixed reality glasses • Resulting space savings of this key optical component enables design of smart glasses to look and feel as normal spectacles or sunglasses • ams OSRAM’s innovation in packaging of RGB SMT laser unit enables the development of the next wave of consumer wearable devices

• Analog Devices, Inc.

  ADSD3100

  

  The ADSD3100 is a CMOS 3D Time of Flight (ToF)-based 3D depth and 2D visual light imager that is available for integration into 3D sensor systems. The functional blocks required for read out, which include an analog to digital converter (ADC), pixel biasing circuitry, and sensor control logic, are built into the chip to enable a cost effective and simple implementation into systems. The ADSD3100 interfaces electrically to a host system over a mobile industry processor interface (MIPI), Camera Serial Interface 2 (CSI-2) interface. A lens plus optical band-pass filter for the imager and an infrared light source plus an associated driver are required to complete the working subsystem.

• Himax Technologies, Inc.

  WE-I Plus Solution (Note: WE stands for WiseEye)

  

  Unique Design 1. By integrating Himax’s ultra-low-power image sensor and edge AI processor, WE-I Plus solution realizes a wide range of battery-powered applications of vision, voice, and vibration detection at lower power and optimized costs. Smart sensing at the edge, with the considerations of privacy and latency, has been massively deployed in laptops, home security, smart city, smart retail, and smart manufacturing scenes. 2. The processor incorporates a neural network hardware accelerator optimized for image recognition, and the inference computing performance of running a neural network is 20 times better, compared with other MCUs. The multi-layer power management design can shut down functional blocks that are not running to lower voltages, thereby reducing dynamic and static power consumption so as to extend battery life. 3. Having both visible light and infrared bands, Himax AOS (Always-on Sensor) can dynamically adjust the energy level according to different operation modes to realize the most reasonable power consumption. It further reduces total system power when combining with low-power output interfaces. Special Feature 1. Himax proprietary interface between Always-on Sensor and ULP AI Edge Processor enables VGA input up to 60fps to realize fast wake-up and efficient image capture. 2. With full optimization of TensorFlow Lite for Microcontrollers framework, WE-I Plus simplifies the development and transplantation of NN models and removes the barriers of AI algorithm development. 3. WE-I Plus, an AI accelerator-embedded ASIC platform for ultra-low power applications, is designed to develop and deploy convolutional neural networks (CNN)-based machine learning (ML) models on battery-powered AIoT applications. Sensor fusion applications have brought greater convenience to people’s lives by enabling total solutions incorporating motion sensing, human presence detection, people counting, face detection, speech recognition, etc. Competitiveness 1. As a pioneer in the Edge AI sector, Himax WE-I Plus was firstly approved and enlisted in Google TensorFlow Lite for Microcontrollers Framework in 2020. 2. Himax ULP Edge AI Processor has been certified by Microsoft Azure IoT PnP. Through the ecosystem partnership with international cloud service companies, it is well received in the market and community. 3. By sponsoring the tinyML Vision Challenge held by the tinyML Foundation in July 2021, Himax helped to advocate tinyML computer vision technology to the developer community.

• KaiKuTeK Inc.

  K60168

  

  KaiKuTeK’s K60168 is the world’s first gesture recognition sensor SoC with mmWave radar. K60168 integrate 60GHz mmWave radar, AI Algorithms & Accelerator and Antenna with AiP (Antenna-in-Package) solution into single chip. Base on mmWave radar, K60168’s gesture recognition sensor SoC meet UI/UX expectations such as easy-to-learn-and-use, simple and gut instincts. Compare to other technique, the speed and sensitivity of gesture recognition sensor SoC, which developed by KaiKuTeK’s own AI Algorithms, are better. In addition, most of SoC with mmWave radar on the market so far include radar only, which would still rely on CPU or MCU to process signal. K60168, unlike others, provide single die, total integrated SoC in AiP package. Hence, K60168 not only solve antenna issue, but also enhance product performance via achieving low-cost, low-power and small-size goals. K60168 enable clients to use those SoC with mmWave radar as regular SoC and apply to consumer electronics such as wearable devices and AIoT applications. Moreover, KaiKuTeK also offer EVB and SDK to clients for their future innovative ideas development. In other words, design validation could be simpler, and may reduce implicit cost as well, which allow clients to launch products and reach time-to-market goals.

• Meridian Innovation Limited

  CMOS MEMS Thermal Imaging Sensor ( SenXorTM )

  

  SenXorTM technology is Meridian Innovation’s patented CMOS Hybrid thermal sensing architecture & proprietary Wafer Level Vacuum Package (WLVP). WLVP refers to a microchip that is made of two CMOS wafers bonded together with a vacuum cavity in between. The base wafer – referred to as the active wafer -- contains the thermal sensor array and the readout circuit. The top wafer – referred to as the cap wafer – transmits LWIR radiation while keeping the pixels of the array in vacuum for optimal operation. The WLVP chip is attached and wire-bonded to a PCB substrate and its housing includes a lens assembly designed to transmit LWIR radiation and focus it on the thermal sensor array. The PCBA has an FPC-connector for interfacing to a thermal image processing system by means of a flat strip cable. Meridian Innovation delivers cost-effective CMOS MEMS thermal camera modules that are mass manufactured in very large volume and can be embedded in appliances and infrastructure, to augment the value proposition of products and services by means of thermal imaging and thermal data analytics. It could make the invisible infrared spectrum to be visible for various applications. It can also sense the invisible in the dark. The patented sensor architecture enables its production by CMOS/MEMS-only technology, without exotic materials or packaging, unlike conventional sensors technology on the market. In addition to the thermal imager itself, Meridian Innovation supplies a suite of in-house developed reference design kits, equipped with firmware and software libraries for interfacing to the sensor and for performing thermal image analytics. This enables fast design-in process with the sensor, and accelerates the development of end-user solutions augmented by virtue of thermal imaging analytics.

• Molex

  Road Noise Cancellation (RNC) Sensors

  

  Molex: Road Noise Cancellation (RNC) Sensors, utilize A2B technology paired with a sensing element that captures sound waves, enabling a reduction of road-based noise a combustion engine would typically mask. RNC Sensors capture a sound wave as vehicle chassis vibration is detected and transfer it to the processing unit, which generates a cancellation wave form to the sound inside the vehicle while traveling on the road. Using A2B audio bus technology by Analog Devices, the sensors are connected through daisy-chained cabling, which eliminates the weight of heavy star-pattern or home-run wire harnessing and sound-dampening materials. The network technology minimizes the time between the sensor receiving the vibration excitation and the processing unit receiving the signal, which means the noise is cancelled more efficiently. Plus, the sensors can measure road noise at slower speeds and be placed farther away from the sound source, while providing more network data channels as well. Furthermore, the casings for the sensors were designed to anticipate the water and dust of the harsh automotive environment; they carry an IP6K9K enclosure rating to protect the system, utilizing the space-saving Molex Sealed Mini50 Connector interface. Various mechanical housing configurations offer flexibility for orienting the sensing element parallel or perpendicular to the ground, which allows for a variety of connector orientations and terminal sizes. Moreover, RNC systems can be configured with 4 to 8 sensors, depending on need. KEY BENEFITS RNC Sensors capture vibration energy from the suspension into the chassis early for optimal cancellation timing, at a lower cost than other noise cancellation systems. • Daisy-chained sensors, eliminating the need for heavier materials • Less time between the sensor receiving vibrations and sending signals to the module • An IP6K9K enclosure, protecting the sensors from harsh automotive environments • Fifty percent space savings with the Molex Sealed Mini50 Connector interface

• NXP Semiconductors

  S32R45 Radar Microprocessor Unit Dedicated High Performance MPU for 4D Imaging Radar

  

  The S32R45 is a purpose-made 64-bit automotive radar microprocessor unit (MPU) based on Arm® Cortex® - A53 and Arm® Cortex® - M7 cores manufactured with 16nm FinFET technology for high performance 4D imaging radar applications. The S32R45 is capable of cascading up to four radar transceivers. To drive all transmitters simultaneously, and process the huge volume of received data in real-time, it features two dedicated hardware accelerators - the 4-threading Signal Processing Toolbox (SPT) for radar processing acceleration and the linear algebra accelerator LAX for heavy-duty radar post-processing. 8MB SRAM is available on-chip to match its processing capability, and external memory is supported via the DD3 or LPDDR4 interface. The S32R45 enables customers to build concurrent 3-in-1 multi-mode high resolution radar sensing across short-, mid- and long-range operation. To achieve this, it leverages an innovative architecture to boost performance beyond raw sensor hardware capabilities with a low-complexity sensor configuration utilizing 192 virtual antenna channels. The boost is enabled by the combination of proprietary radar hardware acceleration delivering up to 64x the compute performance of standard processors, super-resolution radar software algorithms to achieve sub-degree angular resolution and advanced MIMO waveforms that allow simultaneous operation of antenna channels. This architecture helps overcome the limitations of other high-resolution sensors like LIDAR and high antenna count massive MIMO radar, whose cost and complexity limit their applications to a narrow set of use cases. The S32R45 is highly optimized to cut implementation cost & power consumption by up to 50% compared to general purpose FPGA implementations on the market today. It helps to enable increasingly autonomous driving, from L2+ through the most demanding L5 use cases. It also addresses a wide range of other application areas, such as traffic management, mining and agriculture machinery, warehouse and last-mile delivery robots where reliable high-resolution sensing is required.

• onsemi

  High resolution of automotive-qualified image sensor AR0820AT

  

  Specifically designed for automotive, the 8.3-megapixelis CMOS digital image sensor AR0820AT forms a fundamental part of the vision system that will detect objects in the vehicle’s path, including pedestrians and other vehicles, increasing road safety. With features such as higher dynamic range, enhanced low light performance, real-time functional safety mechanisms and fault detection, this sensor is aimed at assisting drivers and ultimately enables a new generation of fully autonomous vehicles with essential 360-degree vision. The AR0820AT provides high resolution and high dynamic range(HDR) in a variety of poor lighting conditions, with 100 times the perception capability of human eye vision under all conditions, enabling detection and identification of smaller objects and other dangerous situations at longer distances (up to 185 meters), making contributions to enhance ADAS systems and more advanced autonomous driving systems, thereby improving road safety. Wafer stacking technology enables compact camera designs. It is optimized for both low light and challenging HDR scenes, with a 2.1 µm DR-Pix BSI pixel and on-chip 140 dB HDR capture capability. The advanced fault detection features and embedded data on the AR0820AT are key to enabling ASIL B compliant cameras that are critical for higher levels of autonomous driving. By moving the responsibility for fault detection from the main processor to the sensor itself, significant processing power is saved and any faults or issues are able to be detected far more quickly, allowing the vision system to return to a safe state before a potentially hazardous event occurs. The inbuilt cybersecurity ensures reliable and secure operation.

• Texas Instruments

  AWR2944 single-chip radar sensor

  

  Empowering automakers to develop vehicles with increased visibility of their surroundings, the high-resolution 77-GHz AWR2944 single-chip automotive radar sensor can help automakers meet the latest automotive safety regulations and provides best-in-class radio frequency performance in a small form factor – approximately 30% smaller compared to radar sensors today. The AWR2944 sensor integrates a fourth transmitter to provide 33% higher resolution than existing radar sensors, enabling vehicles to detect obstacles more clearly and avoid collisions. In addition, the new sensor’s unique hardware supported by Doppler division multiple access (DDMA)-based signal processing improves the ability to sense oncoming vehicles at distances up to 40% farther away. TI’s AWR2944 radar sensor adds to the company’s extensive portfolio of analog and embedded processing products and technologies, giving automotive engineers more tools that can fuel vehicle innovation. The increased ability to quickly detect objects, monitor blind spots, and efficiently navigate turns and corners paves the way for automakers to achieve their vision of a collision-free future.

• TriEye

  SEDAR (Spectrum Enhanced Detection And Ranging)

  

  ULTIMATE PERCEPTION SOLUTION TriEye’s SEDAR (Spectrum Enhanced Detection And Ranging) is the ultimate imaging and ranging solution for ADAS and AV. Operating in the Short-Wave Infrared (SWIR) spectrum the SEDAR enables HD SWIR imaging and accurate 3D perception in all visibility conditions. The SEDAR is based on two world-first innovations: TriEye’s Raven (HD CMOS-based SWIR sensor) and TriEye’s SWIR illuminator. This first-of-its-kind technology is suited for mass production, offering a 10X cost reduction compared to current LiDAR solutions on the market. Operating within the solar blind region, the SEDAR offers environmental immunity, providing superior sight, functionality, and operability in all weather and lighting conditions. Also, because the SEDAR’s illumination is in the SWIR spectrum, it can be operated at 3-5 orders of magnitude higher than VIS/NIR illumination, while remaining completely eye-safe and supporting longer range night vision and depth measurement. The SEDAR generates a point cloud combined with a SWIR image, providing a critical high-resolution depth map to better spatially layout the environment. Its ability to provide 3D perception enables more accurate detection and recognition capabilities. Specifically, TriEye’s depth calculation methodology gives the SEDAR high points per second capabilities enabling deterministic detection, even with small hazards on the road ahead. COST-EFFECTIVENESS Until now, SWIR sensors were fabricated using Indium Gallium Arsenide (InGaAs), an expensive and exotic compound. Developed through advanced nanophotonics research, TriEye’s sensor enables a 1000x price reduction, HD resolution, low-power consumption, and a small form factor, eliminating SWIR as a prohibitive cost. SEAMLESS INTEGRATION As the SWIR spectrum can see through glass, the SEDAR can be mounted behind the windshield, eliminating the need for design modifications to the vehicle. Furthermore, providing imaging-based output means the SEDAR can use existing AI algorithms, saving the cost and time of developing new algorithms.

• Vayyar

  Vayyar Care

  

  Vayyar Care is a 4D imaging radar-on-chip monitoring solution that instantly identifies falls and gathers behavioral data to support personalized care, tracking activity to reveal reduced mobility or mental health issues, and bathroom visit frequency to highlight medical problems. It overcomes the drawbacks of standard technologies: • People may be unable to reach a button or pull a cord after a fall • Wearables like pendants and fall detection watches are widely underused • Video cameras are often unacceptable, especially in bathrooms where most falls happen • Bed mats and floor mats trigger frequent false alarms and must be replaced regularly Vayyar Care delivers 24/7 supervision alongside privacy, dignity and independence, with a single, discreet wall- or ceiling-mounted sensor. Data is processed on-chip into point cloud imaging that provides the resolution required for fall detection, room presence and room area presence. Exceptional accuracy in all conditions, including darkness and steam, enables care providers to manage falls in four distinct ways. • Detection of even minor falls that double the likelihood of falling again and usually go unreported enables preventative measures. • Evaluation of fall risk is supported by measuring Activities of Daily Living to highlight changes in mobility over time. • Prediction of near-term fall risk relies on tracking high bathroom visit frequency and disturbed sleep. • Intervention when high-risk individuals need it most is enabled by imminent bed exit alerts when a resident sits up in bed. Vayyar Care is integrated with the vast majority of nurse call systems and is deployed by over 120 care providers in 18 countries across the Americas, Europe, Asia, and Australasia. It is used in independent living and assisted living communities, skilled nursing and memory care facilities, and private residences. Around 30,000 units are in use with over 100,000 units expected to be online by the end of 2022.

• Vishay Intertechnology, Inc.

  RAME012

  

  Featuring a small 12.7 mm outer diameter, the Vishay MCB RAME012 miniature position sensor delivers higher accuracy and resolution than competing devices in the same size, while offering increased reliability and durability for harsh operating environments. The rotational absolute magnetic encoder uses advanced contactless technology to achieve > 11-bit accuracy and 14-bit resolution, while maintaining robustness against external magnetic fields, airborne pollution, vibration, mechanical shock, and changes in temperature. The device features a useful electrical angle of 360° and works over a temperature range of -40 °C to +105 °C. The body design of the RAME012 — as well as its on-axis design, slim diameter, and light weight (< 11 g) — make it ideal for applications where little space is available, but an angular position needs to be detected with high accuracy. The device is available in a single-turn variant featuring an SSI output signal, with other mechanical and electrical interfaces also available on request. With its SSI output and excellent performance / size ratio, the position sensor offers a perfect replacement for potentiometers in missile guidance systems, gimbals for optical balls and missile seekers, positioning systems for small industrial actuators (servo drives), and the multi-dimensional mechanical measurement of surfaces using 3D probes. With its plug and play operation, the RAME012 eliminates the need for calibration in these applications.

• AMD Xilinx

  Versal Premium ACAP with AI Engines

  

  The Versal Premium series with AI Engines is part of 7nm Versal adaptive compute acceleration platform (ACAP) portfolio including the existing Versal Premium series devices currently shipping to customers. The Versal Premium series with AI Engines delivers a 4X increase in signal processing capacity compared to the last-generation Virtex UltraScale+ VU13P FPGA. It also eliminates I/O bottlenecks with up to 9Tb/s serial bandwidth, and offers significantly reduced size, weight and power through heterogeneous, power-optimized integration of hardened, ASIC-like cores such as 100G/600G Ethernet cores, 400G High-Speed Crypto Engines, DDR memory controller, and integrated PCIe Gen5 blocks. Versal Premium with AI Engines combines highly advanced signal processing from the proven Versal AI Core series with the massive digital signal processing (DSP) compute capacity and serial bandwidth capacities of the existing Versal Premium series. By combining AI Engines with DSP Engines, users of Versal Premium with AI Engines devices can realize major performance gains compared to prior generation 16nm Xilinx devices and competing products on the market today. By offering the heterogenous integration of both AI engines and DSP engines, A&D and T&M customers are able to assign the right compute engine for the right task…from A&D radar applications such as adaptive beamforming to signal processing for RF machine learning applications like digital RF memory and direction finding. In the T&M market, Versal Premium with AI Engines addresses the growing demand for wireless testing as part of the global 5G rollout for applications like 5G protocol and production testing, as well as semiconductor automated test equipment. The Versal Premium series with AI Engines deliver major performance gains and additional functionality at reduced power and with a smaller footprint. In radar beamforming applications, the heterogenous compute engines enable 67% smaller footprint and up to 43% lower power with 2X beamforming performance.

• CEVA

  NeuPro-M

  

  With its NeuPro-M heterogeneous and secure processor architecture, CEVA has redefined high performance Artificial Intelligence / Machine Learning (AI/ML) processing for edge AI and edge compute devices. The 3rd generation NeuPro AI/ML architecture offers scalable performance of 20 to 1,200 TOPS at SoC and Chiplet levels, and lowers memory bandwidth by 6 times compared to its predecessor, the NeuPro-S. It achieves exceptional power efficiency of up to 24 TOPS per watt. NeuPro-M targets the broad use of AI/ML in automotive, industrial, 5G networks and handsets, surveillance cameras, and edge compute.NeuPro-M is CEVA’s latest generation processor architecture for AI/ML inference workloads, following NeuPro (2018) and NeuPro-S (2019). NeuPro-M is a self-contained heterogeneous architecture composed of multiple specialized co-processors and configurable hardware accelerators that seamlessly and simultaneously process diverse workloads of Deep Neural Networks, boosting performance by 5-15X compared to its predecessor. An industry first, NeuPro-M supports both system-on-chip (SoC) as well as Heterogeneous SoC (HSoC) scalability to achieve up to 1,200 TOPS and offers optional robust secure boot and end-to-end data privacy. NeuPro–M compliant processors initially include the following pre-configured cores: • NPM11 – single NeuPro-M engine, up to 20 TOPS at 1.25GHz • NPM18 – eight NeuPro-M engines, up to 160 TOPS at 1.25GHz A single NPM11 core, when processing a ResNet50 convolutional neural network, achieves a five times performance increase and six times memory bandwidth reduction versus its predecessor, which results in exceptional power efficiency of up to 24 TOPS per watt. NeuPro-M is capable of processing all known neural network architectures, as well as integrated native support for next-generation networks like transformers, 3D convolution, self-attention and all types of recurrent neural networks. NeuPro-M has been optimized to process more than 250 neural networks, more than 450 AI kernels and more than 50 algorithms. The embedded vector processing unit (VPU) ensures future proof software-based support of new neural network topologies and new advances in AI workloads.

• Chimes AI, Inc.

  Tukey - an AI modeling and management platform

  

  Tukey, a no-code AI analysis tool, empowers manufacturing industry with AI solution, assisting enterprises to make best decision at the first moment. Tukey's product features are simple and easy to use, horizontally scalable, and customized organization. Through Tukey's friendly interface, users can easily build, adjust and continuously manage AI models. They can also get custom dashboards with Tukey extension modules. Tukey is good at processing factory IoT data, ERP data and CRM data. Through Tukey's Drag-and-Drop data extraction, Automate data preprocessing and parameters tuning, or “AutoML”, and Model Life-cycle management (MLOps), users can complete End-to-End AI applications by themselves. After the self-built AI model is online, user could apply Tukey model API to build their own applications like BI insight or anomaly notifications.

• Flexxon Pte Ltd

  X-PHY® AI Cyber Secure SSD

  Flexxon's X-PHY® Cyber Secure SSD is the world’s first AI-embedded firmware-based cybersecurity solution and the critical last line of defence against cyberattacks in today’s highly interconnected landscape. With a multitude of access points through a range of IoT devices, endpoint security is essential in securing your devices and data. The integration of the X-PHY at the core of each device grants enhanced security across the entire spectrum of IoT devices from mobile and personal computing devices, to servers, and core enterprise data storage. This breakthrough technology detects anomalies in behavioural data access patterns and effectively shuts down potential known and unknown incursions in real-time, without the need for human intervention. This means that the X-PHY effectively fences off Zero Day exploitation, providing protection against a range of cyberthreats including hardware attacks, malware, ransomware and power glitches. By introducing an intelligent and self-learning layer of cybersecurity protection at the firmware level that functions as an added hardware sensor, the X-PHY provides autonomous data protection on the SSD drive at physical layer.

• Ignitarium

  TYQ-i®

  

  TYQ-i® is Ignitarium’s Visual Deep Learning based defect detection platform that can vastly improve your inspection and Quality Assurance process. A distillation of Ignitarium’s deep experience in AI-for-vision, TYQ-i blends the best of Classical CV techniques with advanced Custom neural nets to create an efficient solution across vastly different use cases. The same platform can be tuned to detect anomalies in an infrastructural asset spread over miles as easily as it can be re-purposed to detect a defect in a tiny part moving on a high-speed conveyer line. Key Features • Accurate defect detection using Vision sensors • Multi-mode vision sensor support – RGB, 3D, Laser, Microscopic, Multi-spectral, etc. • Advanced Hybrid algorithms merging classical CV and DL techniques • In-field Customer Re-trainable architecture • CNNs that minimize the requirement for vast training data sets • Multiple deployment modes – edge, in-premise server and cloud based • Solution scalable from low-cost micro-controllers to GPU farms Uniqueness Minimal Training Images CNNs (not just Open Source CNNs) that can be trained for high accuracy inference with minimal data sets Scalable across defect classes Common NN platform architecture can detect edge, surface, color, dimensional, missing or extra artifacts Integrated SDK-based solution Efficient SDK to allow quick deployment in live environments, irrespective of defect class being targeted Works with low-cost cameras Does not require high-end industrial grade Machine-Vision cameras. Can work with regular webcams in several use cases. In-built benchmarking frameworks The TYQ-i framework has a native benchmarking framework that allows quick identification of bottlenecks in the pipeline – registration, classification, inference or sub-stages in between. FPGA-accelerable architecture Efficient architecture that can seamlessly transfer critical functions from the Vision processing pipeline into low-cost FPGAs to achieve higher frame rates or reduce latencies Proven Use cases: • Wind Turbine Inspection • Rail Track Inspection (Aerial or Ground-based) • Real-time manufacturing line Inspection • Missing Artifact Detection • Real-time Color Detection

• Imagination Technologies

  IMG Seires4

  

  IMG Series4 is a ground-breaking neural network accelerator (NNA) for the automotive industry to enable ADAS and autonomous driving. With its incredible high performance at ultra-low latency, architectural efficiency, and safety features, it has what is needed for large-scale commercial implementation. Imagination is working with leading players and innovators in the automotive industry and the multi-core IP has already been licensed. The key to the incredible performance of the IMG Series4 is its multi-core capability. With configurations of 2,4,6, or 8 cores per cluster, the NNA allows for flexible allocation and synchronisation of workloads across cores. In combination with Imagination’s software, which provides fine-grained control, multiple workloads can be executed across any number of cores in the cluster. Maintaining high levels of utilisation with tera operations per second (TOPS) is a key metric for determining neural network performance. With its multi-core scalability, the IMG Series4 outperforms other solutions in the market by an order of magnitude, with industry-leading performance metrics. A single IMG Series4 core can deliver up to 12.5 TOPS per core at 1.2GHz in 7nm, and can be arranged in a cluster of 2, 4, 6, or 8 cores, which can be laid down in multiple cluster. An 8-cluster core is 100 TOPS and six of these laid out on a single SoC would therefore deliver 600 TOPS. Depending on configuration, the IMG Series 4 is over 100x faster than using a GPU for AI acceleration and 1000x faster than using a CPU. IMG Series4 also delivers phenomenal bandwidth efficiency. Processing tensors, the complex 3D maths performed inside a neural network, requires going out to memory and back across the bus. This takes time, consumes memory bandwidth, and absorbs power.

• InfinitiesSoft Solutions Inc.

  AI-Stack: Machine Learning Development and Operations Management Platform

  

  AI-Stack machine learning development and operation platform is the best AI computing management platform recommended by NVIDIA for customers. It can help customers manage a single GPU server or server cluster and turn it into a resource pool that can be managed, shared, and scaled horizontally, bringing flexibility, efficient collaboration and improved cost-effectiveness to the usage of GPU resources. AI-Stack can manage all GPU cards supported by NVIDIA CUDA-core from GeForce, NVIDIA RTX/Quadro to Data Center GPU. Kubernetes containerization technology is used to quickly deploy GPU resources to users. For IT managers and AI developers, it can solve the problem of unfamiliarity with Linux, Docker and Kubernetes. AI-Stack provides monitoring feature and dashboard that allows users and admins to see who are using which GPU cards for how long, providing account authority management, Log history, schedular and multi-node configuration management, to enable a self-service portal to enterprises and organizations. It is a user friendly AI management platform for on-premise and hybrid architecture to help improve GPU utilization. AI-Stack also provide GPU sharing function to cut one GPU card into percentage and share to multiple users to increase utilization.

• Kneron

  Automotive L1/L2 chipset: KL530 lower power with Vision Transformer AI model

  KL530 AI SoC The KL530 is Kneron’s most up-to-date heterogeneous AI chip enabled with a brand new NPU architecture. It is the first chip in the industry to commercially support INT4 precision and transformers. Compared to other chips, it has higher computing efficiency and lower power consumption. AIoT and other scenarios. Kneron Launches KL530— Next Generation Auto-Grade AI Chip, Bringing L1 and L2 Autonomous Driving to Any Vehicle KL530 integrates Kneron’s next generation NPU with a state of the art image-sensing processor for increased clarity at low power KL530 is the first to integrate ISPs and revolutionary Vision Transformer models The versatile new chip can be used to power L1 and L2 applications in autonomous vehicles (AVs), either directly built in to vehicles or through aftermarket solutions KL530 is embedded with ultra low power CPU, and is its most energy efficient processor to date.KL530 boasts up to 2x more TOPS/watt over KL520, already one of the most energy efficient edge AI chips on the market, and up to 10x the performance of KL520 in key AI models such as Mobilenet and Resnet. It is a staggering improvement across the board. This was achieved through the addition of INT4 data support, reducing processing time by 66% and doubling video framerate, as well as reducing boot time by 33% and increasing the number of objects that can be detected from 3 to 8 in the same cycle. Low-power design enabled by ARM Cortex M4 CPU. The computing power of the KL530 runs up to 1 TOPS@INT 4, and its processing efficiency is up to 70% higher than that of INT 8 under the same hardware conditions. Support for various AI models such as CNN, Transformer, RNN Hybrid. The chip’s smart ISP can optimize image quality through AI inferencing; and its powerful codec can achieve high-efficiency multimedia compression. The chip’s cold start time is less than 500 ms, and its average power consumption is less than 500 mW.

• Media.app Co. Ltd

  Asia's first multi-chain E-commerce platform by Web3.0 and metaverse

  

  The team is committed to establishing e-commerce on Web3.0. By assisting merchants to issue NFTs to implement virtual-real integration services, merchants can actually settle in MediaVerse (Multi-Chain Universe - Ethereum, BSC, Polygon, Avalanche) ).At the same time, our self-designed 3D engine provides a fast and excellent display space, allowing users to freely Watch and trade freely, and realize the virtual world on web 3.0. Welcome to MediaVerse DAO to decorate your imagination. Features: 1. Self-developed 3D engine to support real physical collision 2. The only metaverse in the world that supports multiple chains 3. Spherical 360° live streaming interaction 4. Integrate redeem functions, virtual and real integration 5. The first in Asia to have built-in advertising billboards in the Metaverse

• MemryX, Inc.

  MX3 Edge AI Accelerator

  

  Innovative Edge AI Architecture Compute-at-memory for highest throughput and lowest energy. Pure Dataflow architecture optimized for real time processing of streaming inputs from cameras or other sensors with low latency. Simplicity 1-click performance and power optimization of trained models with no retraining, hand-tuning, or quantization necessary. And with just one click, the majority of models execute with >50% chip utilization Scalability The exact same software is used for multiple small AI networks in one MX3 chiplet or large model(s) across multiple chiplets. Any number of MX3 chiplets can be used to scale to the desired level of performance, latency, and/or model size(s). Deterministic Low Latency (Batch=1) pipelined dataflow design with no internal control planes or control logic to limit input data streaming. All memory is included on the chiplet, fully mitigating any system bottlenecks and placing no processing requirements on the host. With no bottlenecks, AI performance is highly consistent/deterministic. Broad Support Supports all popular AI software frameworks (e.g. PyTorch, ONNX, Tensorflow, Tensorflow-Lite, Keras), Application Processors (Arm, x86, Risc-V), and operating systems (Ubuntu, Ycoto, Android, Windows, etc.). Connects to USB or PCI-E I/O ports.

• Molex

  NearStack PCIe Connector System and Cable Assemblies

  

  NearStack PCIe Connector System and Cable Jumper Assemblies create a direct connection from anywhere in the system to near the ASIC, using twinax cables to deliver a PCB alternative while improving signal integrity, lowering insertion loss and reducing signal latency. Being optimized for height they come with a low profile mated height of 11.10mm (R/A cable) to reduce airflow interference and allow for placement in tighter spaces within the system alternative. The unique contact interface with flexing beams on the NearStack cable receptacle affords no chance for preloaded beam relaxation through reflow on the PCB side. NearStack PCIe is capable of PCIe Gen-5 32-Gbps performance supporting PCIe Gen-5 requirements, with regards to both signal speed (32 Gbps NRZ) and number of pins for a x8 channel making it a fit for data center applications like accelerator hardware for AI or graphics as well as servers, storage and high performance computing. Built with direct-to-contact twinax termination it eliminates the PCB paddle card from the cable assembly, improving manufacturing efficiencies, repeatability, and signal integrity. NearStack PCIe is officially included in the OCP “DC-MHS” and “M-XIO” specifications and will be the recommended technology moving forward for the internal High Speed IO. Available in right-angle, angle-exit, and vertical cable assemblies NearStack PCIe provides design flexibility with more options for cable routing.

• MyelinTek Inc.

  MLSteam AI Platform

  

  1. Save Money – Hardware resources integration, cluster the dataset storage systems, GPU computing systems, and management servers to perform a data center-level cluster. Let IT or MIS monitor, allocate, and manage all hardware resources to maximize their utilization. Briefly speaking, it makes the company perform the highest efficiency for every penny spent on hardware. 2. One-stop AI Platform – Integrate the tools required for model development, such as data cleaning templates, labeling tools, development environments (JupyterLab), model templates (YOLO, Cifar etc...), so that model developers can immediately work on AI model training. 3. Save Time – Combining the above two points, the administrators can customize the upper limit of the user's hardware resources without causing the situation of resource interrupting, and the developers can also fine-tune the hyperparameters to train the models at the same time and select the best experimental results. In short, the resources are individual from each developer and do not cause queuing problems, and users themselves can also run experiments with different parameters at the same time to save time and cost. In addition, the pipeline feature allows users to duplicate the development process of a successful model, simplifying the tedious process of setting up the development environment. In other words, users can use successful cases as SOPs and then fine-tune them according to the needs of their projects to quickly develop. 4. Easy Deployment – When the trained model is deployed to the front-end devices, the operator can make adjustments in the form of no-code or low-code, to be closer to the inferencing site. In addition, for deployment to third-party operators, the model protection mechanism can also be used to avoid full exposure of the know-how of the model. The ability to automatically retrain is also currently being developed to lower the threshold for MLOps.

• NXP Semiconductors

  eIQ® ML Software Development Environment

  

  The NXP® eIQ® machine learning (ML) software development environment enables the use of ML algorithms on NXP EdgeVerse™ microcontrollers and microprocessors, including i.MX RT crossover MCUs, and i.MX family application processors. eIQ ML software includes a ML workflow tool called eIQ Toolkit, along with inference engines, neural network compilers and optimized libraries. This software leverages open-source and proprietary technologies and is fully integrated into our MCUXpresso SDK and Yocto development environments, allowing you to develop complete system-level applications with ease.

• onsemi

  RSL10 Smart Shot Camera

  

  RSL10 Smart Shot Camera, combining cloud-based AI with ultra-low-power event triggered image capture, can provide image capture and object recognition service with supporting app, to enable a new generation of IoT imaging, such as surveillance cameras, factory automation, smart agriculture and smart homes etc. The platform brings together a number of onsemi innovations, including the RSL10 SIP, which provides ultra-low power Bluetooth® Low Energy technology, and the compact 360 fps ARX3A0 Mono camera module, and other power products for low-power scenarios. Key Features: 1. Multiple sensors. Allows the user to set a startup event/threshold for the camera, and the camera is only started when needed, thereby greatly reducing power consumption. 2. Ultra-low power consumption. RSL10 SiP is the industry's lowest power consumption BLE system-on-a-chip (SoC), and the ARX3A0 image sensor also has ultra-low power consumption (<3.2 mW at startup). 3. High image quality. ARX3A0 global shutter greatly reduces image distortion, while near-infrared technology improves low-light performance. 4. Cloud services. The supporting APP allows users to control the camera through the BLE connection platform, while using the Amazon cloud AI engine to recognize images. Competitive Advantages: The RSL10 smart shooting camera platform provides an idea for hyper automation applications: sensor trigger (condition)-shooting (action)-AI recognition-getting information. It can be used for redevelopment with onsemi's free and public design materials based on different application scenarios.

• Silicon Labs

  Matter-Ready Platform BG24 & MG24 Wireless SoC integrated AI/ML accelerators

  

  New Matter-Ready platform BG24 & MG24 wireless SoCs which feature the industry's first integrated AI/ML accelerators, support for Matter, Zigbee, OpenThread, Bluetooth Low Energy, Bluetooth mesh, proprietary and multi-protocol operation, the highest level of industry security certification, ultra-low power capabilities and the largest memory and flash capacity in the Silicon Labs portfolio.This new co-optimized hardware and software platform incorporated PSA Level 3 Secure Vault™ protection will help bring AI/ML applications and wireless high performance to battery-powered edge devices, ideal for diverse smart home, medical and industrial applications. The BG24 and MG24 alleviate those penalties as the first ultra-low powered devices with dedicated AI/ML accelerators built-in. This specialized hardware is designed to handle complex calculations quickly and efficiently, with internal testing showing up to a 4x improvement in performance along with up to a 6x improvement in energy efficiency. Because the ML calculations are happening on the local device rather than in the cloud, network latency is eliminated for faster decision-making and actions. In addition to natively supporting TensorFlow, Silicon Labs has partnered with some of the leading AI and ML tools providers, like SensiML and Edge Impulse, to ensure that developers have an end-to-end toolchain that simplifies the development of machine learning models optimized for embedded deployments of wireless applications. Using this new AI/ML toolchain with Silicon Labs's Simplicity Studio and the BG24 and MG24 families of SoCs, developers can create applications that draw information from various connected devices, all communicating with each other using Matter to then make intelligent machine learning-driven decisions.

• Touch Cloud

  Crossing camera tracking and searching:GotchA!

  

  GotchA! is a AI based analytics product that provides cross-camera tracking feature. By using GotchA!, users can easily search and track the target persons in different cameras. Even in different angles or covered by something could be searched. GotchA! can be used for lost person searching, shopping mall VIP customer strolling path tracking. In addition, GotchA! provides physical attribute filters, such as age group, gender, attire style, etc., to filter out the objects to be searched and tracked. It can speed up the user's search speed. To compare with manual approach to find the target persons, GotchA! can save even more than 90% of the time.

• A-China Semiconductor Ltd

  32 bit MCU with PUF security function

  

  a 32 -bit microcontroller with PUF (physical uncloneable function) security function, each MCU has its own ID (like a fingerprint) which uses the physical differences on the silicon process to generate random garbled code and hardware it on the chip. It is unpredicatable, reliable, and durable, also easier for mass production. Applications inculde firmware protection, smart locks, car keys, IoT authentication, anti-fake, branding, licensing, tag, match with blockchain technology, and many other applications concerning security like NFT and cryptocurrency.

• Bravotek Electronics Co, Ltd.

  BV6811: AMOLED Power Solution

  

  In terms of wearable devices, how to reduce the PCB size as much as possible, while maintaining a long battery life, which is always an important issue. Bravotek develops a CCM Single-Inductor-Multiple-Bipolar-Output (SIMBO) power management chip for wearable AMOLED displays. The SIMBO technology generates two positive and one negative voltage outputs. The SIMBO structure saves large size of the PCB area around 26% due to eliminating external capacitors required by the charge pump circuit. At the meantime, this is the first one SIMBO-structure IC providing output voltage directly without LDO structure. The die size of SIMBO-structure is 40% smaller than the die size of traditional bipolar convertor (DC/DC + CP (20%) and LDO (20%)), while having better efficiency more 3~5%. In addition, through the latest innovative patented design, in terms of efficiency, it has a dynamic negative output voltage function. Under the same screen display on panel, the power consumption can be reduced by nearly 52% compared to other competitors’ products. When it comes to life cycle, the extremely low quiescent current (25uA) enables the wearable device to maintain normal operation in a long-time standby state, providing the optimal power solution for wearable devices with highly requirements in terms of size and battery life.

• Cambridge GaN Devices

  ICeGaN™ - 650V eMode GaN ICs

  

  Industry-first 650V enhancement mode GaN Transistor that can be driven like a Silicon MosFET, up to 20V gate voltage. CGD's ICeGaN™ transistors can be driven with any external gate drivers without the needs for additional circuitry and clamping diodes and no negative driving voltage is required.

• Chimes AI, Inc.

  Tukey - an AI modeling and management platform

  

  Tukey, a no-code AI analysis tool, empowers manufacturing industry with AI solution, assisting enterprises to make best decision at the first moment. Tukey's product features are simple and easy to use, horizontally scalable, and customized organization. Through Tukey's friendly interface, users can easily build, adjust and continuously manage AI models. They can also get custom dashboards with Tukey extension modules. Tukey is good at processing factory IoT data, ERP data and CRM data. Through Tukey's Drag-and-Drop data extraction, Automate data preprocessing and parameters tuning, or “AutoML”, and Model Life-cycle management (MLOps), users can complete End-to-End AI applications by themselves. After the self-built AI model is online, user could apply Tukey model API to build their own applications like BI insight or anomaly notifications.

• Hyson Technology Inc.

  FarmABetterFish AIoT Aquaculture Management System

  

  The biggest difficulty facing the aquaculture industry is that the fish and shrimp are underwater and difficult to be observed, which makes aquaculture extremely risky. To conquer this, we have developed the “FarmABetterFish AIoT Aquaculture Management System” to lower the risks caused by hard to check fish growth in the farming ponds. This product is applicable to inland and offshore aquaculture. It allows fishermen to examine the fish/shrimp growth via their mobile phones, and also can integrate on-site machinery equipment to automate routine works, reduce operational risks, and improve productivity in a friendly environment. FarmABetterFish system includes a self-developed underwater camera together with an AIoT portable analyzer to monitor fish. An embedded edge-AI image defogging technology is applied to make the underwater images to become clear, so that fishermen can see the fish, check the fish activities, examine feeding status, and know whether fish is sick or not, etc. Fish images will be synchronized to the cloud. Cloud-AI will automatically identify, measure, and record the fish biological information to statistic the growth status of the fish population, analyze the feed conversion rate, and present the information in visualized charts. Based on the growth data, the AI expert system predicts the harvest date for you to arrange sales and shipment schedules, and ensures the stability of supply chain. This system can be expanded to remotely control on-site automation equipment and link peripheral modules such as water quality detector, flood detector, and micro-weather stations, to monitor and alert the in-pond water quality and the environment outside the ponds. This system can automate 75% aquaculture daily work, reduce 40% risks, and increase 30% productivity. This is the best product to make aquaculture visible, measurable, controllable, and thus easier for you to manage your stock and scale up your aquaculture business with lower risk.

• KaiKuTeK Inc.

  K60168

  

  KaiKuTeK’s K60168 is the world’s first gesture recognition sensor SoC with mmWave radar. K60168 integrate 60GHz mmWave radar, AI Algorithms & Accelerator and Antenna with AiP (Antenna-in-Package) solution into single chip. Base on mmWave radar, K60168’s gesture recognition sensor SoC meet UI/UX expectations such as easy-to-learn-and-use, simple and gut instincts. Compare to other technique, the speed and sensitivity of gesture recognition sensor SoC, which developed by KaiKuTeK’s own AI Algorithms, are better. In addition, most of SoC with mmWave radar on the market so far include radar only, which would still rely on CPU or MCU to process signal. K60168, unlike others, provide single die, total integrated SoC in AiP package. Hence, K60168 not only solve antenna issue, but also enhance product performance via achieving low-cost, low-power and small-size goals. K60168 enable clients to use those SoC with mmWave radar as regular SoC and apply to consumer electronics such as wearable devices and AIoT applications. Moreover, KaiKuTeK also offer EVB and SDK to clients for their future innovative ideas development. In other words, design validation could be simpler, and may reduce implicit cost as well, which allow clients to launch products and reach time-to-market goals.

• Kameleon Security

  ProSPU

  

  Kameleon’s Proactive Security Processing Unit (ProSPU) is the world’s first processor designed to enforce system’s security throughout its lifecycle. The ProSPU is a Hardware Root of Trust (RoT), controlling the system boot and performing platform and peripheral attestation. Kameleon can extend the ROT role for HW based runtime security by dynamically protecting and securing the computing platform and applications on it. Integrating Kameleon’s ProSPU enables platform designers to implement Platform Firmware Resiliency and comply with the NIST 800-193 and OCP requirements with minimal effort. In addition, when deployed on Linux-based systems, it makes the platforms resilient to a wide range of software attacks such as malware, ransomware, and rootkit

• MemryX, Inc.

  MX3 Edge AI Accelerator

  

  Innovative Edge AI Architecture Compute-at-memory for highest throughput and lowest energy. Pure Dataflow architecture optimized for real time processing of streaming inputs from cameras or other sensors with low latency. Simplicity 1-click performance and power optimization of trained models with no retraining, hand-tuning, or quantization necessary. And with just one click, the majority of models execute with >50% chip utilization Scalability The exact same software is used for multiple small AI networks in one MX3 chiplet or large model(s) across multiple chiplets. Any number of MX3 chiplets can be used to scale to the desired level of performance, latency, and/or model size(s). Deterministic Low Latency (Batch=1) pipelined dataflow design with no internal control planes or control logic to limit input data streaming. All memory is included on the chiplet, fully mitigating any system bottlenecks and placing no processing requirements on the host. With no bottlenecks, AI performance is highly consistent/deterministic. Broad Support Supports all popular AI software frameworks (e.g. PyTorch, ONNX, Tensorflow, Tensorflow-Lite, Keras), Application Processors (Arm, x86, Risc-V), and operating systems (Ubuntu, Ycoto, Android, Windows, etc.). Connects to USB or PCI-E I/O ports.

• Meridian Innovation Limited

  CMOS MEMS Thermal Imaging Sensor ( SenXorTM )

  

  SenXorTM technology is Meridian Innovation’s patented CMOS Hybrid thermal sensing architecture & proprietary Wafer Level Vacuum Package (WLVP). WLVP refers to a microchip that is made of two CMOS wafers bonded together with a vacuum cavity in between. The base wafer – referred to as the active wafer -- contains the thermal sensor array and the readout circuit. The top wafer – referred to as the cap wafer – transmits LWIR radiation while keeping the pixels of the array in vacuum for optimal operation. The WLVP chip is attached and wire-bonded to a PCB substrate and its housing includes a lens assembly designed to transmit LWIR radiation and focus it on the thermal sensor array. The PCBA has an FPC-connector for interfacing to a thermal image processing system by means of a flat strip cable. Meridian Innovation delivers cost-effective CMOS MEMS thermal camera modules that are mass manufactured in very large volume and can be embedded in appliances and infrastructure, to augment the value proposition of products and services by means of thermal imaging and thermal data analytics. It could make the invisible infrared spectrum to be visible for various applications. It can also sense the invisible in the dark. The patented sensor architecture enables its production by CMOS/MEMS-only technology, without exotic materials or packaging, unlike conventional sensors technology on the market. In addition to the thermal imager itself, Meridian Innovation supplies a suite of in-house developed reference design kits, equipped with firmware and software libraries for interfacing to the sensor and for performing thermal image analytics. This enables fast design-in process with the sensor, and accelerates the development of end-user solutions augmented by virtue of thermal imaging analytics.

• proteanTecs

  Universal Chip Telemetry™ technology

  

  proteanTecs has developed health and performance monitoring solutions for advanced electronics, enabling visibility from within. The company provides deep data based on Universal Chip Telemetry™ (UCT), to uncover insights in test and in mission. Our cloud-based analytics platform applies machine learning algorithms to measurements extracted from on-chip UCT Agents (monitoring IPs), strategically placed during design to provide a high coverage, high resolution picture of the chip’s behavior, design sensitivities and marginalities. Users gain insights and alerts allowing them to take immediate action to maximize profit, ensure supply and improve power, performance, quality and reliability - all while reducing costs. During product bring-up and volume testing, chip and system vendors can reduce DPPM by 10x, optimize power-performance per application, improve performance yields, optimize and track reliability margins and significantly shorten TTM. Once deployed in the field, service providers can be alerted on faults before failures, lower maintenance costs, optimize system performance, reduce RMAs, optimize fleet management and extend product lifetime.

• PUFsecurity Corporation

  Secure Crypto Coprocessor - PUFcc

  

  PUFcc is the ideal Crypto Coprocessor IP that combines a Hardware Root of Trust with a full suite of cryptographic algorithms, forming the complete security IP module suitable for integration into a wide array of system architectures. PUFcc supports all secure operations, such as 1)TEE security enhancement; 2)Key processing and generation; 3)Instant key wrapping or indirect key wrapping; 4)Key hierarchy build and advanced management; 5)Secure boot; 6)Anti-cloning and asset protection by using local key encryption; 7)TLS protocol; 8)To extend protection for external Flash, and more. The all-in-one integrated solution takes care of all required security functions throughout the product lifecycle. Such compact design also maintains a security boundary for safekeeping sensitive information or assets intact. PUFcc enables protection from the hardware level extending all the way to OS and APPs to secure the electronic products and services. PUFrt/PUFcc series products have received a lot of attention from the industry, and there are related cooperation and press releases with the U.S. DARPA toolbox program, the latest FIDO FDO standard, Arm, Andes, and Intel IFS accelerator program.

• Ret[AI]ling Data

  Smart Sales Promotion(SSP)

  

  1、The SSP smart retail shopping guide system combines face recognition and advertisement promotion, Using edge computing, data-driven models, and rough deep learning to identify customer characteristics, age, gender, and emotions. 2、To provide thin and light machines,and use the front lens of the shopping guide machine to carry out identification and machine deep learning and analyze customer characteristics in real time. 3、Focusing on OMO precise marketing with "consumers" as the starting point, it provides personalized sales services for different consumer groups.

• UnaBiz Co., Ltd.

  LPWAN-Sigfox,Lora,NB-IoT,LTE,BLE...

  

  1.Smart Metering- Japan’s #1 LPG Gas company, Nicigas, wants to digitalise its entire gas consumption monitoring operations,and UanBiz is is proud to be a partner of #NICIGAS #DigitalTransformation initiatives. Before working with customised IoT hardware maker UnaBiz and Japanese IoT connectivity and data management platform supplier SORACOM, NICIGAS tested several off-the-shelf and custom-built solutions from reputable companies. None of those solutions met their technical requirements within their expected return of investment. To answer the problem, SORACOM teamed up with UnaBiz to create the “Space Hotaru” – a Network Controlling Unit (NCU) that transmits gas consumption data to “NICIGAS Stream”, the company’s central IoT data platform. 2Smart Asset Tracking-, Konvoy commissioned UnaBiz to design its Kegfox beacon, a full-fledged, purpose-fit tracking device and software system that reports the keg’s location throughout its life cycle.Optimised operations, enhanced billing, theft prevention and customer service improvement.

• Your Health Technology Co., Ltd. (Yutech)

  Guard Patch-Cardiovascular Disease Detection, Analysis and Evaluation System-On-Chip and Platform

  

  The goal of the Guard Patch is to develop a Low-power Long-term Wearable Body Sensor SOC for Wireless Electrocardiogram Monitor. Our team designs and implements a high resolution and low power bio-signal acquisition chip. The chip is fabricated in a TSMC 0.18 μm standard CMOS process. Based on this chip, we integrate the required circuits into a wearable system module to sense the ECG signal from users. The communication between the sensor and the smart phone is established via Bluetooth. The software needs to fulfill the following four principal tasks: 1) data processing, 2) analyzing, 3) displaying, and 4) recording. A back-end application (APP) on Android/iOS system carries out the further mathematical calculation and analysis, including demodulation and digital signal processing. With the basic monitor function (off-line bio-signal data storage), the real-time monitoring function is also developed and the real-time bio-signal can be checked on the smart device. The processed bio-signal will then be displayed on the screen. With such a wearable platform for wireless bio-signal acquisition, the user can access and monitor his own physiological condition anytime and anywhere. For these functions mentioned above, this wireless bio-signal acquisition system will become the guard patch of the user. There are three main advantages of this system, including real-time monitoring, convenient for wear, and easy to use. Besides, the technology of Guard Patch is promoted to other application including 24-hour arrhythmia monitoring system, Intelligent medical stethoscope, portable and wireless urine detection system and platform, smart clothing, Arrhythmia monitoring Belt, I-Pet clothing, Bio-medical development module for wearable and IOT-based products, etc. The detailed has been presented in product introduction video (https://youtu.be/jdgV-7rmt5g).

• Andes Technology

  AndeSight™ IDE V5.1

  

  AndeSight™ IDE v5.1 brings the power of application development, debugging, and analysis to the heterogeneous RISC-V multiprocessors, including the cutting-edge Andes RISC-V Superscalar Multicore A(X)45MP and Andes RISC-V Vector Processor NX27V. To support OS with SMP (Symmetric Multiprocessing), besides Linux SMP which has been well supported in RISC-V upstream and Andes platforms, Andes offers the first RISC-V port for SMP Zephyr™ RTOS and Zephyr’s driver subsystem. It has been verified on Andes RISC-V multicore platform. Developers only need to focus on the applications themselves without worrying about the underlying system software. As to AMP (Asymmetric Multiprocessing) demands, AndeSight™ integrates the OpenAMP which provides communication infrastructure between heterogeneous systems and enables AMP applications to leverage parallelism offered by multiprocessor systems. AndeSight™ provides the user-friendly multicore debugging feature for both SMP and AMP systems in one IDE interface. To further enhance the ultimate debugging efficiency for multiprocessors, it offers a handy feature “Core Grouping” by sending debug commands to a set of cores in the same debug session. AndeSight™ also offers the record-and-replay scripting capability to save interactive steps for easy issue reproduction and automatic testing. To simplify the software development and unleash the potential of powerful ISA extensions, AndeSight™ offers full support from toolchains for RVP and RVV, their respective intrinsic functions, highly optimized DSP and Vector libraries, and sample codes to guide code optimization. AndeSight™ facilitates and streamlines the development of embedded systems and provides customers with a versatile integrated environment, including outstanding toolchains and libraries, scripting for automated operations, AndeSim™ near cycle simulator, handy analysis tools, and OS awareness development. Moreover, AndeSight™ provides abundant reference codes that enable developers to get started easily.

• Arm

  Arm Virtual Hardware

  

  Arm Virtual Hardware (AVH) provides a step change in the evolution of Arm’s modeling technology. Arm Virtual Hardware delivers test platforms for developers to verify and validate embedded and IoT applications during the complete software design cycle. Multiple modeling technologies are provided that remove the complexity of building and configuring board farms. This enables modern, agile, cloud native software development practices, such as continuous integration and continuous development CI/CD (DevOps) and MLOps workflows.

• NXP Semiconductors

  Voice Intelligent Technology (VIT)

  

  Voice Intelligent Technology (VIT) provides voice UI enablement with always-on wake word detection and local commands. Based on state-of-the-art deep learning and speech recognition technologies, VIT is a comprehensive software library including a far-field audio front end (AFE) supporting up to three microphones, an always-on wake word engine and a voice command engine, along with online tools to generate customer-defined wake word models and voice command models. VIT is fully compatible with NXP’s MCUXpresso SDK. VIT simplifies the developer's job and streamlines the development process by providing a comprehensive, flexible software solution that incorporates the key technical building blocks to create on-device voice control applications with no need for the complexities of cloud connectivity. VIT is a comprehensive software solution that simplifies voice control for mass deployment via online self-service model creation tools. VIT is free to deploy on compatible NXP processors. This self-service models speeds customer time to market and expands innovation potential, complete with video training guides and an online community for engineer-to-engineer support. NXP now offers a streamlined path to mass deployment of on-device voice control which we believe will lead to more innovation and faster time to market for our customers Current languages supported include English, Mandarin, German, Spanish and Turkish. The language roadmap includes Japanese, Korean, French, Italian by end of 2022. Other semiconductor companies do not provide a free-to-use, local voice control enablement for low-power IoT edge applications. VIT runs entirely at the edge and can be deployed in an always-on state, even on battery-operated devices. No cloud or server connectivity is necessary to achieve reliable, high-quality voice control.

• Renesas Electronics

  Lab on the Cloud

  

  Lab on the Cloud is a very unique platform, where customers can evaluate a solution remotely using the web URL. It is an attempt to make Renesas eval kits and solutions reachable to the remotest designer globally and instantly accessible 24/7. These solution boards, Advance Test instruments like Oscilloscope, Power sources and Power meters are connected over cloud and can be monitored through live video streaming direct from the Lab.The Lab is fully autonomous, and users can test these boards, control the equipment through an intuitive web GUI (Graphical User Interface).In last one year, Renesas has brought up ~40 such boards where many mass market applications like cloud based solution, Low Power Bluetooth, Motor drive, Electric Vehicle System, Air Quality Monitoring system, Advance Face, Object & Voice recognition and voice authentication systems were implemented. 1. It is a real time evaluation of demos from Solutions of Renesas accessed virtually. 2. This is a Free to use tool, which doesn't need to be installed, so no IT, Storage, or any other restrictions to use it. 3. 24/7 Live system, designers can select their suitable time to test & evaluate. 4. Online Evaluation can boost the confidence of designers, which will reduce their design cycle time. 5. The wait time for solutions reaching to customer can be avoided, they can quickly test the Evaluation boards. 6. Users can post their queries about the designs and it can be answered by the board designers directly. 7. All the necessary documents and downloadable tools are available in the evaluation page links.

• Silicon Labs

  Simplicity Studio 5 IDE for IoT

  

  Simplicity Studio is the unified development environment for all Silicon Labs technologies, SoCs, and modules. It provides you with access to the target device-specific web and SDK resources, software and hardware configuration tools, and an integrated development environment (IDE) featuring industry-standard code editors, compilers, and debuggers. With Simplicity Studio, you get a complete set of advanced value-add tools for network analysis and code-correlated energy profiling. No matter your experience level, Simplicity Studio takes you through an optimized workflow, enabling quicker project progression, device configuration, and application optimization. Simplicity Studio 5 is built on Eclipse and C/C++ Development Tooling (CDT), adding robustness, improving performance, and allowing you to customize your development experience using plug-ins from the Eclipse Marketplace. Simplicity Studio version 5 supports Silicon Labs Secure Vault, the most advanced security software suite with the highest PSA Certification Level 3. With Secure Vault, you can protect your IoT devices against escalating threats while conforming to the quickly evolving cyber-security regulations. The IDE also includes a UI engine for modern, responsive, web-like user interfaces. Product website: https://www.silabs.com/developers/simplicity-studio

• Your Health Technology Co., Ltd. (Yutech)

  TriAnswer-Bio-medical development module designed for wearable and IOT-based products

  

  Trianswer is a bio-medical development module designed for wearable and IOT-based products. It not only contains several features about low-power consumption, miniaturization and IOT-based design, but also provides the acquisition of high-quality bio-signals including Electrocardiography (ECG), Electroencephalography (EEG), Electromyography (EMG), etc. By reducing the development time and cost, developers can manufacture their wearable devices rapidly with the assistance of Trianswer, which means that you can try and get your answer. In addition, acquiring the specific bio-signal needs its own corresponding module. Developers can combine the modules like building blocks according to their needs. The main concept of Trianswer is to promote the development of bio-medical wearable devices. TriAnswer theorem introduction: https://youtu.be/sQcyQJgb_so TriAnswer operation introduction: https://youtu.be/DJzKJtfdT1s TriAnswer open source :https://github.com/YuTecHealth

• Arm

  Armv9

  

  The number of Arm-based chips shipped continues to accelerate, with more than 100 billion devices shipped over the last five years. At the current rate, 100 percent of the world’s shared data will soon be processed on Arm; either at the endpoint, in the data networks or the cloud. Such pervasiveness conveys a responsibility on Arm to deliver more security and performance, along with other new features in Armv9. Armv9 is the first new Arm architecture in a decade, building on the success of Armv8 which today drives the best performance-per-watt everywhere computing happens. To secure the world’s data, the Armv9 roadmap introduces the Arm Confidential Compute Architecture (CCA). Confidential computing shields portions of code and data from access or modification while in-use, even from privileged software, by performing computation in a hardware-based secure environment. The new capabilities in Armv9 will accelerate the move from general-purpose to more specialized compute across every application as AI, the Internet of Things (IoT) and 5G gain momentum globally.

• Artery Technology

  Artery AT32F435/437 High Performance MCU

  

  High performance AT32F437 series, ARM® Cortex®-M4 core, up to 288 MHz CPU. Featuring internal FPU, DSP and MPU, it is provided with rich peripherals and flexible clock control mechanism for a wide range of applications. It supports up to 4032 KB Flash and 512 KB SRAM, suitable for higher computation and larger memory including industrial automation, motor control, IoT and consumer electronics.

• ASIX Electronics Corporation

  Industrial Ethernet/ EtherCAT Slave Controller & TSN FPGA Technology

  Response to the rapidly growing industrial Ethernet market demand, ASIX offers cost-efficient AX58x00 family EtherCAT slave controllers, and AXM57104 TSN NIC solutions for Industrial IoT applications. AX58400 EtherCAT to IO-Link Gateway solution integrates ASIX’s own IO-Link Master Protocol Stack.

• Cambridge GaN Devices

  ICeGaN™ - 650V eMode GaN ICs

  

  Gallium Nitride (GaN)-based electronic devices switch faster and consume less energy than classic silicon-based devices. With GaN, >99% energy efficiency is achievable, enabling a new generation of compact and lighter power converters with reduced environmental impact. Historically, GaN transistors have always been difficult to operate. Every manufacturer suggests using additional components or even customised gate drivers to ensure the transistors operate safely and reliably. CGD introduced ICeGaN™: an industry-first enhancement-mode GaN transistor that can be operated like a Silicon MOSFET without the need for special gate drivers, driving circuitry, or unique gate voltage clamping mechanisms. Without the need for pairing GaN with Si MOSFETs in Cascode or Direct Drive configurations, CGD’s GaN is a single chip eMode GaN in a low profile/low inductance package. Benefits: High-efficiency and Reliability, Fast Speed and Ease of Use

• Hexas Technology Corporation

  Innovative transistor: FanFET

  

  FanFET is an innovative, infrastructural device in the semiconductor industry. The 3D structure of FanFET has the characteristics of vertical current and stackable multi-layer and the fan-shaped form is beneficial to adjust the area ratio between the active area and the isolation. Furthermore, FanFET technology only uses DUV lithographic equipment to make the alignment and transfer of critical patterns clear. The application of FanFET is not only for non-volatile 3D-NAND flash memory, but also for DRAM development and production. The feature size of FanFET 3D-NAND Flash is 2F2. In the node technology of 20 nm, it can be used as a deck stacks of more than 200 layers based on 64 or 96 layers, and can meet the circuit design of various multi-level cells and reliability requirements of the product. As a result, the density of FanFET 3D-NAND Flash is about 2 times that of GAA 3D-NAND Flash. The feature size of FanFET DRAM is 3.5F2~5 F2. Within the node technology of 1x nm to below 1a nm, the minimum tolerance of size and alignment of capacitor can completely improve the density of DRAM based on the demand for capacitance and refresh conditions. Therefore, the density of FanFET DRAM is about 15% to 30% higher than that of buried WL RCAT DRAM. Therefore, FanFET technology can be applied to commodity products of 3D-NAND flash, DRAM, and more advanced technologies such as Tera-scale 3D-NAND flash memory chips, high bandwidth memory (HBM) of high speed and low power, and high performance chips in-memory computing.

• Leadtrend Technology Corporation

  Efficiency Tracking Method of a Controller Applied to a Flyback Power Converter

  

  In many power converter topologies available today, the flyback is the most commonly used topology. flyback topology design offers great advantages for many applications. Base on it the Leadtrend successfully developed smart Efficiency tracking method for flyback topology of power converter. An efficiency tracking method of a controller applied to a flyback power converter includes before the controller soft starts, an original frequency variation curve setting voltage generated by the controller outputting an original frequency variation curve setting detection current to an original frequency variation curve setting detection resistor determining a frequency variation curve of the flyback power converter, and utilizing adjustment of resistance of the original frequency variation curve setting detection resistor to achieve efficiency optimization. Therefore, the controller controls an output voltage of the flyback power converter and tracks a maximum power point of the flyback power converter according to the efficiency tracking method to achieve efficiency optimization. The controller controls the output voltage of the operation of the flyback power converter according to the efficiency tracking method, and tracks the flyback power supply the maximum power of the converter to achieve efficiency optimization purposes. Therefore, compared with the prior art, because the present invention doesn’t adjust the primary side current detection resistor of the flyback power converter, the efficiency tracking method provided by the present invention is used in the flyback power converter when the secondary side outputs different charging conditions, the flyback power converter can still be maximized output power of the secondary side. The Leadtrend technology uses a green hybrid model to improve system efficiency to assist in the implementation of ESG, the smart efficiency tracking method is used to optimize the efficiency, the system can obtain the best conduction and switching loss. Take the 65W system as an example: under the condition of input voltage 230Vac & system load 5V/10W, the efficiency will be improved to +10.92% compared with the original system.

• Molex

  Accelerometer-based Road Noise Cancelling (RNC) sensor

  

  January 2021, Molex announced its accelerometer-based Road Noise Cancelling (RNC) sensor, the first product in a new family of automotive ANC sensors. New sensors, the result of years of collaborative effort with some of the industry’s leading players. Including, Bose, the high-end audio equipment manufacturer, Analog Device and Silentium. These collaborations have seen the integration Molex’s automotive Active Noise Cancellation (ANC) accelerometer-based sensors with Bose’s QuietComfort™ Road Noise Control technology for industry-leading performance and quieter, more enjoyable driving. The family of ANC accelerometer and microphone sensors use Analog Devices’ Automotive Audio Bus® (A2B) technology to ensure delivery of high-fidelity audio while significantly reducing cabling complexity, costs and weight and the sensors have been tested and validated with Silentium’s “Active Acoustics” software, which removes up to 90% of unwanted noises. Advancements in the electronics industry have enabled ANC technology, more commonly associated with high-end headphones, to transform how car manufacturers address road-based noises. Instead of installing expensive and heavy sound-absorbing materials to insulate car interiors from excessive road noise, ANC sensors are designed to be installed on a car’s chassis for more accurate and efficient results. Devices mounted to wheel wells and car frames, however, must be built to withstand the harshest conditions. Molex’s noise cancellation sensors capture sound and vibration energy from the wheels through the suspension into the chassis early for optimal cancellation timing, at a lower cost than other noise cancellation systems. • Daisy-chained sensors eliminate need for heavier materials • Less time between sensor receiving vibrations and sending signals to the module • IP6K9K enclosure protects sensors from harsh automotive environments • 50% space savings are achieved with the Molex Sealed Mini50 Connector interface In 2020, Molex received its first production order for an initial run of approximately 250,000 sensors to accommodate one of Bose’s first QuietComfort™ RNC customers. Molex’s global manufacturing footprint ramped sensor production as volumes scaled after the January 2021, launch of the accelerometer-based Road Noise Cancelling (RNC) sensor, the first product in a new family of Molex automotive ANC sensors.

• NXP Semiconductors

  software-defined vehicles: S32Z and S32E Real-Time Processors

  

  The S32Z and S32E real-time processors feature Arm® Cortex®-R52 split-lock processors for multi-tenant software integration plus lockstep Arm Cortex-M33 processors for system management, combining multi-core, real-time processing with core-to-pin hardware virtualization, DSP/ML processing, communications acceleration and Gigabit Ethernet switch with hardware security and ISO 26262 ASIL D safety. The S32Z processors are ideal for safety processing and domain and zonal control, while the S32E processors are ideal for electric vehicle (xEV) control and smart actuation. The software-compatible S32Z and S32E processors help enable software-defined vehicles, reduce software integration complexity and enhance security and safety. The S32Z and S32E processors are part of the NXP S32 Platform and are supported by a comprehensive third-party ecosystem and feature a minimum of 15 years of product longevity.

• NXP Semiconductors

  Ultra-Fine Motion Detection:Trimension SR160

  

  Industry’s first single-chip solution to combine ultra-wideband (UWB) radar and fine ranging capabilities to enable high motion sensitivity for presence detection, vital signs monitoring and gesture recognition. NXP® Semiconductors has announced a further expansion of its TrimensionTM portfolio with the industry’s first single-chip solution to combine both UWB radar and fine ranging capabilities. The integration of UWB radar enables devices to sense their environment, as well as range to other UWB-enabled devices. This makes it easier and more cost-effective to bring motion sensitivity, including presence detection, vital signs monitoring and gesture recognition, to mobile, Internet of Things (IoT) and automotive applications. Ultra-fine motion detection enabled by UWB radar can help advance safety, as well as convenience, in both the smart home and automotive markets. For example, a smart baby monitor with UWB radar could detect a sleeping baby’s breathing and send parents an alert if patterns change. In the automotive market, the technology can be used to help protect against hot car tragedies, a problem that is being addressed by NCAP guidelines and the U.S. Hot Car Act, which require that safety alerts be sent when a child is left in the backseat.

• proteanTecs

  Universal Chip Telemetry™ technology

  

  proteanTecs has developed health and performance monitoring solutions for advanced electronics, enabling visibility from within. The company provides deep data based on Universal Chip Telemetry™ (UCT), to uncover insights in test and in mission. Our cloud-based analytics platform applies machine learning algorithms to measurements extracted from on-chip UCT Agents (monitoring IPs), strategically placed during design to provide a high coverage, high resolution picture of the chip’s behavior, design sensitivities and marginalities. Users gain insights and alerts allowing them to take immediate action to maximize profit, ensure supply and improve power, performance, quality and reliability - all while reducing costs. During product bring-up and volume testing, chip and system vendors can reduce DPPM by 10x, optimize power-performance per application, improve performance yields, optimize and track reliability margins and significantly shorten TTM. Once deployed in the field, service providers can be alerted on faults before failures, lower maintenance costs, optimize system performance, reduce RMAs, optimize fleet management and extend product lifetime.

• SINTRONES TECHNOLOGY CORP.

  Solution of EV Fleet Management

  SINTRONES' "Solution of EV Fleet Management" uses using ultra-mini fanless car computer equipped with an Intel® Celeron processor, which provides robust connectivity. And users could install those modules such as 5G, LTE, GPS, and Wi-Fi/Bluetooth in the system according to their needs. The compact body design can Easily fit into minimal car room space. 9V - 60V wide-voltage input also has intelligent vehicle power ignition and wireless remote control functions for various vehicles; this system can operate in extreme weather, and driving conditions from -30 ~ 60ºC Longhour working are uniquely designed for fleet management applications. And it is equipped with a 7-inch high-resolution and high-brightness display screen. Only one ALL-IN-ONE signal line is needed to integrate multiple functions such as power supply, video output, audio input and output, and multi-touch functions, significantly reducing the cost of wiring and maintenance.

• Solomon Systech Limited

  Active Matrix EPD display driver with controller for Color Electrophoretic displays

  

  This development is targeting a Driver IC which able to drive TFT with independently control of multiple color pigments specifically for AMEPD displays which associated technological challenges by embedded a single ship with High Voltage >40V, power IC and timing controller for source and gate outputs. The product development requires a wide range of technical capabilities from System architecture, through analogue and digital design with focus on nano-technology and low power design. Color display for electronic shelf labels (ESL) has become popular among retailers and is becoming a technology trend to replace the paper tag. In April, 2021, EInk introduced the newest color bistable technology, E Ink Spectra™ 3100. This new four-particle electronic ink is a major step forward in the technology, and incorporates retailer’s requests for additional color functionality to highlight something and can aid immensely in their marketing efforts, by utilizing black, white, red and yellow particles. The unique temperature sensor devices allow user to monitor the temperature range from -25 oC to 50oC in order to optimize the display performance under different conditions. Besides, the partial display update feature which minimize the power consumption usage to 20% only when comparing to traditional full display update. Power consumption saving is the key for ESL which sustain for over 5 years life cycle without battery replacement. It can help retailers improve the efficiency of energy use, reduce overall energy consumption, and reduce environmental resource consumption from product promotion, inventory control and business operations. The ESL ultimately aim to inform consumers about the impact their purchases have on greenhouse gas (GHG) emissions. The European authorities are now working to add the “greenhouse factor” to the criteria for purchasing consumer goods about their environmental impact, so, a power saving partial display update is benefit to the Carbon and environmental labelling.

• Vayyar

  Centipede C

  

  Vayyar's automotive-grade Centipede C is the world’s first multi-range and multifunctional RFIC, covering a distance of 0-300m. Designed primarily for use in the automotive industry, it provides 4D imaging radar sensing to passenger cars, trucks, and motorcycles, offering exceptional accuracy that enables a wide range of lifesaving applications. The highly integrated offering eliminates the need for external processors, supports an ultra-wide and simultaneously gathers high-resolution data on multiple static and moving targets. Centipede C is the driving force behind dozens of safety and AV features. In low-speed scenarios such as parking lots, Centipede C’s uSRR and SRR sensing supports advanced parking assistance, detecting and tracking pedestrians, other vehicles, and stationary obstacles. Its MRR and LRR capabilities facilitate ADAS and autonomy applications including Lane Change Assist (LCA), Adaptive Cruise Control (ACC), Blind Spot Detection (BSD), Collision Warnings (fCW/rCW), Cross Traffic Alerting (CTA) and Autonomous Emergency Braking (AEB). The solution has the highest antenna count of any comparable offering – four times as many as its closest rival. It detects and tracks an unlimited number of static and dynamic targets, while other solutions track only several dozen, at best. Vayyar’s RoC generates rich 4D imaging for complete target classification, whereas other offerings rely on 2D Doppler imaging. At 170 degrees, the Vayyar chip’s field of view is wider than alternative solutions, while its target separation of just 1-2 degrees is superior to other radars which are limited to around 7 degrees. The offering replaces multiple costly vehicle sensors and reduces costs, complexity, hardware, software, power consumption, wiring and integration efforts.

• Wolfspeed Taiwan Limited

  Wolfspeed 650V SiC MOSFETs and Diodes: Proven performance built to support future technological innovations

  

  Wolfspeed’s new line of 650V SiC MOSFETS, which incorporate the latest third-generation C3M silicon carbide (SiC) technology, join its established family of industry-leading sixth-generation C6D Schottky diodes, to deliver today’s design engineer exceptional performance, reliability, and efficiency. Wolfspeed Silicon Carbide wide-bandgap semiconductors outperform conventional silicon (Si) components and set new standards for efficiency and reliability in application areas across several industry verticals, including automotive and transportation, industrial, renewable energy, test and measurement, aerospace, and more. Compared to traditional materials like silicon and even gallium nitride (GaN), Silicon Carbide has higher thermal conductivity and significantly lower losses. And while other materials must scale more quickly to handle higher voltages (leading to increased size and costs), Silicon Carbide is the epitome of “doing more with less” — keeping size, weight, and costs down. Silicon Carbide also offers avalanche ruggedness to avoid catastrophic failures and maintain its high reliability even in overstress conditions. Wolfspeed’s 650V SiC MOSFETs and Schottky diodes are the result of years of research and development into building the highest-performing Silicon Carbide semiconductors in the industry. Wolfspeed Silicon Carbide products enable the lowest conduction losses in the industry and provide fast switching speeds with low losses that reduce the size of external components.

• Computing in memory

• Co-packaged Optics

• 5G/ORAN

• GAA FET

• LE Audio

• Matter

• Micro LED

• PCIe 6.0

• Quantum Computing

• tinyML

• USB 4.0

• WBG Semiconductor

• Wi-Fi 6E/7

• Color ePaper

• Digital Transformation

• Edge Computing/AI

• Fusion Power

• Heterogeneous Integration

• Hydrogenic Energy

• Metaverse

• Popularization of EVs

• Post-covid19 scenarios/New Normal

• Universal charging port for smartphones

*候選公司排名不分先後