• Andes Technology

  

  Main advantages： In 2020, although the COVID-19 pandemic had a severe impact on the global economy, Andes Technology still made significant advances and achievements in the development of RISC-V. As a leading supplier of RISC-V processors and world-class creator/maintainer of RISC-V related development environments, Andes will continue to form alliances with related industries, expand ecosystems and lead the trend of the next generation RISC-V technology. Global Presence • Andes Technology stepped up to the Founding Premier Member of RISC-V International. • President Frankwell Lin was elected as Board Director of RISC-V International. • Dr. Charlie Su, CTO and EVP, was elected as Vice Chair of RISC-V International Technical Steering Committee. • Florian Wohlrab, Sales Director of Europe and Japan, became one of the first RISC-V Ambassadors. Innovative Products • After releasing the first RISC-V processor supporting the DSP extended instruction set in 2019, Andes launched the first RISC-V vector processor in 2020. • Andes announced new RISC-V AndesCore™ processors: superscalar 45-series with multi-core support and 27-series with level-2 cache controller. • Software: The LLVM tool chain was also launched to support RISC-V vector extension and AI applications. AndeClarity™ Vector Pipeline Analyzer is the first and the best tool in the RISC-V industry to optimize the processor pipeline with visual interface. Other achievements include the enhancements of Linux, porting AndesCore to a variety of RTOS and keeping the leading position of RISC-V commercial tool chain in both performance and code size. New Milestones • In December 2020, Andes’ monthly revenue exceeded USD$ 3.5 million (NTD$ 100 million). • Over 200 commercial licensees, geographically distributed in Taiwan, North America, China, South Korea, Japan and Europe。 • The cumulative number of IP license contracts exceeded 400. In 2020, design wins included many world-leading companies, such as MediaTek, Renesas and SK Telecom. • Royalty revenue grew by nearly 50%. • Nearly 20,000 installations of AndeSight™ IDE. • Annual shipment of SoCs embedded with Andes CPU cores surpassed 2 billion in 2020. • The top three rankings of revenue by regions are Taiwan (43%), the United States (26%) and China (25%) in 2020. • The applications of Andes’ licensees are diversified. In the first three quarters of 2020, the top five customer applications are Video & Audio (24%), MCU (17%), IoT (14%), AI (10%), and Sensing (7%). Awards & Recognition • Andes Technology was ranked among “100 Fastest-Growing Companies” in 2020 by CommonWealth Magazine, one of the most influential magazines in Taiwan. • President Frankwell Lin won ERSO Award, a high honor in the semiconductor industry in Taiwan, because of his contribution to developing Taiwan’s original embedded CPU architecture and licensing business model, making Andes becoming the first commercial CPU IP supplier in Asia. • President Frankwell Lin was invited as the award presenter at the GSA (Global Semiconductor Alliance) Award Ceremony. • The first RISC-V vector processor core, AndesCore NX27V, won “Hsinchu Science Park Innovative Product Award” and “Outstanding Product Performance of the Year” of ASPENCORE World Electronics Achievement Awards. • Dr. Chuanhau Chang, Assistant Vice President of Architecture R&D Division, won RISC-V Top Technical Contributor Awards in recognition of his contribution to RISC-V Architecture. • Andes passed DUNS Registered™ Certificate, demonstrating its credibility as a commercial entity registered in the world’s largest commercial database. Strategic Partnership • More than 145 ecosystem partners. • Development environment: IAR supports RISC-V P Extension which is contributed to the community by Andes. Other partners supporting AndesCore and its development environments include Cyberon, Imperas, Lauterbach, Menta, Open AI Lab, SEGGER, UltraSoC, etc. • Security partners including Hex-Five, PUFsecurity, Rambus, Secure-IC, Silex Insight, Tiempo, and Veridify have worked with Andes from different aspects to strengthen the security and protection mechanism of RISC-V AndesCore. • As for AI applications, Andes collaborated with Deeplite to launch a faster, smaller ,and more accurate AI model optimizer. Also, Andes has made remarkable progress in its neural network computing library (Andes NN Library). Event Presence • At 2020 RISC-V Summit, Andes presented six talks covering the hottest RISC-V topics, including AndesCore™, Vector Extension, AndesClarity™ and IOPMP. • Andes hosted more than 40 RISC-V webinars and meetups to share new market trends and the latest technologies with more than 3,000 RISC-V enthusiasts all over the world. • Andes joined more than 50 major industry events around the world to promote and reach customers despite the pandemic. The events included Embedded World, RISC-V Meetup (Hsinchu, Munich, Toronto), TSMC Online Technology Symposium (China, EU, Japan, Taiwan, and US), EDN Forum, IP SoC Day Online (Shanghai, Grenoble), DAC (San Francisco), VLSI-CAD, D-Forum 2020, VLSI -DAT , RISC-V Global Forum, RISC-V Tokyo Day, RISC-V Vietnam Day, RISC-V Taipei Day , Linley Fall Processor Conference, EEPW IoT Developers Live Chat, ICCAD 2020, GSA Award Dinner, TSES Hsinchu, RISC-V 10th Anniversary, Hsinchu Science Park 40th Anniversary Celebration Ceremony, and RISC-V Summit. Recommended Reasons： Focus on CPU IP The strategic technology of CPU IP is indispensable in SoC design. Andes Technology has been devoted to developing CPU IP technology for over 16 years and it is one of the few companies in the world that provides commercial CPU IP and has customers entering mass production constantly. The annual shipment of SoCs embedded with Andes CPU cores surpassed 2 billion in 2020 and the cumulative shipments hit the milestone of more than 7 billion. Andes was selected as EETimes' Silicon 60 Hot Startups to Watch in 2012 and received TSMC OIP Award “Partner of the Year” for New IP in 2015. In 2020, Andes was awarded “Most Outstanding Embedded Processor IP Supplier” by AI Global Media. Also, its NX27V vector processor IP of AndesCore™ V5 (RISC-V) series was awarded “Hsinchu Science Park Innovative Product Award” at 40th anniversary of the Hsinchu Science Park and “Outstanding Product Performance of the Year” by EETimes (Aspencore Group) at World Electronics Achievement Awards in 2020. Comprehensive Product Lines Andes keeps driving innovation and launches comprehensive RISC-V CPU IP series, including entry-level 32-bit N22, mid-range N25F/D25F/A25/A27 and 64-bit NX25F/AX25/AX27 and high-end multicore A(X)25MP, vector processor NX27V and the latest superscalar 45-series. Its world-leading RISC-V commercial processor cores with DSP instruction set and vector extension become the best solutions for emerging applications such as 5G, AI/ML, ADAS, AR/VR, blockchain, cloud computing, data center, IoT, storage, security and wireless devices. Quality Sales and Service Andes provides quality sales and technical service by establishing branches in Taiwan, USA and China as well as having professional agents in major IC design regions including Korea, Europe, Israel for sales and customer services. Its customers include world-class companies such as MediaTek and Renesas. The diverse applications range from audio, Bluetooth, gaming, GPS to ML, MCU, sensor fusion, SSD controller, touch controller, USB 3.0 storage, voice recognition, Wi-Fi, wireless charging, etc. Active Role in RISC-V Strategic Global Planning Andes is the Founding Premier Member of RISC-V International Association (formerly known as RISC-V Foundation). Frankwell Lin, CEO of Andes, is the Board Director of RISC-V International. Charlie Su, President and CTO of Andes, is Vice Chair of RISC-V International Technical Steering Committee. Every year Andes hosts events including RISC-V CON, Meetup in Taiwan, China and USA as well as over 30 Chinese and English webinars which attracts audience around the world with more than 10 thousand views online. Andes also participates major industry exhibitions, such as Embedded World, DAC, TSMC Symposium and promotes them through social channels including Facebook, Twitter, LinkedIn, WeChat, YouTube, gaining exposure for RISC-V and the brand of Andes. Certification Test Andes Certified Engineer Test (ACET™) Program, hosted by Andes since 2013, issues nearly 200 certificates to engineers who pass the test every year as a reference of recommendation for recruitment in the industry. Fast Growing Business In ihe 100 Fastest Growing Companies of 2020 announced by CommonWealth Magazine in August, 2020, Andes is ranked 35th. Emphasis on Corporate Responsibility With emphasis of corporate responsibility and sustainable values, Andes has devoted itself to developing low power/high performance green power-saving CPU in order to increase power efficiency and protect the environment. For industry–academia collaboration, Andes has provided AndesCore™ to universities around the world for courses, research projects and established joint laboratories with many universities. The total number of contracts with universities (mainly EE and CS departments in Taiwan, China and US) is over 120 by September, 2020. Andes has also donated AndesCore™ and peripheral development platforms valued at tens of millions to numerous prestigious universities including NTU, NTHU, NCTU, NCKU in Taiwan. By establishing long term industry–academia collaboration, Andes aims to cultivate talents, communicate with higher education institutions and fulfill corporate responsibility.

• Ansys

  

  Main advantages： Ansys Receives TSMC OIP Ecosystem Forum Customers' Choice Award for 5G Millimeter Wave Chip Analysis Solution Paper/Ansys Collaborates with Keysight Technologies to Help Engineers Tackle Significant System Design Challenges with Best-In-Class Digital Workflow/Ansys Multiphysics Solutions Certified By TSMC for 3D-IC Packaging Technologies Recommended Reasons： If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you’ve used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination.

• Arm

  

  Main advantages： Arm technology is at the heart of a computing and data revolution for wide range of application segment. For intelligent connected vehicles, Arm believes these new technologies address a key trend in computing, the shift towards autonomous decision making. By deep collaboration with car OEM, tier-1 and large ecosystem partners, we identified two of key IP requirements for next generation automotive application: • Scalable compute is needed to address the range of processing capability for differing workloads in a power efficient manner. • Safety, combined with security and real-time response, is absolutely critical to avoid the risk of damage, or potentially fatal outcomes, if systems fail or are cyber-compromised. In the past year, Arm announced a new suite of CPU, GPU and ISP IP technology that delivers these building blocks. Cortex-A78AE is our highest performance CPU with safety, and includes a NEW Hybrid Mode safety capability. Mali-G78AE is our latest high performance GPU and our first GPU to address safety, and integrates a new Flexible partitioning feature. And Mali-C71AE is an important evolution of our Mali-C71 Image Signal Processor, bringing Safety Enablement to vision applications in autonomous systems. Used those fundamental building blocks, we will open up a huge range of new possibilities of functional utility and human safety. NXP, Renesas, Nvidia, STMicroelectronics and Samsung announced they used Arm automotive grade CPU, GPU and NPU. We believe that will more design-in in 2021. Recommended Reasons： Arm has long history on automotive area. Arm CPU continuously supports automotive market since 1996, the top 15 automotive chip makers license Arm IP, more than 60% IVI/ADS systems are based on Arm. The reason why lots of partners are using Arm’s solutions is because Arm continues to develop scalability, efficiency, high performance solutions for the industrials. Arm is also investing to enable the autonomous software ecosystem to leverage the capabilities of this new technology and speed development. Arm believes that autonomy will become the predominant workload of the future and transform industries of automotive and industrial – and we’re really excited to work with our ecosystem of partners to make this a reality. Arm is committed to the future of autonomous systems, and we will be further augmenting and expanding our technology offerings to enable this compute transformation.

• Bosch Taiwan

  

  Main advantages： Bosch connects the systems and services inside and outside vehicles, transforming them into intelligent mobility solutions. In modern cars, vehicle computers the new all-rounders of automotive electronics, incorporating ever more functions of individual control units into central, highly powerful electronic modules. Bosch vehicle computers have been controlling functions such as driver assistance systems and motion in production vehicles. To fulfill the demand, Bosch established the new Cross-Domain Computing Solutions division to bring its hardware and software engineering for vehicle computers, sensors, and control units for all vehicle domains together. To cater more to the transformation into software-defined vehicles, Bosch teamed up with Microsoft to develop software-defined vehicle platform for seamless integration between cars and cloud. At Bosch, using technology to improve people’s lives is at the core of our strategic imperative “Invented for life.” A vehicle drop-off and collection service saves time and avoids long walks to the car: once parking garages are equipped with the appropriate infrastructure and national laws permit AVP, customers will be able to enjoy driverless parking services. Bosch and Mercedes-Benz are paving the way for this with the world’s first infrastructure-based solution for SAE Level 4 automated valet parking in real-life, mixed parking garage traffic. Uniform standards and interfaces ensure smooth communication between the vehicles and infrastructure technology. In the future, Bosch’s aim is to equip more and more parking garages with AVP infrastructure technology. When it comes to mobility, nothing matters more than safety. This is where Help Connect, Bosch’s connected emergency call solution comes in. In the event of an emergency, in a car, or on a motorcycle, or on an eBike, Help Connect accesses the sensors in the user’s smartphone and other connected devices, uses an intelligent crash algorithm to automatically detect accidents, and further alerts the emergency services via the Help Connect emergency call center and immediately directs them to the scene of the accident. This saves time, and potentially also lives. Two apps are now available for cyclists and motorcyclists and thus for several hundred thousand users: the COBI.Bike app from Bosch eBike Systems and the calimoto app for motorcycle navigation. Recommended Reasons： Bosch customers and partners benefit not only from outstanding technologies but also from Bosch’s special strengths and competencies, like a deep understanding of systems and an extensive knowledge of the market across multiple sectors. This is complemented by Bosch’s unique combination of automotive know-how as well as expertise on the internet of things. These competencies make Bosch the preferred partner for connected mobility.

• Macronix International Co., Ltd.

  

  Main advantages： Macronix has made huge strides in the automotive market since entering it in 2009 -- building it market share, broadening its customer base, and developing automaker OEM relationships, and penetrating the full automotive ecosystem. Macronix has achieved certification in key automotive-industry standards: AEC-Q100, TS16949, ISO26262. The company has also passed all customer and OEM audits. This past year, Macronix passed the 350,000,000 mark of AEC-Q100-compliant products shipped to customers, marking it #2 in the automotive NOR market. Recommended Reasons： With the above achievements, industry recognition of its products' quality, strong relationship with chipset vendors, 10,000+ design-in projects underway, and a broad product portfolio, Macronix is on track to become the #1 supplier of NOR flash to the automotive market by 2023. Additionally, the company has more than 8,000 patents, and many can apply to developing flash memory solutions for the automotive market.

• Murata Manufacturing

  

  To contribute with software as well as with hardware, Murata has been developing communication middleware (WAVE Short Message Protocol, or WSMP) , which will be compact software that will be able to process a few hundred to a few thousand messages per second stably using limited CPU resources. We can integrate our support of device drivers that have many proven records into this middleware to provide total solutions, which include providing highly reliable hardware and software, antenna technical support, and various kinds of authentication support.

• NXP Semiconductors

  

  Main advantages： Known as Worldwide No.1 component suppliers, Murata offers total solutions including V2X module, discrete L/C/filter passive components for our outstanding Tier0/1 customers ex:BMW,Benz, BYD, Desay...etc. We'll aim for optimum solution for the realization of safe driving assistance systems continuously. Recommended Reasons： Key innovator in the area.

• proteanTecs

  

  Recommended Reasons： We live in a world where we depend on car electronics to be available 24/7 and operate with zero in-mission failures. We put our lives in the hands of ECUs, ADAS and E/E systems every day. But how can we guarantee these systems’ reliability, safety, and functionality? How can we track their health at any given stage, under extreme conditions, to make sure they last the full extent of their expected lifetime? proteanTecs has developed health and performance monitoring solutions for advanced electronics, enabling visibility from within. The company provides deep data based on Universal Chip Telemetry™ (UCT), to uncover insights at test and in mission. Our cloud-based analytics platform applies machine learning algorithms to measurements extracted from on-chip monitoring IPs, strategically placed during design to provide a high coverage, high resolution picture of the system’s quality, reliability and performance throughout its lifecycle. Users along the value chain gain insights and alerts, based on common, correlated and predictive data - allowing them to take immediate action to maximize profit, ensure supply and improve safety and reliability - all while reducing costs. Chip manufacturers and Tier 1’s can reduce DPPM by 10X, accelerate TTM, optimize system performance, improve performance yields and optimize reliability margins. Once deployed in the field, OEMs can be alerted on faults before failures for predictive safety and maintenance, increase system availability, perform Over-The-Air updates, and optimize fleet management, all in mission-mode without disruption to normal operation. proteanTecs already serves leading electronics vendors across multiple industries, and our solutions are silicon proven at high volumes in single-digit process technologies.

• Silicon Motion, Inc.

  

  Main advantages： Silicon Motion provides reliable and high performance automotive grade storage solutions, including controllers and Ferri single-chip solutions (FerriSSD, Ferri-eMMC and Ferri-UFS) for in-vehicle infotainment, navigator, ADAS, DVR, and autonomous driving applications. Silicon Motion’s automotive storage solutions support full end-to-end data path protection to guarantee the data integrity. Equipped with Silicon Motion’s proprietary NANDXtend® ECC technology by using an LDPC code and a Group page RAID algorithm, Silicon Motion’s automotive storage solutions extend the service life of SSD. Now offered with built-in SR-IOV capability, a single FerriSSD device or a SSD module with SMI controller in a virtualized architecture can support multiple ADAS functions and the automotive manufacturers can benefit from cost saving, high performance and reduced host CPU utilization. Recommended Reasons： Over the past 10 years, we have witnessed serious transition in the automotive technology, from infotainment, ADAS, connection to autonomous. The automotive storage solutions transitioned from RAW NAND, SD, eMMC to UFS. In the near future, PCIe SSDs with native SR-IOV support will become the mainstream. The storage needs for the high-speed in-vehicle computing systems include performance, data correction, reliability and wide temperate range. Silicon Motion’s automotive storage solutions satisfy the strict requirements of automotive system designs. With SR-IOV support, full end-to-end data path protection and extended temperature support, the SMI automotive storage solutions provide high reliability and data integrity. Silicon Motion offers flexible longevity support to guarantee long-term availability. Silicon Motion’s automotive storage solutions are qualified to AEC-Q100 and ASPICE.

• AOS (Alpha & Omega Semiconductor)

  

  Main advantages: Released 2 generation of SiC MOSFET and SBD products in the market, and specific to support AEC-Q101 qualified to meet essential requirements of automotive market. In addition, the AOS is the IDM company, we have our own 8" & 12" wafer houses for silicon device and backend houses for industrial standard packages, furthermore, all factories have passed the IATF16949 to provide auto-grade product portfolio fulfill market needs. Recommended Reasons： AOS provide total power discrete solutions across the board, we empower your design to provide best-in-class solutions for applications from consumer, commercial, industrial and automotive. Our solution is not only the product features, but also the design service and failure analysis, we treat customers as our family to provide best support in the world.

• Bourns Inc.

  

  Main advantages: Acquired a market leader in the field of customized magnetic components and ferrite cores - Kaschke The Company’s commitment to quality is demonstrated in its manufacturing operations, which meet QS 9000, ISO 9001/2000 and TS 16949 certifications. Bourns has received awards from prominent companies such as Arrow, Mast Distributors, TTI and many others, for its excellence as a supplier. Recommended Reasons： Customers choose Bourns for our 70-year history of trimming potentiometer technology innovation and broad range of physical configurations; rugged enough to withstand today's manufacturing environments.

• Infineon Technologies

  

  Main advantages: At Infineon, we have a long and proven track record in the delivery of innovations at the heart of the emerging electric infrastructure. Building on our extensive and continued research, an expert understanding of design needs at system level and an exceptionally broad product portfolio serving a wide customer base, we are firmly committed to building more sustainability into the entire mobility landscape. Last 12 Months Global Success: - Supplied 8 out of 10 top selling NEVs - Shipped 5.8 M modules & 48 M discrete IGBTs (April 2018 – April 2019) - Supported >120 vehicle projects with Infineon HybridPACKTM high-power modules Recommended Reasons： - Ranked Top 1 position in Power Market World-wide - Outstanding track record in technical performance, quality and delivery reliability of our products

• NXP Semiconductors

  

  Main advantages: The global automotive sector is responding to these looming emissions deadlines, with all major manufacturers, announcing massive investments in EV development programs. The ongoing quest to improve vehicle efficiency and range is driving significant research and development in the propulsion control domain. To integrate the power of technology, Vehicle manufacturers require access to specialist knowledge backed by in-depth resources and NXP Semiconductors are one of a select number of organizations in the ecosystem with this capability. A global leader in auto microprocessors, ADAS, radar, secure car access, infotainment and in-vehicle networking, the NXP comprehensive solution portfolio enables our customers to accelerate the design of their next generation automotive designs, enabling rapid time to market and scalability. Recommended Reasons： Key innovator in the area

• ROHM CO., LTD.

  

  Main advantages： ROHM is an industry leader in ICs, discrete components and module products, utilizing the latest in semiconductor technology. ROHM's proprietary production system, which includes some of the most advanced automation technology, is a major factor in keeping it at the forefront of the electronic component manufacturing industry. In addition to its development of electronic components, ROHM has also developed its own production system so that it can focus on specific aspects of customized product development. ROHM employs highly skilled engineers with expertise in all aspects of design, development and production. This allows ROHM the flexibility to take on a wide range of applications and projects and the capability to serve valuable clients in the automotive, telecommunication and computer sectors, as well as consumer OEMs. Recommended Reasons： Since it was founded in 1954, ROHM has consistently pursued a guarantee rate one order of magnitude higher than the industry standard with the motto of ‘Quality First’, through comprehensive quality control and reliability management. By 1964, we already reached a defect rate for resistors of 1 in 1,000,000, compared to 1 in 100,000 with other manufacturers. Since then, we have been striving to improve the guarantee rate ahead of the industry, such as by implementing mechanization and semi-automation in all processes. ROHM has no company emblems or anthems. All thoughts and efforts are put towards achieving our corporate objective. Perhaps its greatest feature is that it is a ‘concrete living phrase’ that everyone can understand. Throughout the years, ROHM has experienced many events that underscore the importance of quality.And in order to contribute to the advancement of culture, we have established a climate that places an importance not only on products, but the people who support business activities as well. Living words generated from these experiences will become one of the pillars of our company, where they will continue to take root and maybe even passed on beyond our nation and maybe even our era.

• Texas Instruments

  

  Main advantages： Whatever your automotive design challenge, TI analog and embedded processing products, design resources, and easy sourcing and purchasing help you deliver innovation faster and prepare for the road ahead. Recently, TI announced a new wireless BMS solution that empowers automakers to reduce the complexity of their designs, improve reliability and reduce vehicle weight to extend driving range. To highlight, the new BQ79616-Q1 is a high-accuracy battery monitor and balancer that helps automotive manufacturers improve the performance of wired and wireless battery management systems in hybrid and electric vehicles. The monitor enables engineers to diagnose battery failures in high-voltage systems in half the time while streamlining ADIL D certification for functional safety and extending vehicle driving range. Filtering system-level noise to accurately measure battery-cell voltage and temperature and reliably reporting this information to the MCU are key design challenges for automotive manufacturers. The BQ79616-Q1 addresses both of these challenges to help engineers achieve battery safety goals and maximize distance per charge in wired and wireless battery management systems. Recommended Reasons： Below shares why our new BQ79616-Q1 in the EV power IC solution can benefit your design and earn your vote. The BQ79616-Q1 battery monitor and balancer is the industry’s first to include a patented wake-up-at-fault feature. When paired with the BQ79600-Q1 SPI/UART communication interface, it enables total system shutdown when the vehicle is parked or turned off. This helps design engineers conserve battery power, improve cell balancing and support safety requirements. The BQ79616-Q1 is the first in a next-generation family of TI battery monitors and balancers to support high-accuracy monitoring for a broad spectrum of battery chemistries, including lithium-iron-phosphate (LiFePO4). This enables automotive manufacturers to more precisely measure battery state-of-charge and state-of-health, thereby reducing cost. TI’s new monitor and balancer meet component-level requirements of ISO 26262, supporting ASIL D compliance for voltage measurement, temperature measurement, and communication – dramatically reducing bill of materials (BOM) and software overhead. With the industry’s fastest time in diagnosing battery failures, 100 ms in 400-V systems, the BQ79616-Q1 enables greater system reliability and battery safety.

• Andes Technology

  

  Main advantages: In 2020, although the COVID-19 pandemic had a severe impact on the global economy, Andes Technology still made significant advances and achievements in the development of RISC-V. As a leading supplier of RISC-V processors and world-class creator/maintainer of RISC-V related development environments, Andes will continue to form alliances with related industries, expand ecosystems and lead the trend of the next generation RISC-V technology. Global Presence • Andes Technology stepped up to the Founding Premier Member of RISC-V International. • President Frankwell Lin was elected as Board Director of RISC-V International. • Dr. Charlie Su, CTO and EVP, was elected as Vice Chair of RISC-V International Technical Steering Committee. • Florian Wohlrab, Sales Director of Europe and Japan, became one of the first RISC-V Ambassadors. Innovative Products • After releasing the first RISC-V processor supporting the DSP extended instruction set in 2019, Andes launched the first RISC-V vector processor in 2020. • Andes announced new RISC-V AndesCore™ processors: superscalar 45-series with multi-core support and 27-series with level-2 cache controller. • Software: The LLVM tool chain was also launched to support RISC-V vector extension and AI applications. AndeClarity™ Vector Pipeline Analyzer is the first and the best tool in the RISC-V industry to optimize the processor pipeline with visual interface. Other achievements include the enhancements of Linux, porting AndesCore to a variety of RTOS and keeping the leading position of RISC-V commercial tool chain in both performance and code size. New Milestones • In December 2020, Andes’ monthly revenue exceeded USD$ 3.5 million (NTD$ 100 million). • Over 200 commercial licensees, geographically distributed in Taiwan, North America, China, South Korea, Japan and Europe。 • The cumulative number of IP license contracts exceeded 400. In 2020, design wins included many world-leading companies, such as MediaTek, Renesas and SK Telecom. • Royalty revenue grew by nearly 50%. • Nearly 20,000 installations of AndeSight™ IDE. • Annual shipment of SoCs embedded with Andes CPU cores surpassed 2 billion in 2020. • The top three rankings of revenue by regions are Taiwan (43%), the United States (26%) and China (25%) in 2020. • The applications of Andes’ licensees are diversified. In the first three quarters of 2020, the top five customer applications are Video & Audio (24%), MCU (17%), IoT (14%), AI (10%), and Sensing (7%). Awards & Recognition • Andes Technology was ranked among “100 Fastest-Growing Companies” in 2020 by CommonWealth Magazine, one of the most influential magazines in Taiwan. • President Frankwell Lin won ERSO Award, a high honor in the semiconductor industry in Taiwan, because of his contribution to developing Taiwan’s original embedded CPU architecture and licensing business model, making Andes becoming the first commercial CPU IP supplier in Asia. • President Frankwell Lin was invited as the award presenter at the GSA (Global Semiconductor Alliance) Award Ceremony. • The first RISC-V vector processor core, AndesCore NX27V, won “Hsinchu Science Park Innovative Product Award” and “Outstanding Product Performance of the Year” of ASPENCORE World Electronics Achievement Awards. • Dr. Chuanhau Chang, Assistant Vice President of Architecture R&D Division, won RISC-V Top Technical Contributor Awards in recognition of his contribution to RISC-V Architecture. • Andes passed DUNS Registered™ Certificate, demonstrating its credibility as a commercial entity registered in the world’s largest commercial database. Strategic Partnership • More than 145 ecosystem partners. • Development environment: IAR supports RISC-V P Extension which is contributed to the community by Andes. Other partners supporting AndesCore and its development environments include Cyberon, Imperas, Lauterbach, Menta, Open AI Lab, SEGGER, UltraSoC, etc. • Security partners including Hex-Five, PUFsecurity, Rambus, Secure-IC, Silex Insight, Tiempo, and Veridify have worked with Andes from different aspects to strengthen the security and protection mechanism of RISC-V AndesCore. • As for AI applications, Andes collaborated with Deeplite to launch a faster, smaller ,and more accurate AI model optimizer. Also, Andes has made remarkable progress in its neural network computing library (Andes NN Library). Event Presence • At 2020 RISC-V Summit, Andes presented six talks covering the hottest RISC-V topics, including AndesCore™, Vector Extension, AndesClarity™ and IOPMP. • Andes hosted more than 40 RISC-V webinars and meetups to share new market trends and the latest technologies with more than 3,000 RISC-V enthusiasts all over the world. • Andes joined more than 50 major industry events around the world to promote and reach customers despite the pandemic. The events included Embedded World, RISC-V Meetup (Hsinchu, Munich, Toronto), TSMC Online Technology Symposium (China, EU, Japan, Taiwan, and US), EDN Forum, IP SoC Day Online (Shanghai, Grenoble), DAC (San Francisco), VLSI-CAD, D-Forum 2020, VLSI -DAT , RISC-V Global Forum, RISC-V Tokyo Day, RISC-V Vietnam Day, RISC-V Taipei Day , Linley Fall Processor Conference, EEPW IoT Developers Live Chat, ICCAD 2020, GSA Award Dinner, TSES Hsinchu, RISC-V 10th Anniversary, Hsinchu Science Park 40th Anniversary Celebration Ceremony, and RISC-V Summit. Recommended Reasons： Focus on CPU IP The strategic technology of CPU IP is indispensable in SoC design. Andes Technology has been devoted to developing CPU IP technology for over 16 years and it is one of the few companies in the world that provides commercial CPU IP and has customers entering mass production constantly. The annual shipment of SoCs embedded with Andes CPU cores surpassed 2 billion in 2020 and the cumulative shipments hit the milestone of more than 7 billion. Andes was selected as EETimes' Silicon 60 Hot Startups to Watch in 2012 and received TSMC OIP Award “Partner of the Year” for New IP in 2015. In 2020, Andes was awarded “Most Outstanding Embedded Processor IP Supplier” by AI Global Media. Also, its NX27V vector processor IP of AndesCore™ V5 (RISC-V) series was awarded “Hsinchu Science Park Innovative Product Award” at 40th anniversary of the Hsinchu Science Park and “Outstanding Product Performance of the Year” by EETimes (Aspencore Group) at World Electronics Achievement Awards in 2020. Comprehensive Product Lines Andes keeps driving innovation and launches comprehensive RISC-V CPU IP series, including entry-level 32-bit N22, mid-range N25F/D25F/A25/A27 and 64-bit NX25F/AX25/AX27 and high-end multicore A(X)25MP, vector processor NX27V and the latest superscalar 45-series. Its world-leading RISC-V commercial processor cores with DSP instruction set and vector extension become the best solutions for emerging applications such as 5G, AI/ML, ADAS, AR/VR, blockchain, cloud computing, data center, IoT, storage, security and wireless devices. Quality Sales and Service Andes provides quality sales and technical service by establishing branches in Taiwan, USA and China as well as having professional agents in major IC design regions including Korea, Europe, Israel for sales and customer services. Its customers include world-class companies such as MediaTek and Renesas. The diverse applications range from audio, Bluetooth, gaming, GPS to ML, MCU, sensor fusion, SSD controller, touch controller, USB 3.0 storage, voice recognition, Wi-Fi, wireless charging, etc. Active Role in RISC-V Strategic Global Planning Andes is the Founding Premier Member of RISC-V International Association (formerly known as RISC-V Foundation). Frankwell Lin, CEO of Andes, is the Board Director of RISC-V International. Charlie Su, President and CTO of Andes, is Vice Chair of RISC-V International Technical Steering Committee. Every year Andes hosts events including RISC-V CON, Meetup in Taiwan, China and USA as well as over 30 Chinese and English webinars which attracts audience around the world with more than 10 thousand views online. Andes also participates major industry exhibitions, such as Embedded World, DAC, TSMC Symposium and promotes them through social channels including Facebook, Twitter, LinkedIn, WeChat, YouTube, gaining exposure for RISC-V and the brand of Andes. Certification Test Andes Certified Engineer Test (ACET™) Program, hosted by Andes since 2013, issues nearly 200 certificates to engineers who pass the test every year as a reference of recommendation for recruitment in the industry. Fast Growing Business In ihe 100 Fastest Growing Companies of 2020 announced by CommonWealth Magazine in August, 2020, Andes is ranked 35th. Emphasis on Corporate Responsibility With emphasis of corporate responsibility and sustainable values, Andes has devoted itself to developing low power/high performance green power-saving CPU in order to increase power efficiency and protect the environment. For industry–academia collaboration, Andes has provided AndesCore™ to universities around the world for courses, research projects and established joint laboratories with many universities. The total number of contracts with universities (mainly EE and CS departments in Taiwan, China and US) is over 120 by September, 2020. Andes has also donated AndesCore™ and peripheral development platforms valued at tens of millions to numerous prestigious universities including NTU, NTHU, NCTU, NCKU in Taiwan. By establishing long term industry–academia collaboration, Andes aims to cultivate talents, communicate with higher education institutions and fulfill corporate responsibility.

• Arm

  

  Main advantages： Arm has involved in embedded market for over 20 years and has built a comprehensive ecosystem. Our strengths are as follows: 1. Comprehensive ecosystem for all Cortex-M CPU from hardware architecture, software platform, toolchain, etc to provide a developer-friendly environment. 2. A series of 32 bit processor in a 8/16 bit footprint with ultra low power portfolio to address IoT market demand. 3. Addressing security concern with secure core, TrustZone and physical protection feature in IoT space. 4. Advanced ML enhancement with companion NPU processor for AIoT application. Arm launched Cortex-M55 and Ethos-U55 IP to extend the performance of Arm's ML portfolio for endpoint devices in 2020 and this low power endpoint AI solution has been widely adopted by many customers to assist for product innovation. Recommended Reasons： Navigating the IoT landscape can seem complex for companies looking to implement the next IoT idea. However, thanks to 30-years, 1,000+ partners and 180 billion chips of experience in providing IP and enabling software platforms, Arm can help make those big IoT ideas a reality and a success. 1. As we move to networks of a trillion devices, Arm provides everything it takes to help build for the future. 2. Easy access to an unparalleled range of processor designs which has made Arm the leading architecture for IoT and embedded devices. 3. Unrivaled efficient processing capability, including AI-enhanced endpoint intelligence, end-to-end security and scalable solutions. Development platforms and tools for software developers that support a huge range of workloads, devices and clouds, making it easier and more efficient to create future devices. 4. An ecosystem of over 300 software partners ready to help accelerate product journeys wherever compute happens. From the smallest, power-constrained endpoints to global compute platforms spanning the edge of the network, Arm and our global ecosystem of partners can meet all requirements.

• Infineon Technologies

  

  Main advantages: Infineon provides end-to-end systems for a connected, secured world–building on trusted, game-changing microcontrollers as well as wireless and security solutions. We lay stress on hardware-based security technologies to support the broadest application spectrum spanning consumer electronics, consumer and IoT devices, cloud security, IT equipment, home appliances, connected cars, credit and debit cards, electronic passports, ID cards and more. Infineon successively develops the discrete/ hardware security solution design into multiple connective applications and requirements based on OPTIGATM Trust family & OPTIGATM TPM portfolio. The Trust family reinforces device authentication, protects for data integrity, safety and validity, therefore, provides a full range of security protection for embedded verification, brand protection, and further security application requirements. Recommended Reasons： Infineon has more than 30 years of experience in the security field. According to ABI Research, Infineon has the worldwide largest market share in security IC (excluding NFC controller and NFC eSE). Infineon is at the forefront of computing, wireless connectivity and trusted technologies that are helping to securely connect the networked systems of today and tomorrow.

• Intel Corporation

  

  Main advantages： People's dependence on AI computing and the urgent need for low-latency networks make edge computing more important in the future. Intel processors with enhanced IoT capabilities including the 11th generation Intel® Core™ processor, Intel Atom® x6000E series, and Intel® Pentium® and Celeron® N and J series, integrate Edge Software Hub’s Edge Insights for Industrial and Intel® Distribution of OpenVINO™ toolkit, and leverage Intel® Safety Island to meet functional safety requirements. They are also built in with hardware-based security, providing a complete set of software and hardware solutions to help clients meet the edge computing needs in industrial sector, retail, transportation, healthcare and smart city applications. Recommended Reasons： Intel has invested in software and hardware development to lay a solid foundation for its business operation. It has also invested in the global ecosystem and cooperated with more than 1,200 partners to complete more than 15,000 customer deployments globally. In September 2020, Intel Taiwan also joined with 8 IoT computing partners, including AAEON, ADLINK, Advantech, Getac, iBASE, IEI, LILIN, and NEXCOM (in alphabetical order) in launching new products to strengthen the partnership.

• Microchip Technology Inc.

  

  Main advantages: We provide total system solutions for creating smart, connected and secure Internet of Things (IoT) designs. This complete product offering simplifies the development of innovative wired and wireless systems, getting you to production faster and speeding up your revenue stream. Applications that leverage our solutions make use of an ecosystem that encompass smart processors, intelligent analog, certified wired and wireless connectivity and robust security. We also provide comprehensive design assistance through our ready-to-use software and tools, partnerships with the largest cloud computing companies and world-class support, making your journey from idea to cloud fast and easy. Recommended Reasons： The Microchip Advantages: 1. Expanding portfolio of leadership products​ 2. Industry-leading development tools​ 3. “Best in Class” lead times and consistent delivery performance​ 4. Quality leadership . . . the relentless quest for perfection!​ 5. Competitive pricing​ 6. Outstanding support through all phases of a project ​ 7. Consistent profitability and rock-solid financial strength​

• Nuvoton Technology Corporation

  

  Main advantages: Nuvoton IoT security microcontrollers are based on Arm® Cortex®-M23. In addition to the built-in TrustZone® technology of the Armv8-M architecture, it also adds protection functions against side-channel attacks to cryptographic hardware accelerators as well as fault injection attacks of voltage and clock pin surges. Furthermore, M2354 Series has implemented the microcontroller platform security hardware features, including debug port management (Debug Port Management), product life cycle management (Product Lifecycle Management), Firmware Version Counter and a Secure Key storage area with chip physical level security, allowing the microcontroller application system to easily realize data storage security, software execution security and message communication security. In addition to the TrustZone® technology, the NuMicro® M23 all secure IoT microcontroller series also has built-in security technologies that can improve system security. Among them, the Secure Bootloader loading program can support the Trusted Boot function; the hardware encryption accelerator including AES, RSA, ECC algorithms can reduce the load of the main processor in the encryption and decryption operations; XOM (Execute-Only Memory) can define Execute -Only memory area to protect key code; Flash lock bits are designed to prevent the debugging interface of Flash memory from being accessed or written by the outside; Tamper detection pins can be used to detect the state change on the pins linking to system boards for intrusion detection. Nuvoton Secure Microcontroller Platform (NuSMP 2.0) The Platform Security Architecture (PSA) launched by Arm® is an IoT ecosystem security solution. This solution includes threat model analysis, security analysis, to hardware and firmware architecture specifications, and open source The firmware reference design; this solution also provides basic design principles, allowing developers to build more secure IoT devices in a more efficient way. PSA has now developed to three certification levels, namely PSA CertifiedTM Level 1, Level 2 and Level 3.In order to allow developers to more conveniently implement IoT security technology in innovative development, Nuvoton Technology has developed the "Nuvoton Secure Microcontroller Platform (Nuvoton Secure Microcontroller Platform, NuSMP)" that supports Arm® PSA. NuSMP is a security technology that mixes hardware and software to meet the security requirements of general-purpose and IoT security microcontroller series. Developers can easily implement secure designs on NuMicro® M23 Line microcontrollers through NuSMP technology, including Trusted Boot (Root of Trust), secure Over-The-Air (OTA) firmware updates, software downloads, non-secure zone Power Management, and encryption and decryption software tools on the PC side. NuSMP 1.0 can comply with PSA Level 1 and Level 2 security certification, while NuSMP 2.0 imported by M2354 can also comply with PSA Level 3 or other IoT device security certification levels of the same security level. The entire offering suite is constructed in compliance of Chain of Trust (CoT) with several secure booting layers named NuMicro® Boot Loader 1 (NuBL1, hardware level), Boot Loader 2 (NuBL2 first software level including trusted boot code and memory partition manager with OTA update feature), Boot Loader 32 (NuBL32, for Secure World), Boot Loader 33 (NuBL33, for Non-Secure World). With the CoT guarantee, all services and software tool can support most security requirements for MCU applications. Recommended Reasons： In recent years, the rise of the Internet of Things era has increased people’s awareness of the integration of the real world and digital systems. Digitization has improved life efficiency and economic benefits, and the COVID-19 epidemic has also brought people new working and life patterns which have further accelerated the deployment of IoT application services.However, the security issues of every network-connected device also pose new challenges for system developers. More and more national or regional network security supervision departments have proposed corresponding security standards and regulations. Nuvoton Technology debuts brand new NuMicro® M2354 IoT Security microcontroller series. In addition to inherit the security features of NuMicro® M2351 Series that have been Arm® PSA Certified™ Level 1, Level 2 and PSA Functional API Certified, M2354 Series endows the microcontrollers used by network-connected devices with the physical level (chip-level) security protection function. It ensures the software and hardware integration system products developed can meet the requirement of information and communication security for the international mainstream standards, and it can also simplify the implementation of regulations compliant products that require the security certification. At the same time, it satisfies the development and design requirements of the device itself that requires low-power operation.

• NXP Semiconductors

  

  Main advantages: NXP Semiconductors N.V. (NASDAQ: NXPI) announces the expansion of its EdgeVerse™ portfolio with its crossover applications processors, including i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified families, as well as next-generation i.MX 9 series of high performance intelligent applications processors. The expansion includes new innovations with EdgeLock secure enclave to enhance edge security and Energy Flex architecture to maximize energy efficiency. Recommended Reasons： Key innovator in the area

• Silicon Labs

  

  Main advantages: Silicon Labs (NASDAQ: SLAB) is a leading provider of silicon, software and solutions for a smarter, more connected world. Over the last two decades, Silicon Labs has evolved from a semiconductor start-up committed to helping developers reduce the cost and complexity of their designs into a global leader in solutions for the Internet of Things (IoT) and infrastructure. The Austin, Texas based company has shipped more than 7 billion devices to date, holds more than 1,700 patents, and employ over 1,000 people around the globe. Silicon Labs is the market leader in IoT wireless connectivity, consistently outperforming the market at a projected 20-30% wireless year-over-year CAGR. The company possesses the industry's most comprehensive wireless portfolio, supporting the widest range of protocols, including Bluetooth, proprietary, Thread, Wi-SUN, Wi-Fi, Zigbee and Z-Wave, and major ecosystems, such as Amazon, Google, Tuya and Xfinity. Built on an integrated hardware and software platform specifically designed for IoT development, the company's connectivity solution is the only wireless IoT offering to achieve ARM's security PSA Level 3 certification. The ccompany has developed the industry's most comprehensive IoT ecosystem, serving tens of thousands of customers, thousands of applications and hundreds of leading partners, including organizations defining the next wave of technology such as Project Connected Home over IP and Amazon Sidewalk. In recent months, the global pandemic has escalated demand for connectivity as people spend more time in their homes and industries look for smarter and more sustainable ways to operate using connected intelligence. The comprehensive, IoT hardware, software and development tools platform from Silicon Labs simplifies connected product design. • Redefined IoT security with the launch of Secure Vault, a suite of state-of-the-art security features designed to help device makers effectively address escalating IoT security threats and regulatory pressures. • Introduced a new line of Bluetooth Low Energy 5.2 SoCs, SiPs, modules and NCPs featuring cutting-edge security and best-in-class-performance with attributes that include enabling ten-year battery life on a coin cell, mesh networking capability and sub-one-meter direction finding accuracy. • Expanded the company's wireless portfolio with the acquisition of Redpine Signals, a leader in low-power Wi-Fi connectivity solutions including Wi-Fi 6 technology. • Facilitated the rollout of 5G small cells with the launch of a comprehensive Power over Ethernet (PoE) portfolio. • Welcomed 6,000 global registrants to Silicon Labs' first-ever Works With Smart Home Developer Conference. Works With featured the industry's largest smart home ecosystems including Amazon, Comcast and Google with 40 technical sessions, 12 hands-on workshops and six keynotes. • Announced a collaboration with Amazon to support Amazon Sidewalk, a shared network created by neighbors to help wireless devices work better both at home and beyond the front door. • Joined the WI-SUN Alliance to accelerate the adoption of this compelling standards-based, long range smart city IoT connectivity mesh networking solution. • Released Simplicity Studio 5, a major update to our free to use IoT developer environment. • Became a founding member of the Z-Wave Alliance's independent, nonprofit Standards Development Organization (SDO) to help expand advancement of Z-Wave as an open standard for smart home and IoT solutions. Recommended Reasons： Silicon Labs is advancing and redefining IoT security with Secure Vault-- a suite of state-of-the-art security features designed to help device makers effectively address escalating IoT security threats and regulatory pressures. Secure Vault features best-in-class security including secure boot based on hardware root of trust, secure debug, physical tamper, secure identity for attestation, and physically unclonable function (PUF) key management technology to significantly reduce the risk of IoT security breaches and compromised intellectual property. Silicon Labs' EFRxG21B SoCs with Secure Vault are the first chips in the world to be awarded ARM's PSA Level 3 security certification, proving it can protect against both remote and physical software and hardware attacks.

• Silicon Motion, Inc.

  

  Main advantages: The latest generation of embedded and industrial applications for IoT market rely heavily on faster data transfer rates, and robust and reliable data storage. The migration to PCIe SSDs provides a proven way to achieve the required performance in embedded storage applications. The new PCIe FerriSSD from Silicon Motion offers not only improved performance: advanced technologies such as embedded DRAM data redundancy protect the SSD from the risk of data loss during data transfer operations. Available in 3D TLC, MLCand SLC modes, and with memory capacity options ranging from 4GB to 256GB, FerriSSD provides great flexibility to system designers, allowing them to match the specification of their storage solution to the needs of their application, and thus to minimize the cost of the SSD. For many embedded applications, the improved performance and added data protection in the new PCIe FerriSSD will make it the right choice. Silicon Motion’s engineers have developed a full array of advanced technologies to prolong the life of the SSD, including a proven 4th generation data recovery algorithm. The new PCIe FerriSSD offers the best blend of data integrity, cost and performance for embedded and industrial IoT applications. Recommended Reasons： Designed Specifically for Industrial / Embedded Applications Silicon Motion’s PCIe FerriSSD® The increasing popularity of cloud computing systems, and in particular the Internet of Things (IoT), means that demand is growing rapidly for reliable access to data at ever higher data-transfer rates. This increase in demand for data applies equally to storage: as a result the PCIe/NVME SSD, which has a very high-speed interface to support fast Read and Write operations, is rapidly becoming the preferred solution for data storage in many IoT applications. For industrial and embedded systems, the primary requirement for data storage, as for any other important system function, is very high reliability. But in the embedded world too, speed and performance are also crucial parameters. The PCIe/NVME SSD has the potential to satisfy both requirements. The high-speed PCIe/NVME interface can help improve application performance so that an embedded system can process more instructions and answer more complex queries in less time. In embedded systems, I/O-intensive log files and frequently accessed tables can slow down an analytics engine, but a PCIe-based Flash storage unit keeps the data near to the processor, providing a fast response time to requests for data. The ability to access data quickly is, of course, of little value if the data has been corrupted or lost. The reliability of data storage may be compromised in many ways, such as power failure, memory failure, system instability and even human error. This is why manufacturers of NAND Flash-based storage systems have developed special technologies for data protection, to avoid the risk of system faults or even total failure caused by corruption or loss of stored data. The development of data protection and data integrity technology has reached a new level with the introduction of the PCIe FerriSSD® , a NAND Flash-based data storage solution from Silicon Motion which is ideal for a wide range of embedded applications requiring fast access speed, a small flexible form factor and a reliable boot and storage drive. In order to meet demanding boot load SSD performance specifications and to provide robust data protection, the new PCIe FerriSSD incorporates various unique technologies which enhance the data integrity, longevity and performance of SSD boot loaders, providing ideal solutions to ensure the data security and reliability for IoT applications.

• STMicroelectronics

  

  Main advantages： ST has a rich product portfolio to meet challenging IoT security requirements. The STSAFE product family is CC certified and offers simplified, flexible, and standard solutions. Its comprehensive ecosystem eases development effort and helps designers achieve quick time-to-market. STSAFE-A is compatible with leading LPWAN (LoRa & Sigfox) and major Cloud (AWS & Azure) solutions, and performs strict authentication by integrating in IoT devices. Recommended Reasons： Having compiled more than 30 years of experience in security, ST is dedicated to secure embedded application design. With robust product design centered around ST's MCUs and STSAFE products, ST can help secure all applications ranging from smartcards, brand protection, and mobile solutions, extending now into the connected world.

• Winbond Electronics Corporation

  

  Main advantages: 1. Expanded Fab capacity from 54K to 57K wafers per month 2. The production yield of 25nm DRAM has reached a mature level 3. Launched the W77Q (32 Mbit) TrustME® Secure Flash memory 4. Low Power DRAM and HyperRAM have been successfully adopted in various AI edge computing applications Recommended Reasons： Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

• Your Health Technology Co., Ltd. (Yutech)

  

  Main advantages： 1. 2017 IEEE CASS Student Competition – World Champion 2. 2017 Future Tech – Best Media Attention Award, Best Popularity Award, Future Technology Breakthrough Award 3. 2018 AI_ROBOT BASE@STSP TAIRA Final Pitch WINNER Recommended Reasons： The goal of the Guard Patch is to develop an Intelligent Wearable Body Sensor SOC with IoT for Wireless vital signs Monitor. Our team designs and implements a high resolution and low power bio-signal acquisition chip. The chip is fabricated in a TSMC 0.18 μm standard CMOS process. Based on this chip, we integrate the required circuits into a wearable system module to sense the vital signs signal from users. The communication between the sensor and the smart phone is established via Bluetooth. The software needs to fulfill the following four principal tasks: 1) data processing, 2) analyzing, 3) displaying, and 4) recording. A back-end application (APP) on Android/iOS system carries out the further mathematical calculation and analysis, including demodulation and digital signal processing. With the basic monitor function (off-line bio-signal data storage), the real-time monitoring function is also developed and the real-time bio-signal can be checked on the smart device. The processed vital signs signal will then be displayed on the screen. With such a wearable platform for wireless bio-signal acquisition, the user can access and monitor his own physiological condition anytime and anywhere. For these functions mentioned above, this wireless bio-signal acquisition system with IoT will become the guard patch of the user. There are three main advantages of this system, including real-time monitoring, convenient for wear, and easy to use. Besides, the technology of Guard Patch is promoted to other application including YuGuard, YuSound, YuRine, YuCloth, YuBelt, YuPet, and TriAnswer. The detailed has been presented in Yutech introduction video (https://www.youtube.com/watch?v=xOxKiOdbVXc&list=PL97ZBA5GLz5uJVRsz1hg9WSdPIR_Q2B_W&index=2 ). The new company “YuTech” founded by CBIC members has been performed to provide the market production and service for users. “YuTech” is one of few companies in Taiwan which can provide IoT modules with multi-sensors, firmware development for communication between different platforms and the integration of hardware and software, software service with AI algorithm for long-term health monitoring.

• Andes Technology

  

  Main advantages: In 2020, although the COVID-19 pandemic had a severe impact on the global economy, Andes Technology still made significant advances and achievements in the development of RISC-V. As a leading supplier of RISC-V processors and world-class creator/maintainer of RISC-V related development environments, Andes will continue to form alliances with related industries, expand ecosystems and lead the trend of the next generation RISC-V technology. Global Presence • Andes Technology stepped up to the Founding Premier Member of RISC-V International. • President Frankwell Lin was elected as Board Director of RISC-V International. • Dr. Charlie Su, CTO and EVP, was elected as Vice Chair of RISC-V International Technical Steering Committee. • Florian Wohlrab, Sales Director of Europe and Japan, became one of the first RISC-V Ambassadors. Innovative Products • After releasing the first RISC-V processor supporting the DSP extended instruction set in 2019, Andes launched the first RISC-V vector processor in 2020. • Andes announced new RISC-V AndesCore™ processors: superscalar 45-series with multi-core support and 27-series with level-2 cache controller. • Software: The LLVM tool chain was also launched to support RISC-V vector extension and AI applications. AndeClarity™ Vector Pipeline Analyzer is the first and the best tool in the RISC-V industry to optimize the processor pipeline with visual interface. Other achievements include the enhancements of Linux, porting AndesCore to a variety of RTOS and keeping the leading position of RISC-V commercial tool chain in both performance and code size. New Milestones • In December 2020, Andes’ monthly revenue exceeded USD$ 3.5 million (NTD$ 100 million). • Over 200 commercial licensees, geographically distributed in Taiwan, North America, China, South Korea, Japan and Europe。 • The cumulative number of IP license contracts exceeded 400. In 2020, design wins included many world-leading companies, such as MediaTek, Renesas and SK Telecom. • Royalty revenue grew by nearly 50%. • Nearly 20,000 installations of AndeSight™ IDE. • Annual shipment of SoCs embedded with Andes CPU cores surpassed 2 billion in 2020. • The top three rankings of revenue by regions are Taiwan (43%), the United States (26%) and China (25%) in 2020. • The applications of Andes’ licensees are diversified. In the first three quarters of 2020, the top five customer applications are Video & Audio (24%), MCU (17%), IoT (14%), AI (10%), and Sensing (7%). Awards & Recognition • Andes Technology was ranked among “100 Fastest-Growing Companies” in 2020 by CommonWealth Magazine, one of the most influential magazines in Taiwan. • President Frankwell Lin won ERSO Award, a high honor in the semiconductor industry in Taiwan, because of his contribution to developing Taiwan’s original embedded CPU architecture and licensing business model, making Andes becoming the first commercial CPU IP supplier in Asia. • President Frankwell Lin was invited as the award presenter at the GSA (Global Semiconductor Alliance) Award Ceremony. • The first RISC-V vector processor core, AndesCore NX27V, won “Hsinchu Science Park Innovative Product Award” and “Outstanding Product Performance of the Year” of ASPENCORE World Electronics Achievement Awards. • Dr. Chuanhau Chang, Assistant Vice President of Architecture R&D Division, won RISC-V Top Technical Contributor Awards in recognition of his contribution to RISC-V Architecture. • Andes passed DUNS Registered™ Certificate, demonstrating its credibility as a commercial entity registered in the world’s largest commercial database. Strategic Partnership • More than 145 ecosystem partners. • Development environment: IAR supports RISC-V P Extension which is contributed to the community by Andes. Other partners supporting AndesCore and its development environments include Cyberon, Imperas, Lauterbach, Menta, Open AI Lab, SEGGER, UltraSoC, etc. • Security partners including Hex-Five, PUFsecurity, Rambus, Secure-IC, Silex Insight, Tiempo, and Veridify have worked with Andes from different aspects to strengthen the security and protection mechanism of RISC-V AndesCore. • As for AI applications, Andes collaborated with Deeplite to launch a faster, smaller ,and more accurate AI model optimizer. Also, Andes has made remarkable progress in its neural network computing library (Andes NN Library). Event Presence • At 2020 RISC-V Summit, Andes presented six talks covering the hottest RISC-V topics, including AndesCore™, Vector Extension, AndesClarity™ and IOPMP. • Andes hosted more than 40 RISC-V webinars and meetups to share new market trends and the latest technologies with more than 3,000 RISC-V enthusiasts all over the world. • Andes joined more than 50 major industry events around the world to promote and reach customers despite the pandemic. The events included Embedded World, RISC-V Meetup (Hsinchu, Munich, Toronto), TSMC Online Technology Symposium (China, EU, Japan, Taiwan, and US), EDN Forum, IP SoC Day Online (Shanghai, Grenoble), DAC (San Francisco), VLSI-CAD, D-Forum 2020, VLSI -DAT , RISC-V Global Forum, RISC-V Tokyo Day, RISC-V Vietnam Day, RISC-V Taipei Day , Linley Fall Processor Conference, EEPW IoT Developers Live Chat, ICCAD 2020, GSA Award Dinner, TSES Hsinchu, RISC-V 10th Anniversary, Hsinchu Science Park 40th Anniversary Celebration Ceremony, and RISC-V Summit. Recommended Reasons： Focus on CPU IP The strategic technology of CPU IP is indispensable in SoC design. Andes Technology has been devoted to developing CPU IP technology for over 16 years and it is one of the few companies in the world that provides commercial CPU IP and has customers entering mass production constantly. The annual shipment of SoCs embedded with Andes CPU cores surpassed 2 billion in 2020 and the cumulative shipments hit the milestone of more than 7 billion. Andes was selected as EETimes' Silicon 60 Hot Startups to Watch in 2012 and received TSMC OIP Award “Partner of the Year” for New IP in 2015. In 2020, Andes was awarded “Most Outstanding Embedded Processor IP Supplier” by AI Global Media. Also, its NX27V vector processor IP of AndesCore™ V5 (RISC-V) series was awarded “Hsinchu Science Park Innovative Product Award” at 40th anniversary of the Hsinchu Science Park and “Outstanding Product Performance of the Year” by EETimes (Aspencore Group) at World Electronics Achievement Awards in 2020. Comprehensive Product Lines Andes keeps driving innovation and launches comprehensive RISC-V CPU IP series, including entry-level 32-bit N22, mid-range N25F/D25F/A25/A27 and 64-bit NX25F/AX25/AX27 and high-end multicore A(X)25MP, vector processor NX27V and the latest superscalar 45-series. Its world-leading RISC-V commercial processor cores with DSP instruction set and vector extension become the best solutions for emerging applications such as 5G, AI/ML, ADAS, AR/VR, blockchain, cloud computing, data center, IoT, storage, security and wireless devices. Quality Sales and Service Andes provides quality sales and technical service by establishing branches in Taiwan, USA and China as well as having professional agents in major IC design regions including Korea, Europe, Israel for sales and customer services. Its customers include world-class companies such as MediaTek and Renesas. The diverse applications range from audio, Bluetooth, gaming, GPS to ML, MCU, sensor fusion, SSD controller, touch controller, USB 3.0 storage, voice recognition, Wi-Fi, wireless charging, etc. Active Role in RISC-V Strategic Global Planning Andes is the Founding Premier Member of RISC-V International Association (formerly known as RISC-V Foundation). Frankwell Lin, CEO of Andes, is the Board Director of RISC-V International. Charlie Su, President and CTO of Andes, is Vice Chair of RISC-V International Technical Steering Committee. Every year Andes hosts events including RISC-V CON, Meetup in Taiwan, China and USA as well as over 30 Chinese and English webinars which attracts audience around the world with more than 10 thousand views online. Andes also participates major industry exhibitions, such as Embedded World, DAC, TSMC Symposium and promotes them through social channels including Facebook, Twitter, LinkedIn, WeChat, YouTube, gaining exposure for RISC-V and the brand of Andes. Certification Test Andes Certified Engineer Test (ACET™) Program, hosted by Andes since 2013, issues nearly 200 certificates to engineers who pass the test every year as a reference of recommendation for recruitment in the industry. Fast Growing Business In ihe 100 Fastest Growing Companies of 2020 announced by CommonWealth Magazine in August, 2020, Andes is ranked 35th. Emphasis on Corporate Responsibility With emphasis of corporate responsibility and sustainable values, Andes has devoted itself to developing low power/high performance green power-saving CPU in order to increase power efficiency and protect the environment. For industry–academia collaboration, Andes has provided AndesCore™ to universities around the world for courses, research projects and established joint laboratories with many universities. The total number of contracts with universities (mainly EE and CS departments in Taiwan, China and US) is over 120 by September, 2020. Andes has also donated AndesCore™ and peripheral development platforms valued at tens of millions to numerous prestigious universities including NTU, NTHU, NCTU, NCKU in Taiwan. By establishing long term industry–academia collaboration, Andes aims to cultivate talents, communicate with higher education institutions and fulfill corporate responsibility.

• ASIX Electronics Corporation

  

  Main advantages: ASIX Electronics Corporation launches most successful and innovative products, - The Greater China's First EtherCAT Slave Controller - The Greater China's First EtherCAT Slave Controller SoC - The newest Quad Port TSN Gigabit Ethernet PCIe NIC Card Recommended Reasons： ASIX Electronics Corporation focuses on developing high-integrated, easy-design and cost-efficient Ethernet-centric and interface silicon products. ASIX has successfully launched many most successful and innovative products applied in industrial/embedded networking, communication and connectivity applications.

• congatec Asia Ltd.

  

  Main advantages: World's largest vendor focused on Computer-On-Module(COMs), SBCs, and customized design only. Most complete roadmap of COM products. Proven superior design-in support. Close partnerships to Intel, AMD, and NXP. Provide more than 13 years product longevity Recommended Reasons： Focused Specialist & Market Leader Innovator & Driver of standards Provide Embedded Eco-system & partners Collective experience & knowledge in Industry automation

• Intel Corporation

  

  Main advantages： People's dependence on AI computing and the urgent need for low-latency networks make edge computing more important in the future. Intel processors with enhanced IoT capabilities including the 11th generation Intel® Core™ processor, Intel Atom® x6000E series, and Intel® Pentium® and Celeron® N and J series, integrate Edge Software Hub’s Edge Insights for Industrial and Intel® Distribution of OpenVINO™ toolkit, and leverage Intel® Safety Island to meet functional safety requirements. They are also built in with hardware-based security, providing a complete set of software and hardware solutions to help clients meet the edge computing needs in industrial sector, retail, transportation, healthcare and smart city applications. Recommended Reasons： Intel has invested in software and hardware development to lay a solid foundation for its business operation. It has also invested in the global ecosystem and cooperated with more than 1,200 partners to complete more than 15,000 customer deployments globally. In September 2020, Intel Taiwan also joined with 8 IoT computing partners, including AAEON, ADLINK, Advantech, Getac, iBASE, IEI, LILIN, and NEXCOM (in alphabetical order) in launching new products to strengthen the partnership.

• KDH Design Inc.

  

  Main advantages: 1. Transparent, flexible, and high brightness “Flexible Augmented Reality Display (AR Film)” can be widely used in various applications, such as motorcycles, automobiles, and retail shelves or shop windows. AR film is different from the augmented reality display developed by other manufacturers which has low plasticity in appearance and is limited by the clarity of the picture under strong sunlight. 2. Signed a cooperation agreement with the largest retailer in the United States, and plans to provide augmented reality shelf displays by late 2023. Recommended Reasons： The Flexible Augmented Reality Display (AR film) can be applied to various fields by integrating virtual and real experience with online and offline setting to save costs and build platform for data analyzing purpose to increase the operational efficiency of the company.

• Microchip Technology Inc.

  

  Main advantages: Innovation in the latest meter designs are being driven by a number of factors including the migration from mechanical meters to smart meters, the need to provide advanced intelligence and two-way communications and the demands of the emerging smart grid. Designing solutions for this rapidly evolving market also requires keeping up with the latest government regulations, technology innovations, competitive products and end-customer expectations. We understand the challenges you are facing with your metering designs. Our solutions are used in millions of meters worldwide to increase accuracy and reliability while lowering total system costs. We provide products, a variety of development resources and technical support to assist you with developing engaging energy management solutions that are designed to monitor and control the use of valuable energy resources. We offer an extensive array of 8-, 16- and 32-bit microcontrollers, 16-bit Digital Signal Controllers (DSCs), energy measurement ICs, analog components, Flash memory, serial EEPROMs, capacitive touch and wireless connectivity solutions. Our solutions can help you: Drive inexpensive LED and LCD displays directly Add wireless communication for automated meter reading Implement anti-tampering techniques Create low-power designs Integrate a real time clock for advanced billing schemes Improve accuracy and simplify meter calibration Integrate touch sensing functionality into your designs Recommended Reasons： The Microchip Advantages: 1. Expanding portfolio of leadership products​ 2. Industry-leading development tools​ 3. “Best in Class” lead times and consistent delivery performance​ 4. Quality leadership . . . the relentless quest for perfection!​ 5. Competitive pricing​ 6. Outstanding support through all phases of a project ​ 7. Consistent profitability and rock-solid financial strength​

• Nuvoton Technology Corporation

  

  Main advantages: The NUC980 series with the ARM926EJ-S core can operate at up to 300 MHz . It offers 64-pin, 128-pin and 216-pin LQFP packages stacked with 64 MB and 128 MB DDR-II Memory to reduce PCB size and EMI issues. Rich peripherals include 10 sets of UART , dual Ethernet, 4 sets CAN 2.0B, dual SDIO / eMMC interface, NAND Flash interface, QSPI NAND, 8 Ports USB Host, ISO-7816 interface and High-Speed USB 2.0 host / device controller to allow more flexibility in designs. The NUC980 also integrates the crypto engine which provides hardware acceleration for AES, SHA, ECC, RSA function. It supports industrial temperature from - 40 ℃ to 85 ℃ and targets Industrial Control, Industrial IoT Gateway, Network Printer, Meter Concentrator and Smart Home Gateway applications. Recommended Reasons： Linux Industrial IoT Development Platform Nuvoton Technology provides industrial IoT development platform using NUC980DK61Y microprocessor, which is an industrial IoT open platform, including complete hardware design and software reference design. The platform is powered by Nuvoton ARM9 MPU with a 300 MHz internal speed and up to 128 MB DDR memory, single 10/100 Ethernet port, 2 high-speed USB hosts, 1 Gb SPI NAND Flash memory, microphone input, stereo headphone output and Arduino compatible interface. The platform supports embedded Linux OS which provides all IoT protocols you need, such as AWS Client / MQTT / Web Server, etc., users can use this platform to quickly develop a plenty of IoTapplications. NuMaker-RTU-NUC980 (Chili) NuMaker-RTU-NUC980, also known as Chili, is a Nuvoton’s development platform that uses NUC980DR61YC microprocessor with a 64-pin package on a 50 mm x 50 mm dimension PCB. This Chili PCB has already embedded Linux operating system and does not have to prepare a cross complier environment. Users can begin develop software application and control a LED light within 5 minutes. Chili Board embeds Linux v4.4, NFS(Network File System) and webserver functions. To accelerate development, Nuvoton provides sample code like LED control, Wi-Fi connection, Bluetooth control etc. Not only providing a whole developing environment, Chili board provides a high-end hardware features including a NUC980DR61YC ARM926EJ-S processor with 64 MB DRAM, 32MB SPI NOR Flash, 10/100 Ethernet MAC interface, USB 2.0 High Speed host/device connector, CAN bus, RS-485 and five GPIOs. Crypto engine supports RSA2048, AES256, ECC, SHA512 algorithm and a Pseudo Random Number Generator for communication security protection. Chili board is a small system which can run Linux on it. Nuvoton provides a full development environment and high-end hardware features. To those who need operation system and internet applications, Chili board is a fast-developing and suitable platform for them.

• NXP Semiconductors

  

  Main advantages: From embedded hardware to software solutions, NXP industrial expertise and innovative spirit enable customers to meet the highest expectations of industry 4.0 and industrial IoT markets. Recommended Reasons： -- Broad Industrial Portfolio -- Innovation That Anticipates Market Trends --Top 10 Automation OEMs Trust NXP solutions --Strong Industrial Partner Ecosystem --1 Global Industrial System Innovation (ISI)

• STMicroelectronics

  

  Main advantages： *ST has announced multiple, new, wireless MCUs, for both short-range and long-range wireless protocols. ST's rich portfolio makes it easy for customers/developers to find the best solution for Industrial IoT projects. *ST features high-performance dual-coreMCUs, including the STM32H745 and MPU STM32MP157 now in mass production. These high-performance MCUs bring greater precision, efficiency, and communication capabilities to high-value applications. *Evolving HW/SW development for popular applications like AI, Motor control and Digital power Recommended Reasons： *ST is a well-known, high-reliability brand, featuring the most popular 32-bit MCU family in the market *ST's widely used MCU family features a rolling longevity commitment of 10 years *The STM32 ecosystem, a broad-based and easy to use set of HW and SW tools, is compatible with the whole STM32 family of MCUs from the low end to the high end

• Suzhou Novosense Microelectronics Co., Ltd.

  

  Main advantages: In 2020,Novosense has successively launched Isolated Error Amplifier, Isolated Driver Chip, Isolated Sampling Chip, I²C Interface Chip, Adaptive OOK-based Enhanced Digital Isolation Chip, the first LIN bus interface sensor signal conditioning chip of automotive standard class, and many other chips. At present, Novosense has become the only one-stop supplier of digital isolation devices in China, including digital isolation, interface isolation, isolation drive, isolation power supply and isolation sampling. In the middle of 2020,Novosense won many honors, such as 2019 China MEMS Top 10, China IC Unicorn Enterprise, "Excellent Enterprise Award" of China Analog Semiconductor Leap Achievement Award, 2020 Hardcore China Semiconductor · Best Domestic Sensor Chip Product Award, and was selected as one of KPMG China "Chip Technology" Top 50 New Enterprises. In 2020, the annual revenue exceeded 240 million yuan, an increase of 160% compared with 2019. Recommended Reasons： Novosense provides low propagation delay, high reliability, high integration, basic/enhanced isolation drive chip solutions, which are particularly suited to the current trend of intelligent and miniaturized switching power supply design. At present, we isolated drive, sampling products are widely used in industrial fields, the solution supports industry control, motor drive, industry, transportation, instrumentation, industrial PC and safety equipment, from product concept to manufacturing, our engineers according to specific application of standard and custom requirements for support, Designed according to strict specifications to meet the stringent requirements of general industrial applications.

• Texas Instruments

  

  Main advantages： TI industry-leading microcontrollers and processors bring real-time processing, data analytics, and safety capabilities to your design, enabling more automated and energy-efficient industrial 4.0 systems. From intelligent peripheral and analog integration to an extensive tool ecosystem, we're committed to delivering innovative embedded technology to help you achieve your goals. Our diverse portfolio of 16- and 32-bit MCUs with real-time control capabilities and high-precision analog integration are optimized for industrial applications. Besides, our processors enable real-time communication, analytics, and features for functional safety and security through optimal integration that helps you meet cost and performance requirements for a variety of applications. To highlight, TI’s new family of AM64x devices combines real-time computing performance, integrated networking options, and the ability to implement configurable web services in a small power envelope. With five pin-to-pin compatible devices, the AM64x family enables you to design next-generation compact, precise and connected edge devices for modern automation. Recommended Reasons： TI’s innovative analog and embedded processing products, industrial 4.0 system expertise, and easy-to-use design tools help you deliver the digitalization of systems to enable smarter, safer, more efficient factories. Below shares how/why our new family of AM64x devices can benefit your design and earn your vote. The AM64x family offers high levels of integration that help simplify designs and offer lower system costs. The AM64x family enables industry-leading real-time computing from up to 4 Arm® Cortex®-R5F cores delivering 6,400 DMIPs, flexible networking architecture that supports the top networking standards and industrial Ethernet protocols, and configurable web services powered by dual Arm Cortex-A53 cores. In industrial drives specifically, AM64x devices enable customers to handle the communication and control capabilities of a drive with a single chip. Integrated industrial connectivity is central to the AM64x family architecture. Each device features multiple Ethernet ports to support industrial switch implementations such as time-sensitive networking (TSN) up to gigabit speeds, as well as EtherCAT®, PROFINET®, ETHERNET/IP®, and others. The AM64x family also integrates complete software stacks for these protocols, making it easy to design edge devices that seamlessly connect to the infrastructure. The AM64x family uses Arm Cortex-R5F processing cores (as opposed to other Arm processing cores such as Cortex-M7) to enable the multicore capability for embedded systems that require reliability, high availability, and low-latency real-time responses.

• Winbond Electronics Corporation

  

  Main advantages: 1. Expanded Fab capacity from 54K to 57K wafers per month 2. The production yield of 25nm DRAM has reached a mature level 3. Launched the W77Q (32 Mbit) TrustME® Secure Flash memory 4. Low Power DRAM and HyperRAM have been successfully adopted in various AI edge computing applications Recommended Reasons： Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

• Andes Technology

  

  Main advantages: In 2020, although the COVID-19 pandemic had a severe impact on the global economy, Andes Technology still made significant advances and achievements in the development of RISC-V. As a leading supplier of RISC-V processors and world-class creator/maintainer of RISC-V related development environments, Andes will continue to form alliances with related industries, expand ecosystems and lead the trend of the next generation RISC-V technology. Global Presence • Andes Technology stepped up to the Founding Premier Member of RISC-V International. • President Frankwell Lin was elected as Board Director of RISC-V International.. • Dr. Charlie Su, CTO and EVP, was elected as Vice Chair of RISC-V International Technical Steering Committee. • Florian Wohlrab, Sales Director of Europe and Japan, became one of the first RISC-V Ambassadors. Innovative Products • After releasing the first RISC-V processor supporting the DSP extended instruction set in 2019, Andes launched the first RISC-V vector processor in 2020. • Andes announced new RISC-V AndesCore™ processors: superscalar 45-series with multi-core support and 27-series with level-2 cache controller. • Software: The LLVM tool chain was also launched to support RISC-V vector extension and AI applications. AndeClarity™ Vector Pipeline Analyzer is the first and the best tool in the RISC-V industry to optimize the processor pipeline with visual interface. Other achievements include the enhancements of Linux, porting AndesCore to a variety of RTOS and keeping the leading position of RISC-V commercial tool chain in both performance and code size. New Milestones • In December 2020, Andes’ monthly revenue exceeded USD$ 3.5 million (NTD$ 100 million). • Over 200 commercial licensees, geographically distributed in Taiwan, North America, China, South Korea, Japan and Europe。 • The cumulative number of IP license contracts exceeded 400. In 2020, design wins included many world-leading companies, such as MediaTek, Renesas and SK Telecom. • Royalty revenue grew by nearly 50%. • Nearly 20,000 installations of AndeSight™ IDE. • Annual shipment of SoCs embedded with Andes CPU cores surpassed 2 billion in 2020. • The top three rankings of revenue by regions are Taiwan (43%), the United States (26%) and China (25%) in 2020. • The applications of Andes’ licensees are diversified. In the first three quarters of 2020, the top five customer applications are Video & Audio (24%), MCU (17%), IoT (14%), AI (10%), and Sensing (7%). Awards & Recognition • Andes Technology was ranked among “100 Fastest-Growing Companies” in 2020 by CommonWealth Magazine, one of the most influential magazines in Taiwan. • President Frankwell Lin won ERSO Award, a high honor in the semiconductor industry in Taiwan, because of his contribution to developing Taiwan’s original embedded CPU architecture and licensing business model, making Andes becoming the first commercial CPU IP supplier in Asia. • President Frankwell Lin was invited as the award presenter at the GSA (Global Semiconductor Alliance) Award Ceremony. • The first RISC-V vector processor core, AndesCore NX27V, won “Hsinchu Science Park Innovative Product Award” and “Outstanding Product Performance of the Year” of ASPENCORE World Electronics Achievement Awards. • Dr. Chuanhau Chang, Assistant Vice President of Architecture R&D Division, won RISC-V Top Technical Contributor Awards in recognition of his contribution to RISC-V Architecture. • Andes passed DUNS Registered™ Certificate, demonstrating its credibility as a commercial entity registered in the world’s largest commercial database. Strategic Partnership • More than 145 ecosystem partners. • Development environment: IAR supports RISC-V P Extension which is contributed to the community by Andes. Other partners supporting AndesCore and its development environments include Cyberon, Imperas, Lauterbach, Menta, Open AI Lab, SEGGER, UltraSoC, etc. • Security partners including Hex-Five, PUFsecurity, Rambus, Secure-IC, Silex Insight, Tiempo, and Veridify have worked with Andes from different aspects to strengthen the security and protection mechanism of RISC-V AndesCore. • As for AI applications, Andes collaborated with Deeplite to launch a faster, smaller ,and more accurate AI model optimizer. Also, Andes has made remarkable progress in its neural network computing library (Andes NN Library). Event Presence • At 2020 RISC-V Summit, Andes presented six talks covering the hottest RISC-V topics, including AndesCore™, Vector Extension, AndesClarity™ and IOPMP. • Andes hosted more than 40 RISC-V webinars and meetups to share new market trends and the latest technologies with more than 3,000 RISC-V enthusiasts all over the world. • Andes joined more than 50 major industry events around the world to promote and reach customers despite the pandemic. The events included Embedded World, RISC-V Meetup (Hsinchu, Munich, Toronto), TSMC Online Technology Symposium (China, EU, Japan, Taiwan, and US), EDN Forum, IP SoC Day Online (Shanghai, Grenoble), DAC (San Francisco), VLSI-CAD, D-Forum 2020, VLSI -DAT , RISC-V Global Forum, RISC-V Tokyo Day, RISC-V Vietnam Day, RISC-V Taipei Day , Linley Fall Processor Conference, EEPW IoT Developers Live Chat, ICCAD 2020, GSA Award Dinner, TSES Hsinchu, RISC-V 10th Anniversary, Hsinchu Science Park 40th Anniversary Celebration Ceremony, and RISC-V Summit. Recommended Reasons： Focus on CPU IP The strategic technology of CPU IP is indispensable in SoC design. Andes Technology has been devoted to developing CPU IP technology for over 16 years and it is one of the few companies in the world that provides commercial CPU IP and has customers entering mass production constantly. The annual shipment of SoCs embedded with Andes CPU cores surpassed 2 billion in 2020 and the cumulative shipments hit the milestone of more than 7 billion. Andes was selected as EETimes' Silicon 60 Hot Startups to Watch in 2012 and received TSMC OIP Award “Partner of the Year” for New IP in 2015. In 2020, Andes was awarded “Most Outstanding Embedded Processor IP Supplier” by AI Global Media. Also, its NX27V vector processor IP of AndesCore™ V5 (RISC-V) series was awarded “Hsinchu Science Park Innovative Product Award” at 40th anniversary of the Hsinchu Science Park and “Outstanding Product Performance of the Year” by EETimes (Aspencore Group) at World Electronics Achievement Awards in 2020. Comprehensive Product Lines Andes keeps driving innovation and launches comprehensive RISC-V CPU IP series, including entry-level 32-bit N22, mid-range N25F/D25F/A25/A27 and 64-bit NX25F/AX25/AX27 and high-end multicore A(X)25MP, vector processor NX27V and the latest superscalar 45-series. Its world-leading RISC-V commercial processor cores with DSP instruction set and vector extension become the best solutions for emerging applications such as 5G, AI/ML, ADAS, AR/VR, blockchain, cloud computing, data center, IoT, storage, security and wireless devices. Quality Sales and Service Andes provides quality sales and technical service by establishing branches in Taiwan, USA and China as well as having professional agents in major IC design regions including Korea, Europe, Israel for sales and customer services. Its customers include world-class companies such as MediaTek and Renesas. The diverse applications range from audio, Bluetooth, gaming, GPS to ML, MCU, sensor fusion, SSD controller, touch controller, USB 3.0 storage, voice recognition, Wi-Fi, wireless charging, etc. Active Role in RISC-V Strategic Global Planning Andes is the Founding Premier Member of RISC-V International Association (formerly known as RISC-V Foundation). Frankwell Lin, CEO of Andes, is the Board Director of RISC-V International. Charlie Su, President and CTO of Andes, is Vice Chair of RISC-V International Technical Steering Committee. Every year Andes hosts events including RISC-V CON, Meetup in Taiwan, China and USA as well as over 30 Chinese and English webinars which attracts audience around the world with more than 10 thousand views online. Andes also participates major industry exhibitions, such as Embedded World, DAC, TSMC Symposium and promotes them through social channels including Facebook, Twitter, LinkedIn, WeChat, YouTube, gaining exposure for RISC-V and the brand of Andes. Certification Test Andes Certified Engineer Test (ACET™) Program, hosted by Andes since 2013, issues nearly 200 certificates to engineers who pass the test every year as a reference of recommendation for recruitment in the industry. Fast Growing Business In ihe 100 Fastest Growing Companies of 2020 announced by CommonWealth Magazine in August, 2020, Andes is ranked 35th. Emphasis on Corporate Responsibility With emphasis of corporate responsibility and sustainable values, Andes has devoted itself to developing low power/high performance green power-saving CPU in order to increase power efficiency and protect the environment. For industry–academia collaboration, Andes has provided AndesCore™ to universities around the world for courses, research projects and established joint laboratories with many universities. The total number of contracts with universities (mainly EE and CS departments in Taiwan, China and US) is over 120 by September, 2020. Andes has also donated AndesCore™ and peripheral development platforms valued at tens of millions to numerous prestigious universities including NTU, NTHU, NCTU, NCKU in Taiwan. By establishing long term industry–academia collaboration, Andes aims to cultivate talents, communicate with higher education institutions and fulfill corporate responsibility.

• Attopsemi Technology Co., Ltd

  

  Main advantages: * 1st generation of UltraLP I-fuse™ with 0.4V/1uA read qual'd at GF22 FDX * 2nd generation of UltraLP I-fuse™ OTP worked: 0.6~1.5V/3uA read from -40C~125oC * Passed ISO 9001:2015 certified in June 2020. * I-fuse™ worked at TSMC 22nmULP process with 1.1V core voltage programmable * I-fuse™ worked at GF22nm with 1.8V I/O voltage programmable Recommended Reasons： Attopsemi has revolutionary OTP technology I-fuse™ based on non-breaking fuse concept. By programming below a catastrophe thermal runaway condition, electromigration is the sole program mechansim for high reliability, high temperature, small size, low program/read voltage, low program/read current.

• Diodes Incorporated

  

  Main advantages： Diodes Incorporated launched a complete Ultra-High-Power Density (UHPD) charger solution in 2021 with improved efficiency, higher power density, and reduced charger size. The solution consists of three IC devices. First, the AP3306 is a patented Active Clamp Flyback (ACF) PWM Controller IC with a proprietary High-Side PMOS driving topology. The innovative control rules of the device effectively improve the average and heavy load efficiency. Second, the APR340 is a Synchronous Rectification (SR) Controller specifically developed for Active Clamp Flyback operation. Finally, the AP43771V is a USB Power Delivery (PD) decoder. The device is certified by the USB-IF (TID: 4312) and supports a wide PPS output range of 3.3 to 21 VDC as well as Qualcomm's Quck Charge 5. As the key value proposition of the proposed UHPD charger solution meets practical implementation and business considerations for optimal CP value benchmark, it has been widely adopted by major charger manufacturers in Taiwan and distributors in China, Europe, and the U.S. Recommended Reasons： The AP3306/APR340/AP43771V solution provides high-efficiency and high-power density for AC/DC charger applications. The real-use case designed with this solution has a rated power output of 65 watts. Traditionally, the typical size of a charger with this power output is around 10.5 cm x 4.2 cm x 2.8 cm (length/width/height) with a volume of 123.48 cubic centimeters. The typical converter efficiency is around 90% at heavy load, and the typical standby power is around 55-60 miliwatts. Using Diodes Incorporated’s solution, designers can reduce the size to 5.2 cm x 4 cm x 2.5 cm with a volume of 52 cubic centimeters. The efficiency of the converter can reach 94% or more, and the standby power is less than 20 miliwatts. The benefits of reduced size, increased efficiency, and lower standby power allow end-users to use a more portable, energy-saving, and environmentally friendly charger.

• Infineon Technologies

  

  Main advantages: Infineon is the market leader in highly energy efficient solutions for power generation, power transmission and power consumption. We deliver solutions from microamps to megawatts with superior energy efficiency, offering highly reliable IGBTs, power MOSFETs, GaN e-mode HEMTs, power discretes, protected switches, Si drivers, GaN drivers, IGBT modules, intelligent power modules (IPMs), linear regulators, motor control solutions, LED drivers, and all forms of AC-DC, DC-DC, and digital power conversion. In the past year, Infineon had realized energy efficiency through the key achievements: - Provides CoolGaN™ to a major customer’s 3,000 W telecom power rectifier achieving an industry-leading energy efficiency of 98%. - Enables another major customer in delivering SMPS with 80 PLUS Titanium certificate with CoolSiCTM MOSFET 650 V. Recommended Reasons： - Infineon is the market leader in the total market for discrete power semiconductors and modules for 17 years in a row. - Infineon is also one of the few companies in the market offering a full-spectrum portfolio of all power technologies – silicon (Si), silicon carbide (SiC) and GaN. - Infineon is also committed to offer solutions with ease-of-use, highest quality and reliability to designers. We also continuously invest the capacity following growing market demand.

• Leadtrend Technology Corporation

  

  Main advantages: 1. To focus on technical products in the ACDC field, the product characteristics meet the customers requirements and the product line is complete, providing customers with ACDC total solutions. (for TV/MNT/Adapter/LED lighting applications) 2. Meet the requirements of the latest international regulations,including IEC62368:2018 and IEC61000-3-2 Class C Ed5.1. 3. Patented technologies contain "AI Efficiency Tracking", "PFC new architecture for ZVS/ZCS and 2nd OVP", "PFC ON/OFF by Vo, Io & Vac",etc., to achieve the vision “green your power, green the world”. Recommended Reasons： 1.ACDC total solutions for great efficiency and high power density design 2.Achieving the vision “green your power, green the world”, holding the philosophy of “Innovation, Service, Quality, Sharing”, we have innovative technology to offer products with high performance and high quality continuously. Getting closer to our customers by excellent service, Leadtrend is a major PMIC supplier accepted by world tiers customers.

• NXP Semiconductors

  

  Main advantages: NXP delivers secure and reliable distributed grid control technology – from robust processors that learn at the edge, to fast-responding analog sensors, connected by secure, time-sensitive and deterministic communications. In terms of Smart Charging Solutions,NXP provides AC/DC Primary Controllers, Secondary Side Controllers, and Secondary-Protocol Controllers Recommended Reasons： -- Broad Industrial Portfolio -- Innovation That Anticipates Market Trends

• Richtek Technology Corporation

  

  Main advantages： RT7790+ RT7208: The first Zero Voltage Switch total solution for PD Travel Adaptors. Its Zero voltage Switch reduce the switching loss during high frequency operation(130kHz~180kHz) and improve the power density. Launched 50W-120W highly-integrated Brushless DC (BLDC) Motor sIPM® solutions which integrated a sensor-less FOC MCU motor controller + 600V gate drivers + boost strap diodes + 6x 600V MOSFET in single packages.to greatly simplify BLDC motor control board designs and enhance their performance. High integration and low power power management to 5G smartphone platform released Recommended Reasons： With long-term experience in developing innovative power solutions for various applications, Richtek has been successful in winning the trust from the global well-known manufacturers/brands such as MediaTek, Huawei, Lenovo, Intel, AMD etc. We also have expended our expertise to new applications such as automotive, 5G etc. Moreover, we always listen to customers’ requirements to provide customised power solutions and technical services.

• ROHM CO., LTD.

  

  Main advantages： ROHM is an industry leader in ICs, discrete components and module products, utilizing the latest in semiconductor technology. ROHM's proprietary production system, which includes some of the most advanced automation technology, is a major factor in keeping it at the forefront of the electronic component manufacturing industry. In addition to its development of electronic components, ROHM has also developed its own production system so that it can focus on specific aspects of customized product development. ROHM employs highly skilled engineers with expertise in all aspects of design, development and production. This allows ROHM the flexibility to take on a wide range of applications and projects and the capability to serve valuable clients in the automotive, telecommunication and computer sectors, as well as consumer OEMs. Recommended Reasons： Since it was founded in 1954, ROHM has consistently pursued a guarantee rate one order of magnitude higher than the industry standard with the motto of ‘Quality First’, through comprehensive quality control and reliability management. By 1964, we already reached a defect rate for resistors of 1 in 1,000,000, compared to 1 in 100,000 with other manufacturers. Since then, we have been striving to improve the guarantee rate ahead of the industry, such as by implementing mechanization and semi-automation in all processes. ROHM has no company emblems or anthems. All thoughts and efforts are put towards achieving our corporate objective. Perhaps its greatest feature is that it is a ‘concrete living phrase’ that everyone can understand. Throughout the years, ROHM has experienced many events that underscore the importance of quality.And in order to contribute to the advancement of culture, we have established a climate that places an importance not only on products, but the people who support business activities as well. Living words generated from these experiences will become one of the pillars of our company, where they will continue to take root and maybe even passed on beyond our nation and maybe even our era.

• Texas Instruments

  

  Main advantages： As your partner in power management, TI is in constant pursuit of pushing the limits of power: developing a new process, packaging, and circuit-design technologies to deliver the best power IC devices for your energy-saving application. We’re committed to working alongside you to solve key power design challenges – increasing power density, extending battery life, reducing EMI, enhancing power and signal integrity, and making systems even safer. Our family of GaN FETs with integrated gate drivers and GaN power devices offer the most efficient GaN solution with lifetime reliability, cost advantages, and power efficiency. As the need for power efficiency becomes more and more pressing, TI technology and solutions continue to be among the leading innovations that are helping to make the world smarter and more green. To highlight, TI's new LMG3525R030-Q1 is the industry’s first automotive GaN FET with integrated driver, protection, and active power management. The 650-V automotive GaN FETs feature a fast-switching, 2.2-MHz integrated gate driver, helping engineers deliver twice the power density, achieve 99% efficiency and reduce the size of power magnetics by 59% compared to existing solutions. Using the new automotive GaN FETs can help reduce the size of electric vehicle (EV) onboard chargers and DC/DC converters by as much as 50% compared to existing Si or SiC solutions – enabling engineers to achieve extended battery range, increased system reliability, and lower design cost. Backed by more than 40 million device reliability hours and more than 5 GWh of power conversion application testing, TI’s GaN technology provides the lifetime reliability engineers require in any market. Recommended Reasons： One means to increase efficient delivery of power is to leverage new power semiconductor technologies, including gallium-nitride (GaN). Below shares how/why our new family of GaN FETs with integrated gate drivers and GaN power devices can benefit your design and earn your vote. Double power density with fewer devices: In high-voltage, high-density applications, minimizing board space is an important design consideration. As electronic systems are getting smaller, the components inside them must also get smaller and sit closer together. TI’s new GaN FETs integrate a fast-switching driver, plus internal protection and temperature sensing, enabling engineers to achieve high performance while reducing board space for their power management designs. This integration, plus the high power density of TI’s GaN technology, enables engineers to eliminate more than 10 components typically required for discrete solutions. Additionally, each of the new 30-mΩ FETs can support up to 4 kW of power conversion when applied in a half-bridge configuration. Reach the industry’s highest efficiency in power factor correction (PFC): GaN offers the advantage of fast switching, which enables smaller, lighter and more efficient power systems. Historically, the trade-off with gaining fast switching capability is higher power losses. To avoid this trade-off, the new GaN FETs feature TI’s ideal diode mode to reduce power losses. For example, in PFCs, ideal diode mode reduces third-quadrant losses by up to 66% compared to discrete GaN and SiC metal oxide silicon FETs (MOSFETs). Ideal diode mode also eliminates the need for adaptive dead-time control, reducing firmware complexity and development time. Maximize thermal performance: Offering 23% lower thermal impedance than the nearest competitive packaging, the TI GaN FET packaging allows engineers to use smaller heat sinks while simplifying thermal designs. The new devices provide maximum thermal design flexibility, no matter the application, with the ability to choose from either a bottom- or top-side-cooled package. In addition, the FETs’ integrated digital temperature reporting enables active power management, allowing engineers to optimize system thermal performance under varying loads and operating conditions.

• Vicor Corporation

  

  Main advantages： Vicor has 170+ patents on power trains, control systems, components and packaging technology, which include Factorized Power Architecture (FPA) , new power distribution architectures, Zero-Current Switching (ZCS) and Zero-Voltage Switching (ZVS) power conversion topologies, and advanced power packaging. The Factorized Power Architecture (FPA) leveraged current multiplication modules that can efficiently deliver hundreds of amperes at voltages less than 1 V. The Converter Housed in Package (CHiP) scalable packaging technology has enabled higher levels of power system efficiency and density. Recommended Reasons： Vicor has been being devoted in innovations that push the envelope of efficiency, power density, and flexibility in distributed power systems have fundamentally altered the technical and commercial landscape of power conversion technologies. To enable the highest performance in hyperscale data centers, Vicor is changing the way GPU and AI processors are powered with Vicor's factorized power on package architecture. The high-density chipset is comprised of a driver, the MCD4609, and a pair of MCM4609 current multiplier modules to supply up to 650A continuous and 1200A peak currents at sub 1v. When board real estate and system weight is a business and engineering obstacle, Vicor redefine the power density limitations of 3-phase AC, HVDC and 48V power distribution solutions, in automotive, industrial and defense markets. Solving the toughest power delivery challenges and enabling a competitive advantage for the customers can only be achieved if Vicor stays on the forefront of power architectures, conversion topologies and packaging technology.

• Arrow Electronics

  

  Main advantages: Arrow ranks #110 in the 2020 Fortune 500. Arrow was also recognized as one of the “World’s Most Admired Companies” list for the 20th time. Our strategic direction of guiding innovation forward is expressed in the company's Five Years Out brand platform. Five Years Out is a way of thinking about the tangible future, of bridging the gap between what's possible and the practical technologies to make it happen. Arrow's incredibly broad portfolio brings a unique vantage over the entire technology landscape to every conversation with every customer as we help them design, source, build and launch products that improve the quality of life for people around the world and make the benefits of innovation more accessible to all. Recommended Reasons： We help people connect with a more progressive future. One where new technologies, new materials, new ideas and new electronics make life not only different, but better. Not just faster, but smarter. Not just easier, but more inspired. Where the benefits of these technologies are accessible to the many, not just the few. Customers. Corporations. Communities. Individuals. The people who need them most. We do this by thinking and acting five years out – far ahead enough to shape the future, but close enough to make it a reality. We’re a team of builders, designers, engineers and imaginers, all bridging the gap between what’s possible and the practical technologies to make it happen. Our broad portfolio that spans the entire technology landscape helps customers create, make and manage forward-thinking products that make the benefits of technology accessible to as many people as possible.

• Avnet Asia Pacific

  

  Main advantages: During these unprecedented times, Avnet actively assumed social responsibility - taking all necessary precautionary measures to control the spread of Covid-19, and ensuring a stable and reliable supply of electronic components. We maintain close communication with customers, which allows us to understand and respond quickly to their needs in a timely manner. By leveraging our global infrastructure and broad network of supply chain and logistics partners, we maintain our service levels and maximize capacity to provide timely deliveries to customers. This enables customers to quickly restore their production capacity. As the world faces a surge in demand for medical electronic devices during the pandemic, we have prioritized the supply to medical device manufacturers to expedite the production of critical supplies and equipment. Avnet is committed to supporting the frontlines in the fight against Covid-19. As a leading global technology solutions provider, Avnet leverages its product development ecosystem and global reach to accelerate our customers’ ability to provide various technology solutions to meet the global demand of medical equipment such as ventilators and CT scanners. For example, Avnet assisted downstream customers in the design and production of a hydrogen oxygen nebulizers, which can be used for the clinical treatment of Covid-19. Avnet’s Hackster.io community has partnered with the UN Development Programme to challenge designers to create affordable technology that supports those most in need. Our element14 community has launched the “Fighting Germs” design challenge, aimed at engaging problem-solving designers and engineers to slow the spread of COVID-19. In Hunan, Avnet supported a start-up to develop unmanned vehicles, providing contactless delivery of meals to reduce unnecessary human contact and thereby effectively reducing the spread of infections. Recommended Reasons： Avnet is marking the company’s 100th anniversary in 2021, joining an elite group of companies that have reached their centennial. From its origins on Radio Row, the Manhattan warehouse district famous for its post-World War I electronics shops, to its current position as a top global distributor, Avnet has spent the last century navigating the complex technology landscape and helping its customers do the same. Throughout the years, Avnet embarked on a continuous transformation alongside the ever-evolving technology market. Resiliency, adaptability and execution have been key as Avnet continues to enable its customers and accelerate technological development through its expertise in components distribution and deep knowledge of the global supply chain. Today, Avnet is continually strengthening and evolving its core business, managing the complex global environment with diverse revenue streams that drive top-line growth while continuing to innovate and accelerate our differentiated capabilities such as digital, Avnet Integrated and IoT solutions. The company continues to help supplier partners deploy their technologies to meet end customers’ needs. Avnet is ranked #169 on the FORTUNE 500, #579 on the Forbes Global 2000, and has been named one of Ethisphere’s Most Ethical Companies for seven consecutive years. Avnet is a leading global technology solutions provider with an extensive ecosystem and a professional technical team to support customers and makers at every stage of the product lifecycle. As a value added partner, we provide design, product, marketing and supply chain expertise to help companies reduce the time, cost and complexities required to bring their products to market. Our end-to-end suite of IoT services and solutions helps companies adopt IoT strategy and technology to create a host of new digital opportunities across various industries, including retail, manufacturing, oil and gas, fleet and logistics.

• Burnon International Ltd.

  

  Main advantages: Strong supply chain, fast service. Integrate multiple product lines(24+) to provide a complete IoT application solution. Last year, a variety of Total System Solutions were provided on the NB-IoT & 4G network, covering MCU (Microchip), eSIM (Infineon), Senser (TE), 4G Module (GosucunCN), Redtea Mobile... Recommended Reasons： Achieving your goals represents our growth！

• Digi-Key Electronics

  

  Main advantages: Sustained high levels of performance for our customers throughout the pandemic, with industry leading levels of inventory in stock and available for immediate shipment. Double-digit growth in APAC. Continued expansion of new product and key suppliers adding to an already broad line card.Numerous website enhancements and improved payment terms and flexibility for customers with accounts. Recommended Reasons： Digi-Key provides access the the world's largest selection of 100% authorized quality name-brand components in stock and available for immediate shipment anywhere in the world. In addition you will find the tools and technical resources to turn your ideas into reality quickly and efficiently.

• Mouser Electronics

  

  Main advantages: Mouser Electronics, a Berkshire Hathaway company, is one of the industry’s top global semiconductor and electronic component distributors. Mouser distributes products from over 1100 industry-leading manufacturers to support the design and prototyping stages of new product development. Mouser also delivers no-minimum orders and same-day shipping along with unsurpassed customer service and localized worldwide support to design engineers and buyers, whether they need a single component or thousands of them. Mouser’s customer-focused distribution delivers tomorrow’s technology today. The company’s expansive line card consists of semiconductors, optoelectronics, embedded solutions, sensors, LED lighting and power, as well as passives, interconnects, electromechanical, circuit protection, enclosures, thermal management and wire/cable products. In other words, whatever parts engineers and buyers need for their designs, Mouser stocks them. Mouser.com provides access to millions of products from all the top brands engineers want and trust. The website quickly searches over 31 million products to locate more than 5.3 million part numbers available for easy online purchase. Mouser.com also provides millions of downloadable data sheets, application notes, and technical design information for research and engineering tools to speed design development. The site offers 20 language choices and accepts 34 different international currencies. Mouser.com also features numerous user-friendly tools, such as the Price and Availability Assistant, project manager with automatic re-order, FORTE the intelligent BOM tool, search accelerators and other time-saving services that streamline finding parts and simplify the ordering process. Selection, speed and accuracy are the foundation of the company’s 93,000 m² warehouse operations. Orders are processed 24/7 and ready to ship in 15 minutes on average for same-day shipping to more than 630,000 customers in 223 countries/territories. Mouser’s operations deliver a 5-Sigma confidence rating, or better than 99%. Recommended Reasons： With its broad product line and unsurpassed customer service, Mouser strives to empower innovation among design engineers and buyers by delivering advanced technologies. Mouser stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. Mouser Electronics’ website is continually updated and offers advanced search methods to help customers quickly locate inventory. Mouser.com also houses data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.

• WPG holdings

  

  Main advantages: 1.WPG Holdings is Asia’s No. 1 distributor of semi-conductor components, serves as a franchise partner for about 250 worldwide suppliers. About 104 sales offices around the world, WPG achieved NT$609.886 billion in 2020 revenue. Recommended Reasons： WPG Holdings is Asia’s No. 1 distributor of semi-conductor components, we have been awarded by “Global Electronic Component Distributor Awards” for 19 consecutive years. Under the new manufacturing trend, we are committed to transforming into a Data-Driven enterprise, and build an online digital platform - WPG DADAWANT. We are positioned as a LaaS (Logistics as a Service) provider to advocate smart logistics and assist our customers in facing the challenges of smart manufacturing.

• WT Microelectronics

  

  Main advantages: WT Microelectronics is a leading professional service provider focusing on the global semiconductor distribution industry. By providing superior supply chain management services to both vendors and customers, WT has successfully positioned itself as a pivotal liaison, bridging upstream and downstream partners. Aiming to co-define the product marketing strategy with upstream vendors as well as to reduce R&D pipeline for downstream customers, WT has persistently strengthened its capability to create value-added services throughout the supply chain. WT Technology has solid field application engineering support capabilities, more than 550 excellent FAE can help customers to solve product problems quickly, and support customers' products to be more quickly listed. WT currently serves as the distribution partner for over 70 global leading semiconductor partners and provides services to over 8,000 quality customers. The products we carry are broadly used in various fields, including communication, computing, consumer electronics, industry & instrument, IoT, and automotive. WT has an extensive marketing and sales channel with over 40 regional offices in Asia. Therefore, it can highly grasp market demand and technology trends and provide the most suitable supply chain services. This multi-regions and multi-sectors operation capability can support customers' better multi -regional manufacturing needs with perfect supply chain management. WT’s annual sales for 2020 totals NT$353.2 billion, an increase of 5% compared with 2019 period. In addition to the practice of management integrity, customer service, employee care, and shareholder rewards based on a good-faith business concept, we devote ourselves to carrying out corporate social responsibilities of social good, environmental sustainability, and company governance. We published the third Sustainability Reports in 2020. Recommended Reasons： According to the report of Gartner, an international market research organization, WT is the fourth largest semiconductor distributor in the world and the second largest in Asia, accounting for 19.8% of the top 10 semiconductor distributors in Asia and 27.1% of the top four semiconductor distributors in Asia. In the past five years, WT’s revenue grew at a 25% CAGR, which has outperformed the overall semiconductor market performance.

• Zenitron Corporation

  

  Main advantages: Zenitron(TSE:3028) was founded in October 1982 by Mr. Chou. Zenitron is one of the leading semiconductor distributors in Taiwan. Our mission is to provide value-added total solutions and services with leading technology in all aspects, allowing quickest time-to-market for our customers. Our main operation region is Greater China region. We provide flexibility and long-term development in local market. Zenitron focuses on 7 market domains and applications: power management systems, networking & telecommunications, consumer electronics, Industrial Control, automotive, AIOT, home appliances, retail channel. Complete and Diversified Product Lines 1. Representing active components and passive components suppliers from Europe, US and Japan with professional technology and marketing strategy. 2 .Continueously searching for product lines in response to the needs from industry's trends in the markets and product characteristics for new customers. Full Technical Support 1. More than 100 FAEs providing customers with 24/7 technical support, such as product design consulting service and electrical performance testing support. 2. Provide customers with product verification and performance debugging with a professional laboratory. 3. Provide customers with total solution to help shorten time to market. Recommended Reasons： Aside from selling components, Zenitron provides clients Turnkey solutions and design consultations service. Such service assists clients integrating resources, lower R&D time and expenses, so Zenitron's clients could launch the products to the market at faster speed. Today, Zenitron has rich and fruitful experiences in power management systems, networking & telecommunications, consumer electronics, Industrial Control, automotive, AIOT, home appliances, retail channel and so on. Accumulated nearly 40 years of industry experience 1.Fully understand market demands and business development 2.Deep partnership (Supplier/ Customer) 3.Focus on core business, create win-win situations

• AMICCOM Electronics Corporation

  2.4GHz direct-sequence spread-spectrum wireless chip

  

  A7157 supports FSK and DSSS modulation operation modes. In FSK mode, A7157 is a high-speed (4Mbps) RF transceiver chip. The maximum PA output power can be up to 17Bm.Via SPI interface user can control the operation mode and access to the built-in 512 Bytes TXFIFO and RXFIFO. When the DSSS modulation operation is enabled, the supported maximum data rate is 133.3kbps, the spread spectrum function can enhance the anti-interference ability of the A7157 and greatly increase the distance of wireless transmission. A7157 features 4Mbps mode high-speed transmission, 30 times DSSS function, built-in high-power PA and 512 Bytes TX/RX FIFO packets. Customers can configure the best transmission mode according to system application requirements. Suitable applications include Baby Monitor in the 2.4GHz frequency band, wireless audio and video transmission, high-fidelity wireless speakers, home security and drone. Using FSK modulation, 15 channels can be used. In the RF performance, the reference design of the A7157 operates with DSSS 133.3kbps, 17dBm TX Power and RX sensitivity of -100dBm. Link Budget can reach 117dB. In addition, the built-in RSSI of the A7157 can help software engineers to select a clean channel for high-speed transmission (4Mbps) and a built-in Multi-CRC to enhance the packet error detection capability. The Auto Calibration mechanism inside the chip can overcome the semiconductor process variation and can work stably in various environments. In data processing, A7157 provides packet error detection (FEC and CRC), Auto ACK and Auto Resend mechanisms to reduce the burden of software development, the packet content also supports hardware AES128 encryption and decryption. Enhancing the confidentiality of data can reduce the complexity of MCU operation for data processing. The power management of A7157 supports Sleep, Idle mode and TWOR mode (Wake up by Radio Timer). The TWOR function provides A7157 automatic wake-up to extend battery life. In Sleep mode, the current consumption of A7157 is only 5.3uA.

• CREE / Wolfspeed

  Wolfspeed WS1A3640

  

  Due to wide band, low latency and high stability requirement mMIMO had become the major architecture for 5G, Wolfspeed had developed GaN on SiC technology that specially focused on cellular infrastructure and use this technology to design mMIMO device that can support 5G requirement. The device focused on high integration, high efficiency and very good linearize capability, which make smaller lighter and highly efficient 5G mMIMO system to be possible

• Infineon Technologies

  CYW5557x Wi-Fi/Bluetooth Combo Chip

  

  Infineon’s AIROC™ CYW5557x is a highly integrated Wi-Fi 6 / 6E and Bluetooth 5.2 SoC family. CYW5557x supports Wi-Fi 6 / 6E features and is Tri-band capable (2.4G, 5G, 6G). It is available in both 2x2 or 1x1 configurations. 5557x brings exceptional high quality video/audio streaming and seamless gaming experience in congested network environment and significantly reduces latency by operating in 6G spectrum. The Infineon AIROC™ CYW5557x has enhancements to improve range, power efficiency, network robustness, and security. It is highly integrated with an on-chip power management unit, power amplifiers and low noise amplifiers to reduce total BOM cost and board space.

• Microchip Technology Inc.

  WFI32E01PC

  

  For developers designing secure IIoT systems, Microchip’s highly integrated WFI32E01PC is a Trust&GO secured platform-enabled Wi-Fi MCU module that is pre-provisioned for cloud platforms. The WFI32E01PC is compliant to Wi-Fi Alliance (WFA) specification and fully certified with the following world regulatory agencies: Federal Communications Commission (FCC), Industry Canada (IC) and European Radio Equipment Directive (RED). Microchip’s Trust&GO platform inside the WFI32E01PC streamlines the process of network authentication using secure element technology, which is preconfigured and pre-provisioned for cloud authentication. Unlike existing devices, Microchip’s new technology includes a premium PIC32 MCU core, rich peripherals and a proven hardware security platform – enabling it not only to provide Wi-Fi but also to serve as a powerful MCU core for the entire IIoT system.

• Newracom Inc.

  802.11ah HaLow SOC

  

  Industry leading 802.11ah HaLow SOC platform solution enabling next generation AI and Visional-Intelligent related applications, such as smart automation, remote access and security, autonomous vehicle and agile local area network connectivity.

• NXP Semiconductors

  AFSC5G40E38 RF Airfast RF power Multi-Chip Modules (MCMs)

  

  The AFSC5G40E38 is a fully integrated Doherty power amplifier module designed for wireless infrastructure applications that demand high performance in the smallest footprint. Ideal for applications in massive MIMO systems, outdoor small cells and low-power remote radio heads. The field-proven LDMOS power amplifiers are designed for TDD and FDD LTE systems.

• Psemi Corporation (A Murata company)

  PE43610 and PE43614

  

  Both PE43610 and PE43614 are newly released digital step attenuators which feature industry-leading attenuation accuracy, fast switching time, wider freguency band coverage and ligh linearity etc., programming modes can be serial and parallel addressable and support glitch safe attenuation state transitions.

• RichWave Technology Corporation

  The total solution for Wi-Fi 6 (802.11ax) RF front-end module (FEM)

  

  RichWave’s wide product lines of Wi-Fi 6 RF front-end modules cover high power RF FEM, middle-high power RF FEM and high efficiency RF FEM. For example, RTC7676 (5 GHz) and RTC7646 (2.4 GHz) front-end modules (FEM) are designed for middle/high-power Wi-Fi 6 (802.11ax) applications, and those modules are qualified and issued by leading reference designs. Those modules provide all the functionality of the power amplifier, power detector, low noise amplifier with bypass mode and single-pole double throw (SPDT) transmit/receive (T/R) switch. With a simple matching to the antenna and compact form factor with minimizing PCB layout area, those modules are easy to be used in WLAN applications. With very low EVM floor and higher linear output power with 1024-QAM signals, both parts can be applied for WiFi Tri-band application to enhance throughput and meeting the requirements for multi-user MIMO Wi-Fi system. And RTC7678O/RTC66504HT (5 GHz) and RTC7647O/RTC66204HT (2.4 GHz) front-end modules (FEM) are designed for high-power Wi-Fi 6 (802.11ax) applications, thereby providing powerful and robust performance. The HT series high power products with built-in coupler feature can support RF loop-back mode for DPD (digital pre-distortion) application or specific power detection function as the platform requirement of Q company. These modules have an extremely low EVM floor of less than -50dB, a linear output power of up to 22dBm with 1024-QAM signal and 27dBm MCS0 mask power. These modules are suitable for Wi-Fi tri-band high-power applications to improve throughput and operating range and meet the requirements of FCC multi-user MIMO Wi-Fi system.

• Silicon Labs

  EFRxG21B SoCs with Secure Vault

  

  Silicon Labs' EFRxG21B SoCs with Secure Vault is the first chip in the world to achieve Arm PSA Level 3 certification – PSA Certified's highest level of IoT security protection. This certification requires testing the prescribed “Hardware Root of Trust” security features in an approved 3rd party security lab against not only software attack vectors (the scope of PSA Level 2) but also hardware attack vectors (the additional scope of PSA Level 3).“Hardware Root of Trust," a proven technology, has become a highly desired feature in IoT devices as it creates an anchor to security capabilities. Secure Vault features best-in-class security including  secure boot based on hardware root of trust, secure debug, physical tamper, secure identity for attestation, and physically unclonable function (PUF) key management technology to significantly reduce the risk of IoT security breaches and compromised intellectual property. Integrating Secure Vault into our SoCs highlights our commitment to protect devices from hardware and software attacks, and it cements our leadership in IoT security. The SoC includes a 80 MHz ARM Cortex-M33 core, providing plenty of processing capability while the Secure Vault integrated security subsystem provides leading security features that greatly reduce the risk of IoT security breaches and compromised intellectual property. The SoCs also provide a robust RF link for reliable communications for Zigbee, Thread and multiprotocol applications and enables greater range and reliable RF communications. The SoC uses Simplicity Studio 5 development tools, providing easy migration and fast time-to-market with development kits, SDKs, mobile apps and our patented network analyzer.

• STMicroelectronics

  ST25DV04KC

  

  The ST25DV-I2C-EVO is an NFC Forum Type 5 certified tag with improved and extended I2C features (configurable I2C address, arbitration). It provides up to 64k-bits of EEPROM memory (40y data retention & 1Mcycles write), as well as a 256-Byte Fast Transfer Mode buffer, Energy harvesting, and multiple data protection passwords. ST's Type 5 tag also offers performance over an extended temperature range with industrial grade 8 capability, and benefits from ST's 10-year longevity commitment program.

• Texas Instruments

  CC2662R-Q1

  

  Using a new wireless protocol, developed specifically for the wireless BMS use case, TI’s wireless BMS functional safety concept addresses communication error detection and security. The proprietary protocol via the CC2662R-Q1 wireless MCU enables a robust and scalable data exchange between a host system processor and the newly announced BQ79616-Q1 battery monitor and balancer. Now automotive engineers can securely enable the industry’s best network availability. Rivaling wired connections, TI’s wireless protocol for BMS via the CC2662R-Q1 wireless MCU offers the industry’s highest network availability of greater than 99.999% and a network restart of 300-ms maximum availability. With this wireless MCU, dedicated time slots that provide high throughput and low latency protect data from loss or corruption while enabling multiple battery cells to send voltage and temperature data to the main MCU with ±2-mV accuracy and a network packet error rate of less than 10-7. Automakers can mitigate potential threats with security enablers from TI such as key exchange and refreshment; unique device authentication; debug security; software IP protection with a joint test action group (JTAG) lock; Advanced Encryption Standard (AES) 128-bit cryptographic acceleration and message integrity checks. Additionally, modern EVs are subject to multiple sources of wireless interference. They’re noisy and battery modules are surrounded by metal enclosures which can affect signal propagation. Our wireless protocol is designed specifically to address the automotive battery use case. The 2.4-GHz solution, enabled by the CC2662R-Q1 wireless MCU, helps mitigate interference and creates a more reliable connection so you are able to start your vehicle and manage your battery on-demand in real-time.

• TMY Technology

  mmWave Phased Array Module & O-RU (AiP/AiM)

  

  TMYTEK is capable of various types of antenna to work with beamformer chips in 28/39/60/77 GHz bands. Antenna BW, gain, steering coverage and polarizations are well modeled to make sure EIRP and other indexes meet the customers and markets. TMYTEK is creating ready-to-commercialize FR2 O-RU solution, 60 GHz 5G-U FWA turnkey and large-size phased array for 5G/B5G and SATCOM market to keep ahead of the curve. To realize mosaic structure to form a large array by repeating unit AiP module, integrating IF from/to RF circuits into the package is critical to have I/O pin work in IF. A mixer and BPF needed to be integrated into the package, too. ORAN opens up the opportunities for the base station ecosystem. The new split 7.2 relieves the load of the front haul network. We need the integration of Low PHY in the RU module. We are building sophisticated AiP modules.

• Vayyar

  Vayyar XRR Chip

  

  Vayyar’s newly launched “XRR” chip is the world’s first multi-range, single RFIC with a range of 0-300m. It’s designed to support ADAS and autonomous vehicle applications in passenger cars, trucks and motorcycles. Supported by a 48-antenna MIMO array, the leading-edge platform provides radar imaging with unprecedented accuracy for numerous safety applications, without the need for external processors. Vayyar’s XRR chip– AEC-Q100 qualified and ASIL-B compliant - is unmatched in terms of range, resolution, and performance. With an ultra-wide field of view and rich 4D point cloud imaging, it delivers unprecedented multifunctionality on a single-chip platform, supporting dozens of Advanced Driver Assistance Systems (ADAS), Advanced Rider Assistance Systems (ARAS) and autonomy features. This eliminates the need for multiple, costly vehicle sensors and reduces costs, complexity, hardware, software, power consumption, wiring and integration efforts. Affording a range of 0-300m, the multi-range XRR chip differentiates between static obstacles such as dividers, curbs and parked vehicles, and between different types of VRUs, moving vehicles and other hazards. In low-speed environments such as parking lots, the XRR chip’s SRR sensing supports advanced parking assistance, scanning the vehicle’s surroundings for pedestrians and obstacles. On the open road, MRR and LRR capabilities facilitate a variety of ADAS and autonomy applications such as Lane Change Assist (LCA), Adaptive Cruise Control (ACC), Blind Spot Detection (BSD), Collision Warnings (fCW/rCW), Cross Traffic Alerting (CTA) and Autonomous Emergency Braking (AEB). Compared with alternatives such as cameras, standard radar and LIDAR, Vayyar’s 4D imaging radar delivers unprecedented multifunctionality on a single-chip platform, maximizing affordability, coverage, range, resolution and robustness. The XRR chip provides real-time 4D detection, identifying and tracking numerous objects simultaneously, even in extremely challenging conditions such as heavy traffic, darkness, or fog. As automakers strive to protect motorists and their passengers, Vayyar’s multi-range XRR chip is redefining ADAS, ARAS and autonomy, making the utmost safety available to all vehicles.

• Your Health Technology Co., Ltd. (Yutech)

  YuRine

  

  For decades, cardiovascular disease (CVD) is the top cause of death in the world and the top 3 leading causes of death in Taiwan. The statistics reveal the issue of CVD mortality awaits for a useful prevention method. Due to the high mortality of CVD, the early detection of CVD is becoming a big issue. A portable and wireless urine detection system and platform for home care and community screening is proposed. It provides a telecare platform to monitor the risks of CVD and prevent the occurrence of CVD according to the detection of urine albumin and creatinine ratio (UACR). The main concept is to develop a system-on-chip, a microelectrode and microchannel chip to detect the concentration of CVD-related risk factors in urine. Data will be wirelessly transmitted to a smart application platform to evaluate user’s cardiovascular status based on the outcomes in clinical research. Users will obtain the condition of CVD and the professional medical advice from the cooperative cardiovascular doctors in NCKU hospital through the platform.

• A-China Semiconductor Ltd

  MCU007

  

  32 bit ARM M0 base MCU with PUF security function, each MCU have its natural creative 1024bits unique ID, truly random, reliable, unpredictable, unclonable. Concept like the human finger print. Good for firmware, data protection, IoT authentication, smart lock, key, ID card, cybersecurity etc. simply said, it is a most reliable key ID.

• Artery Technology Company

  ARTERY AT32F407 High-performance M4 MCU

  

  AT32F407 series microcontrollers, based on 32-bit ARM® Cortex®-M4 core, utilize advanced process to achieve 240 MHz computing speed. The embedded single precision floating-point unit (FPU) and digital signal processor (DSP), various peripherals and flexible clock control mechanism can meet a wide range of applications. It also features up to 1 MB Flash memory, 224 KB SRAM and Flash access zero wait, far beyond the same level of chip industry. In addition, AT32F407 series also imports the Security Library to support the use of passwords to protect the specified program area, in which IDH programs the core algorithm and provides to downstream customers for secondary development. Moreover, there are eight sets of UART serial interfaces, two sets of CAN buses and compatible IEEE-802.3 10/100 Mbps Ethernet port controllers available to suit for IoT applications. The USB device applications, without the need of external crystal oscillators, can reduce costs while enhancing the reliability of end products. AT32F407 devices not only perform well in the temperature range of -40 to 105°C , but also offer a variety of chips for selection in response to diverse memory requirements. Through its powerful on-chip resource allocation, high integration and cost-effective performance, they are able to maintain its competitive edge in terms of design solutions with high computing demands.

• ELAN Microelectronics Corp.

  32-bit Encrypted Fingerprint Identification Chip

  

  With the expansion of fingerprint applications, fingerprints have been widely used for security protection, from electronic payments, access control systems, mobile phone unlocking to smart card applications. Smart cards are combined with fingerprint chips, MCU, and SE for ID cards and payment cards. ELAN Microelectronics takes the lead in leveraging its unique advantages in software and hardware integration, launching a fingerprint chip with extremely low power consumption, high anti-static function and an MCU chip with extremely high security mechanism. This MCU chip has advanced encryption technologies such as ECC 2048, RSA2048, AES256, etc. ensuring that fingerprint feature information is not easily leaked and stolen in communication and transmission. Fingerprint sensors have become smaller with complex calculations for algorithms therefore our MCU has built-in hardware accelerator with industry-leading unlocking speed of less than 1-second and to enhance user experience. Due to increase in credit card fraud during COVID-19, ELAN has already deployed Artificial Intelligence (AI) anti-spoof technology in smart cards, and used AI technology Deep Learning training with tens of thousands of real fingerprints and fake fingerprint galleries. The algorithm continues to evolve so that it can easily distinguish between real and false fingerprints. In this small chip, all the complex operations of fingerprint recognition can be completed without relying on the chip of platform. Accurate identification, security, speed and system compatibility have surpassed industry standards. ELAN has launched the world’s first battery-based biometric fingerprint card to South Korea’s Woori bank a few years ago, and recently launched ultra-low power a battery-free contactless card. ELAN continues to improve with the third generation with improved chip sensitivity and streamlined the back-end production process of card makers for cost down hot lamination. The MCU is equipped with ELAN's AI Anti-Spoof technology and a biometric smart card that meets EMV and ISO financial high security levels, as well as MasterCard certified, it provides customers not only with the most secured fingerprint solution, but also reducing card fraud and improving user convenience.

• ENE TECHNOLOGY INC

  Gaming RGB MCU

  

  ENE Gaming RGB MCU is perfect for the RGB LED light effects on gaming PCs. Applications including MB/VGA/DRAM/SSD/FAN etc. ENE Gaming RGB MCU can also be installed on gaming peripheral devices to enhance the surroundings for players such as mouse, pad, chair and table… etc. ENE Gaming RGB MCU is able to present more than 20 RGB LED effects including static, breathing, flashing, rainbow, color-cycling and many variations. ENE Gaming RGB MCU adopts cortex-M0 process and is equipped with USB2.0, SPI and SMBus interface. It accommodates maximum of 48 PWM IOs with maximum input current of 320mA. There is no need for external drivers and circuits nor BJT/MOSFET devices.

• Fortior Technology (Shenzhen) Co., Ltd.

  FU6832

  

  FU6832 is the latest generation motor drive control dedicated chip of Fortior Technology. The chip integrates a dedicated motor drive engine core (ME for short) and an universal 8051 core. The dual-core drive is fast in calculation and high in reliability. Among them, ME is independently developed by Fortior Technology with independent IPs. The chip integration is very high, and the main peripherals are as follows: The peripheral resources of ME: 1. Built-in 3P3N Pre-driver; 2. 3-channel operational amplifier, its OA 0 can be configured with magnification; 3. 3-way comparator; 4. ADC has up to 14 channels, built-in reference VREF; 5. DAC has 2 channels; 6. Built-in hardware multiplier and divider MDU, PI/PID, CORDIC, LPF low-pass filter and other operation units The peripheral resources of the universal core (8051): 1. Built-in clock: fast clock 24MHz, slow clock 32.8KHz 2. Flash: 16K; RAM: 1K 3. GPIO max 35 4. 4 levels of interrupt priority, 15 interrupt sources 5. 6 timers 6. Communication interface: 2 UART, 1 SPI, 1 I2C 7. 2 Channel DMA 8. 1 watchdog FU6832 has a variety of motor drive modes: 1. Sensorless FOC mode: support single/double/three resistance current sampling mode 2. Sensorless square wave mode: support 120 degree and 150 degree sensorless square wave mode 3. Sensor FOC mode, sensor SVPWM mode, sensor square wave mode Motor drive dedicated chip FU6832’s working environment temperature range is -40  105 °C (TJ is 150 °C). Typical applications: cooling fans, vacuum cleaners, sweepers, ceiling fans, floor fans, forced exhaust, electric drills, electric wrenches, low-pressure water pumps, exhaust fans, etc.

• GigaDevice Semiconductor Inc.

  GD32E5

  

  The GD32E5 series of MCUs are based on the newest Arm® Cortex®-M33 core design and are built with TSMC’s low-power 40nm embedded flash memory technology. The processor frequency can reach up to 180MHz, built-in hardware multiplier/divider and provides a complete DSP instruction set and single-precision floating-point arithmetic unit (FPU) , are also equipped with a new hardware trigonometric function accelerator (TMU), which can support vector, sine and cosine, exponent, square root, common logarithm and other mathematical trigonometric operations to reduce the burden on the CPU And improve processing efficiency. GD32E5 has a built-in innovative ultra-high-precision timer (SHRTimer), which has 5 independent counters inside, which can generate 5 groups of 2 PWM control signals with dead zone complementary outputs, the frequency can reach up to 11.5GHz, and the resolution is the fastest Only 90ps, the highest performance can reach 244DMIPS, and the CoreMark® test can reach 547 points. The GD32E5 series of MCUs include 4 product series, including GD32E503, GD32E505, GD32E507 and GD32EPRT, and 23 model choices. The software and pins of each series are perfectly compatible, and the excellent flexibility fully releases the excellent potential of the Cortex®-M33 core. The GD32E5 series of MCUs have industry-leading processing capabilities, power consumption efficiency, connection characteristics and more economical development costs, and further promote the expansion of embedded development to the high-precision industrial control field, solving digital power supply, motor frequency conversion, measuring instruments, mixed signal processing, High-end consumer applications and other functional integration and workload requirements.

• Infineon Technologies

  PSoC 6 Programmable SoC solution

  

  The PSoC 6 family is built on an ultra-low-power architecture, and the MCUs feature low-power design techniques to extend battery life up to a full week for battery powered applications. The dual-core Arm® Cortex®-M4 and Cortex-M0+ architecture lets designers optimize for power and performance simultaneously. Using its dual cores combined with configurable memory and peripheral protection units, the PSoC 6 MCU delivers the highest level of protection defined by the Platform Security Architecture (PSA) from Arm. Designers can use the MCU’s rich analog and digital peripherals to create custom analog front-ends (AFEs) or digital interfaces for innovative system components such as MEMS sensors, electronic-ink displays. The PSoC 6 MCU features the latest generation of industry-leading CapSense® capacitive-sensing technology, enabling modern touch and gesture-based interfaces that are robust and reliable. PSoC 6 MCU, paired with Infineon’s AIROC™ Wi-Fi, AIROC™ Bluetooth, or AIROC™ combos radio modules, is the perfect solution for secure, low-power, feature-rich IoT products.

• Megawin

  MG82F6D32/64

  

  The MG82F6D32/MG82F6D64 MCUs keep the advantages of the hot-selling product MG82F6D17. In addition to expanding Flash Size and Ram Size, the new devices also increase the number of ADC/UART sets in response to IoT requirements. The newly added functions include: OBM, ACMP and Duty Capture...etc. The MG82F6D32/MG82F6D64 MCUs are embedded with up to 4 sets of UART, which can be connected to a variety of sensors. Megawin’s exclusive ”HW Duty Capture” can capture high-speed PWM signals. The devices also provide EMB to expand NAND/8080 LCM interface. The MG82F6D32/MG82F6D64 MCUs are equipped with 144Mhz high speed PWM, which reduces both inductor size and charge and discharge ripple, and also enables higher resolution for frequency adjustment. Furthermore, the ADC is upgraded to 12bit with a maximum speed up to 1.2Mbps. Megawin also provides complete IP Wizard to speed up customers’ project development. There are QFN32, LQFP32, QFN48, LQFP48, and LQFP64 for customers to choose from. All package types are pin-to-pin compatible with previous MCU series. The MG82F6D32/MG82F6D64 MCUs are especially suitable for industrial control applications such as mobile phone screens, electric tools, auto-reclosing, wireless charging, electric meters, and household appliance applications (including access control system (video intercom), range hoods, water heaters, window cleaning machines, beauty apparatus etc.). Especially, the built-in CRC (Cyclic Redundancy Check) for home appliances ensures that there will be no risks to users because safety-check function is executed from power- on, and also make product meet IEC-60730-compliance which is the necessary requirement for exporting to European. Please contact Megawin’s distributors or Sales for more information on detailed specifications and sample requirements.

• Microchip Technology Inc.

  The TrustAnchor100 (TA100)

  

  The TA100 provides an alternative in-vehicle network architecture implementation for secure boot and message authentication — and has already been approved by multiple OEMs around the world as a solution for EVITA Medium and EVITA Full HSM requirements. Its feature set was designed based on careful review of several prominent OEM cybersecurity specifications to help facilitate a Tier 1’s pursuit of OEM Part Production Approval (PPAP). Additionally, Microchip offers security specification and Request for Quote (RFQ) review services to assist Tier 1s in developing educated responses, improving their project award success rate. The TA100 removes the challenges associated with secure code development and provisioning by offering pre-programmed cryptographic internal application code provisioned with unique asymmetric key-pairs and associated x.509 certificates — reducing risk, cost and time to market. The device is confirmed with high resistance to attack through intensive third-party vulnerability assessments. It is AEC-Q100 Automotive Grade-1 qualified, FIPS 140-2 CMVP Security Level 2 rated and Physical Key Protection Level 3 certified, and it has achieved the highest possible vulnerability assessment rating of Joint Interpretation Library (JIL) High. In addition, the TA100 provides software components like AUTOSAR drivers, MCALs and Microchip’s CryptoAuthentication™ library that allow seamless integration into the industry standard operating system, AUTOSAR, or customized software stacks for crypto functions.

• Nuvoton Technology Corporation

  NuMicro® M2354 Series

  

  Arm® Cortex®-M23 TrustZone® Technology 8 regions MPU_NS (for non-secure world) 8 regions MPU_S (for secure world) 8 regions Security Attribution Units (SAU) Implementation Defined Attribution Unit (IDAU) 3 KB OTP ROM with additional 1KB lock bits Hardware Crypto Accelerators (AES, RSA, ECC with Side-Channel Attacks and Voltage, Clock Fault Injection countermeasures) CRC calculation unit Up to 6 tamper detection pins 96-bit Unique ID (UID), 128-bit Unique Customer ID (UCID) Arm® Platform Security Architecture (PSA) and Trusted Base System Architecture-M (TBSA-M) supported

• NXP Semiconductors

  i.MX RT1170 Crossover MCU Family - First GHz MCU with Arm® Cortex®-M7 and Cortex-M4 Cores

  

  i.MX RT1170 crossover MCUs are part of the EdgeVerse™ edge computing platform and are setting speed records at 1 GHz. This ground-breaking family combines superior computing power and multiple media capabilities with ease of use and real-time functionality. The dual core i.MX RT1170 MCU runs on the Arm® Cortex®-M7 core at 1 GHz and Arm Cortex-M4 at 400 MHz, while providing best-in-class security. The i.MX RT1170 MCU offers support over a wide temperature range and is designed for consumer, industrial and automotive markets.

• Renesas

  RX Functional Safety Solution

  

  Renesas provides RX MCU devices toghether with Certified SW package including UM, Guideline and Dev Tools in order to complete customer's redundant safety system which customer can shorten certification process (for example from 2~3 years to 1 year) 1. SIL3 System Software Kit 2. Self-Test Software Kit 3. FSoE Application Software Kit 4. Reference Document 5. Reference Hardware Board 6. Certification Kit for Compiler Premium certified solutions for easier & faster safety system development by RX MCU.

• Shanghai MindMotion Microelectronics Co., Ltd.

  MM32SPIN0280 Series MCU Product

  

  MindMotion's new part MM32SPIN0280 MCU is desgin for motor drive and control application. It's ARM Cortex M0 with 96MHz and PWM can achieve 192MHz. The package supports QFN20 & TSSOP20 for small form factor application. We also support 3MIPS 12-bit ADC when the package is LQFP64. Key features on MM32 SPIN0280 MCU: •Working voltage 2~5.5V • 8KB SRAM and 128KKB FLASH • Tempataure range is -40°C~105°C • Dedicated 3MSPs 12-bit ADC x 2 with 16 channel • Comparator integrated filter feature x 5 with 11 channels • UART x 3 and multi-address I2C & SPI

• Shenzhen Red Core Microtechnology Development Co., Ltd

  AS300

  

  AS300 Details 　　The AS300 is a low-cost, low-power 32-bit RISC architecture SOC designed for dynamic password applications, with on-chip integrated 32K byte OTP (programmable at once), 16K byte ROM (mask), and 3K byte RAM, OTP, and ROM zones for code storage. The AS300 operates at a typical operating frequency of 800KHz and is integrated with a ring vibration labeled 800KHz to provide the processor with a master clock running at full speed or to switch to RTC's 32.768KHz clock as needed to reduce the dynamic power consumption of the system. A variety of on-chip peripherals are integrated on the AS300, including 16 GPIos, 1 SPI serial peripheral interface, 1 4x32 segment LCD controller, 1 24-bit timer T0, one RTC, and one BVD for battery detection module. SM3 software algorithms are supported on AS300 chips. Applications The AS300 is a low-cost, low-power 32-bit RISC architecture SOC designed for dynamic password applications that supports SM3 algorithm. Main applications: Dynamic passwords.

• Silicon Labs

  EFM32PG22 MCUs

  

  FM32PG22 (PG22) 32-bit microcontroller unit (MCU), a low-cost, high-performance solution with an industry-leading combination of energy efficiency, performance and security. With easy-to-use, cost-efficient analog capabilities, the PG22 MCU is ideally suited for rapid development of consumer and industrial applications with demanding size constraints and low-power operation requirements. Market demand for high-volume, low-powered IoT products continues to grow at a rapid rate. PG22 is an optimized 32-bit MCU, at a price point typically associated with the 8-bit MCU market, providing form factor and code compatibility with its wireless counterparts. PG22 offers best-in-class 32-bit MCU performance through a unique mix of product features including: • Ultra-low-power – 27 µA/MHz Active and 1.1 µA EM2 with 8k RAM retention • Arm® Cortex®-M33 core running at 76.8 MHz • 64k / 128k / 256k / 512k Flash options with 32k RAM • Compact package options – 5 mm x 5 mm QFN40 (26 GPIO) or 4 mm x 4 mm QFN32 (18 GPIO) • Best-in-class device security including secure boot with Root of Trust and Secure Loader (RTSL) • Wide range of peripherals such as 16-bit ADC, PDM, built-in sleep crystal and temp sensor PG22 is pin- and software-compatible with the award winning EFR32xG22 wireless SoCs (BG22, MG22 and FG22), allowing designers to leverage a scalable embedded platform to simplify product development and help drive cost efficiency. Offering 100 percent form factor and code alignment with xG22 SoCs, developers can take advantage of application sharing and a drop-in upgrade path to Bluetooth Low Energy (LE), Zigbee or Proprietary (2.4 GHz) wireless connectivity.

• Silicon Motion, Inc.

  SM768 Graphics Display SoC

  

  SM768 is a high performance graphics processor which provides dual display channels and supports multiple output interfaces, including HDMI, DisplayPort, DVI, VGA, LVDS and digital interfaces. SM768 has 128-bit graphics engine to accelerate graphics displays and provides color space conversion and scaling features. Display resolution supports up to 4K UHD (3840x2160@30p) or 2K/Full HD@60p. SM768 supports H.264/MJPEG hardware video decoding. There's also an option to embed 256MB DDR3 memory into a single 19x19mm package. SM768 connects to host via USB 3.0 device interface or PCIe 2.0 interface and can support various applications, ex: USB display, thin/zero client, signage and embedded displays. Silicon Motion’s Content Adaptive Technology (CAT™) use adaptive algorithms to compress content and can send through USB or network for displays. Compared to competing devices, Silicon Motion’s Graphics SoC offers much lower host CPU loading for an unimpaired user experience. This is backed by the excellent picture quality provided by the CAT compression feature, low latency in dual-display mode, low power consumption and compact dimensions. The architecture also enables OEMs to implement complete docking station and other product designs with few external components. The USB and CAT software as well as a real-time operating system run inside the SM768. The device also provides four USB 2.0 channels for connecting Human Interface Devices such as a wireless keyboard, mouse and dongle as well as a printer. This explains how it is able to support the latest docking station and dongle designs which are helping to bring greater flexibility, convenience and portability to many types of computing equipment in the home, office, store and factory. It is also worth noting that the same SM768 device also features a PCI-e interface for use with other types of hosts, enabling OEMs to develop designs both for the USB market and for other applications.

• STMicroelectronics

  STM32H7

  

  The STM32H7 high-performance family operates at up to 480 MHz in Dual-core (Cortex-M7+M4) configurations and at up to 550 MHz in Single-core (Cortex-M7) configurations. It includes security services such as crypto/Hash, SBSFU, SFI,.., OTFDEC for external-memory protection. Highy integrated peripherals support TFT, MIPI-DSI, JPEG codec, Chrom-ART accelerator, Chrom-GRC, OctoSPI, Ethernet , CAN-FD, 16-bit ADC, Comparators , Op-Amps for a wide range of different applications.

• Texas Instruments

  C2000™ TMS320F28002x MCU

  

  C2000™ TMS320F280025C is a 32-bit real-time microcontroller that achieves maximum efficiency with a lower system cost in industrial and automotive power control applications, including power delivery, grid infrastructure, motor drives and EV/HEV. TMS320F28002C MCUs feature advanced analog integration that includes 12-bit ADCs with advanced timer synchronization, DACs and comparators. Analog components combined with configurable logic, post-processing hardware and pulse-width modulation (PWM) deliver high performance real-time control to power delivery systems while simplifying designs. TI’s high-resolution PWM timer enables power delivery designers to implement the most advanced switching techniques and works seamlessly with SiC and GaN technologies to maximize power density in their applications. TMS320F80025C MCUs also feature a 200-Mbps Fast Serial Interface (FSI) that facilitates high speed data communication over an isolated interface to connect multiple real-time control MCUs, resulting in lower cost, modular designs of power stages and scalability of power levels. C2000 TMS320F28002x devices can be evaluated easily with the LauchXL-F280025C low-cost development board.

• Your Health Technology Co., Ltd. (Yutech)

  YuSound

  

  When mentioning the cardiac auscultation in hospital, it is important but difficult to distinguish efficiently between the first heart sound (S1) and second heart sound (S2). The identification of S1 and S2 will affect the judgement of the additional heart sound and murmurs. The accuracy of auscultation relies on the experience of the doctor. In order to assist doctors in making diagnoses more rapid and accurate, our technical team develops the smart stethoscope which is capable of measuring the ECG signal and the heart sound signal at the same time. These two signals will be displayed on the smart phone and the phase of the heart sound signal can then be confirmed. To eliminate the uncertainty and reduce the demand for experience, the doctors may refer to these waveforms for diagnosing the potential heart disease by taking advantage of signal visualization.

• Analog Devices, Inc.

  LT8650S、LT8652S and LT8653S Series

  

  dual-channel 4A/8.5A/2A synchronous step-down Silent Switcher® converters targeted for automotive, communications and solid state drive power supplies. The proprietary Silent Switcher 2 architecture along with spread spectrum frequency modulation ensures PCB layout robustness to achieve ultra-low EMI performance that easily meets CISPR25 emissions. The LT8650S, LT8652S and LT8653S are also differentiated with their stackable-friendly outputs for higher current applications. Outputs can be paralleled to scale up or down the output current based on the system need while optimizing thermal performance. This also helps to minimize inventory and qualification time with a single device. LT8650S/LT8652S/LT8653S Key Features: • Silent Switcher 2 Technology with Integrated Bypass Capacitors meets CISPR25 Emissions • Ultralow Quiescent Current Burst Mode® for Light Load operation • Up to 12A (LT8652S) on one channel • Adjustable and Synchronizable Frequency (300kHz to 3MHz)

• AOS (Alpha & Omega Semiconductor)

  AOS Automotive-Grade αSiC MOSFET for EV Application (Part Number:AOM033V120X2Q)

  

  The AOS development team had over 30 years experience for SiC MOS/ SBD, named as the αSiC. we develop the state of art 150mm wafers in AITF16949 qualified Fab & assembly house. We had released 1200V planar Silicon Carbide MOSFET base on 3.5mohm-cm2 Rds*A and also have own-design technology to achieve <2.5mohm-cm2 Rds*A to compete with the Trench technology in the 650V device. In addition, the AOS’s αSiC has best-in-class electrical performance such as lower ration of Rds,on v.s. temperature rise, lower Qgd/ Qgs ratio to reduce false trigger when operated in the bridge topology. And also provide lower internal gate resistor to optimize the EMI and turn-on switching energy. In 1st quarter of 2021, AOS release the 1st SiC MOS with AEC-Q101 qualified product – AOM033V120X2Q, which has TO-247-4L enhanced package with integrated kelvin sourcing pin and dedicated for XEV applications, such as OBC (On Board Charger), DC2DC, Charger Station, and traction inverter. Base on features, we bring benefits of high reliability, robustness and quality for customer’s design and work together to join the trend of XEV new era.

• Bourns Inc.

  TBU® high-speed protectors

  

  Bourns TBU-CA-Q High-Speed Protector series are low capacitance single bidirectional high-speed protection components, constructed using MOSFET semiconductor technology, and designed to protect against faults caused by short circuits, AC power cross, induction and lightning surges. ■ Precise and fast over-current protection ■ 1000x faster than conventional fuse/PTC ■ Precise trigger current than conventional fuse/PTC

• Champion Microelectronic Corp.

  Dr. Flyback

  

  Dr. Flyback is the industry first Resonant Flyback controller with integrated a High-Side 650V/4A Super Junction MOSFET (SJMOS). Different from the passive snubber circuit (lossy snubber) used in the traditional Flyback system, Dr. Flyback uses an active snubber circuit (lossless snubber) to make more effective use and treatment of the extra energy (leakage inductance and stray components) on the Flyback system (energy recycling). Benefit from the unique control strategy, Dr. Flyback system’s both power switches (High-Side MOSFET and Low-Side MOSFET) are Almost Always Zero Voltage Switching (ZVS). Therefore, the switching loss of the power switches can be minimized and the efficiency can be optimized. As the results, its efficiency is ~2% higher than the traditional Quasi-Resonant (QR) Flyback topology. And only by using SJMOS power devices and the common materials of the traditional Flyback system, a high efficiency and high power density Flyback power system can be easily realized. Dr. Flyback can also be used in conjunction with GaN or SiC to meet higher frequency power system design requirements.

• CREE / Wolfspeed

  Wolfspeed MOSFET C3M series (Gen.3 650V/1200V)

  

  The market has heard for many years about wide bandgap product roadmaps and concepts. We showcase SiC devices that are widely used, and how they solve real issues: system-level examples adopted and working in the market -- today touting that many possibilities could be available. This reference design demonstrates the application of Wolfspeeds 1200V C3M™ SiC MOSFETs to create a 22kW Bi-directional High Efficiency DC/DC Converter for electric vehicle (EV) on-board (OBC) and off-board fast charging applications. The use of 1200V C3M™ 32mOhm SiC MOSFET’s in a TO- 247-4 package provides the best figure of merit (FOM), best of boustness and reduces switching loss.

• Diodes Incorporated

  AP3306

  

  The AP3306 and APR340 from Diodes Incorporated are patented PWM Controller IC and companion SR Controller, used as the key parts of an Active Clamp Flyback converter solution for UHPD USB PD applications for mobile phones or notebook PCs. The USB-IF introduced USB PD and USB Type-C® Connectors with the goal to provide a common standard for chargers. The standard is aimed to provide portability and reduce waste caused by chargers from different electronic product manufacturers. The device implements a proprietary High-Side PMOS driving topology, which can simplify the traditional and complicated NMOS driving topology. The AP3306 adopts innovative control rules, which effectively improve the average and heavy load efficiency. The designers can design more efficient chargers using the AP3306 as part of the solution. End-users can benefit from a more portable charger that consumes less power and is cooler during charging or standby mode.

• Diodes Incorporated

  AP3306

  

  The AP3306 from Diodes Incorporated is a patented PWM Controller IC that is used as part of an Active Clamp Flyback converter solution for USB PD application. The USB-IF introduced USB PD and USB Type-C® Connectors with the goal to provide a common standard for chargers. The standard is aimed to provide portability and reduce waste caused by chargers from different electronic product manufacturers. The device implements a proprietary PMOS driving topology, which can simplify the traditional and complicated NMOS driving topology. The AP3306 adopts innovative control rules, which effectively improve the average and heavy load efficiency. The designers can design more efficient chargers using the AP3306 as part of the solution. End-users can benefit from a more portable charger that consumes less power and is cooler during charging or standby mode.

• ENE TECHNOLOGY INC

  IO363AF USB-C Alt Mode Combo Adaptor

  

  ENE IO363AF is DFN-8 packaged with tiny footprint that facilitates the PCB design and layout to accommodate high speed video trace routing in a space-limited enclosure. IO363AF supports C-to-DP/HDMI (4 lanes) or C-DP/HDMI (2 lanes) plus C-USB3.0 Type-A downstream port. With the additional USB3.0 Type-A downstream port in place, the traditional C-to-Video dongle can be easily upgraded to a Video/Hub combo device without adding a USB Hub chip. The IO363AF’s firmware has been pre-programmed before shipping to save manufacturing labor cost, and can be field upgradeable by customer request, if needed.

• Infineon Technologies

  XDPE132G5D Digital PWM Controller

  

  As CPU current requirements increase to enable next generation AI and networking workloads, DC-DC voltage regulators (VR) need to deliver more than 500 A to the load. With a true 16-phase digital PWM engine and an improved advanced transient algorithm, the XDPE132G5C controller addresses these high phase count requirements. The true active current sharing between phases enables a reliable, compact and cost-saving design. Furthermore, there is no need for extra logic doubler ICs commonly utilized in today’s high phase count markets. Leading edge ASIC’s and FPGA’s in communication systems are requesting V out control of less than 1 mV steps. This is inherent in the XDPE132G5C, offering fine V out setting in 0.625 mV increments. In addition, it supports communication market auto-restart requirements with options to reduce remote site maintenance following power or system glitches. The XDPE132G5C is packaged in a 7 mm x 7 mm 56-pin QFN to accommodate 16 phases. It employs a full digital and programmable load line and is PMBus 1.3, I2C, AMD SVI2, Nvidia PWM and AVS compliant delivering a comprehensive suite of telemetry features. Paired with TDA21475, the industry’s most thermally efficient integrated current sense power stage, the XDPE132G5C controller can efficiently deliver over 1000 A.

• LA Semiconductor

  3-5-cell Lithium-Ion Battery Monitor IC

  

  As battery capacities increase and motors become more efficient, electronics traditionally powered by AC are now portable. Monitoring the batteries used inside these portable electronics is critical to maintaining performance and safety. LA Semiconductor’s LAB0100 is used to monitor the cell voltages of a string of 3-5, series connected, lithium-ion rechargeable batteries. The LAB0100 offers best in class low quiescent current of 5μA max with less than ±300nA of current mismatch between cells, reducing self-discharge to the order of magnitude of self-leakage currents. Protection features include individual cell monitoring for over-voltage and under-voltage conditions, and 5 LED drivers for charge status and fault indication. The LAB0100 comes in a 16 pin TSSOP package. LA Semiconductor’s battery monitor and protection products work to keep optimal performance and safety for portable power electronics.

• Leadtrend Technology Corporation

  LD9174E2 + LD8925F2

  

  1. PSR CCM+QR a.18W~24W for COMBO 2. Dynamic Response a. primary to secondary communicate b.PSR Meet 0% to 100% Load for Vo ± 8%. (tolerance similar to SSR) 3. Wire loss Compensation a.Improve Cable cost. (SSR can't improve output voltage at max. Load) 4. Improve 10%Load & Power Saving Efficiency a.Communicate with synchronous rectifier – PSR Sleep mode b.Implements low power consumption without HV component, P.S. <50mW 5. Low Line Ripple Compensation a.This function cannot be implemented in SSR either. 6. Less parts in design

• MICROTEST Corporation

  HV Wiring Harness Test System 9804

  

  For high-energy Electric Vehicle Charing Connector Testing System, Microtest provides high-quality beam-line high-voltage integration testing and ideal customized solutions. 9804 Features ‧ High-precision four-wire measurement,low resistance:1mΩ ‧ Up to 128 channels withstand voltage test ‧ Computer program control ‧ Test data, storage reporting function ‧ Conductance / open / short / withstand voltage test measurement ‧ component measurement function - capacitor / diode /resistance ‧ Support automatic printing and scanning barcode function ‧ Multi-channel measurement improves electrical measurement efficiency ‧ One stop for testing conductor resistance、high-voltage components ‧ Automatic learning and pin search function

• ROHM CO., LTD.

  SiC MOSFET---SCT3xxx xR series

  

  The SCT3xxx xR series utilizes a 4-pin package (TO-247-4L) that maximizes switching performance, making it possible to reduce switching loss by up to 35% over conventional 3-pin package types (TO-247N). This contributes to lower power consumption in a variety of applications. In recent years, the growing needs for cloud services due to the proliferation of AI and IoT has increased the demand for data centers worldwide. But for servers used in data centers, one major challenge is how to reduce power consumption as capacity and performance increase. At the same time, SiC devices are attracting attention due to their smaller loss over mainstream silicon devices in the power conversion circuits of servers. Furthermore, as the TO-247-4L package enables to reduce switching loss over conventional packages, it is expected to be adopted in high output applications such as servers, base stations, and solar power generation.

• STMicroelectronics

  ACEPACK DRIVE (Automotive-grand ACEPACK DRIVE power module)

  

  The ACEPACK DRIVE is a compact sixpack module optimized for hybrid and electric vehicles traction inverter. This power module features switches based on silicon carbide Power MOSFET 3rd generation, are characterized by very low RDS(on), very limited switching losses and outstanding performances in synchronous rectification working mode. This will ensure superb efficiency in final application, saving battery recharging cycles. A copper base plate with pin-fin base structure make direct fluid cooling available for this power module minimizing thermal resistance. A dedicated pin-out has been developed to get the best switching performances and press-fit pins will ensure optimal connection with driving board. ACEPACK DRIVE power modules belong to our STPOWER family. The ACEPACK DRIVE is a compact six-pack module optimized for hybrid- and electric-vehicle traction inverters. This power module features 3rd generation silicon carbide (SiC) Power MOSFET switches that are characterized by very low RDS(on), very limited switching losses, and outstanding performance in synchronous-rectification working mode. These characteristics ensure superb efficiency in the final application, reducing power consumption and battery-recharge cycles. A copper base plate with pin-fin base structure makes direct fluid cooling available for this power module, minimizing thermal resistance. ST has developed a dedicated pin-out to optimize switching performance. Press-fit pins ensure optimal connection with the driving board. ACEPACK DRIVE power modules belong to our STPOWER family. Features •AQG 324 qualified •1200 V blocking voltage •1.9 mΩ of typical RDS(on) •Maximum operative junction temperature TJop = 175°C •Very low switching energy •Low inductive compact design for the higher power density •Si3N4 AMB substrate to improve thermal performance •SiC Power MOSFET chip sintered to substrate for improved lifetime •4.2 kV DC 1 s insulation •Direct cooled Cu base plate with pin fins •Three integrated NTC temperature sensors •Long AC bus bar compatible with phase current sense

• Suzhou NOVOSENSE Microelectronics Co., Ltd.

  Digital isolation chip NSiP884x with integrated isolated DC/DC power supply

  

  NSiP884x are based on NOVOSENSE NSPower® technology, which integrates an isolated DC/DC power supply circuit with an on-chip transformer and four-channel high-speed digital isolation. Users only need to add two filters to the power input and output. Capacitors can achieve power isolation and signal isolation. The fully integrated solution greatly reduces the user's development difficulty, saves user development time, and helps users to bring products to the market faster. NSiP884x adopt standard SOIC16 traditional packaging, and the manufacturing process is stable and controllable. They have passed strict high voltage resistance test and performance parameter test before leaving the factory. The products have the characteristics of high consistency and high reliability, and are suitable for extremely high reliability requirements. Application environment such as in-vehicle.

• SYNC POWER CORP.

  SP6892

  

  •Integrate QR and SR into one single chip •Work with any SR MOS •Adapter output voltage is not limited •Internal direct control of SR drive signal for rapid response to avoid cross-over problems in various applications •Reduce noise issues caused by PC board layout and easy adjustment for absorption circuits •Standard package •Provides various protection functions such as OVP, OLP, SCP, OTP etc.

• TDK

  Power inductor CLT32

  

  TDK has opted for an innovative design principle for the new CLT32 series of power inductors. This involves a solid copper coil being over-molded with a special ferromagnetic plastic compound. This technology is hugely beneficial thanks to the fact that the coil core and the housing are created simultaneously.Another benefit of the new design is that there is none of the usual internal connections as the ends of the coil are already designed as terminals. This design principle offers two significant benefits for automotive applications in particular: It significantly increases the reliability and, it helps to achieve extremely low RDC values.Thanks to the innovative design concept, the inductors of the CLT32 series require a footprint of just 3.2 x 2.5 mm2 with aheight of 2.5 mm. This means that their space requirements are up to nearly 4 times less than that of competitor products with comparable electrical performance. The crucial factor here is that several of these power inductors can be used in PMIC topologies, which ultimately leads to significant reductions in terms of the size of the PCB. As well as the size, the new series also boasts much better electrical performance compared to rival technologies. For example, the alternating current losses at high frequencies are significantly and remarkably lower compared to thin-film or metal-composite technologies. The series CLT32 inductors are also far superior to other technologies with regard to the efficiency and the drift of the saturation current at different temperatures. Concerning inductance values, the new series includes values ranging from 17 nH to 440 nH. The new power inductors are designed for rated currents of 10 A to 45 A, with high saturation currents of up to 60 A also of particular importance. Another key benefit of the CLT32 series is its highly reliable operating temperature of 165 °C, making it extremely well-suited for automotive applications. Thanks to their wide frequency range of up to 10 MHz, the robust inductors are also suitable for GaN semiconductor applications.

• Texas Instruments

  LM25149-Q1/LM25149

  

  The new LM25149-Q1 and LM25149 synchronous DC/DC buck controllers enable engineers to miniaturize their low-EMI power supply. Engineers can cut the area of the external EMI filter in half, lower the conducted EMI of the power design by as much as 55 dBµV across multiple frequency bands, or achieve a combination of reduced filter size and low EMI. The LM25149-Q1 and LM25149 are industry's first DC/DC buck controllers with an integrated active EMI filter (AEF). They also feature TI's dual-random spread-spectrum (DRSS) technology. Together, these innovations help engineers address the growing challenge or reducing EMI in the power supply.

• Toshiba Electronic Components Taiwan Corporation

  TW070J120B

  

  Schottky barrier diodes (SBDs) embedded into the MOSFET realize a structure that improves reliability more than 10 times compared to Toshiba’s typical structure while suppressing any rise in on-resistance. The use and market growth of SiC devices have been held back by reliability issues. One of these involves PN diodes, which are positioned between a power MOSFET’s power source and drain. Voltage applied to the PN diode energizes it and results in a change of on-resistance that degrades device reliability. Toshiba’s new device structure, SBD-embedded MOSFET, solves this problem. The new structure prevents energizing of the PN diode by positioning an SBD in parallel to the PN diode inside the cell. Current flows through the embedded SBD because its on-state voltage compared is lower than that of the PN diode, suppressing changes in on-resistance and degradation of the MOSFET’s reliability. MOSFET with embedded SBD are already in practical use, but only in high-voltage products such, as 3.3kV devices; normally, embedded SBD cause on-resistance to rise to a level that only high-voltage products can tolerate. Toshiba adjusted various device parameters and found that the ratio of SBD area in a MOSFET is the key for suppressing increased on-resistance. By optimizing the SBD ratio, Toshiba realized a highly reliable 1.2kV class SiC MOSFET.

• Vicor Corporation

  Vicor 1200A ChiP-set 4609

  

  High performance Artificial Intelligence (AI) processors are requiring a power source that is sub 1v and hundreds of amps. To maximize performance of AI processors, Vicor has introduced the Power-on-Package regulator chipset which is not based on a multi-phase regulator scheme but an architecture called Factorized Power. The high-density chipset is comprised of a driver, the MCD4609, and a pair of MCM4609 current multiplier modules to supply up to 650A continuous and 1200A peak currents at sub 1v. The Vicor Hydra II demo board highlights the deployment and operation enabling high current power delivery to an AI processor at levels not achievable with a multi-phase. The chipset can be seen in several AI processor designs in customer specific and industry standard OCP Accelerator Module (OAM) PCB form factors. Minimizing PDN losses is critical at higher current levels as this can amount to efficiency losses of 20% or more to the overall power system performance. The MCM4609 devices are only 45.7 x 8.6 x 3.2mm, enabling these current multiplier modules to be placed close to the processor minimizing PDN losses and contribute to an overall higher power system efficiency. The MCM4609 modules are also very low noise maintaining the critical signal integrity requirements near the processor. The MCM4609s are driven by the MCD4609 module which accepts 48V creating an overall system that provides high density, low noise 48V direct to sub1V conversion needed by state-of-the-art AI processors.

• Vishay Intertechnology, Inc.

  microBUCK® DC/DC Converter With PMBus Interface

  

  Vishay's new SiC45x family of microBUCK® synchronous buck regulators help reduce energy consumption in data centers and industrial computers by delivering up to 98 % peak efficiency in a 5 mm x 7 mm package. Scalable to 40 A, microBUCK solutions can help designers achieve the best combination of cost and performance. Delivering increased power density and transient response compared to previous-generation devices, Vishay Siliconix SiC45x family regulators also offer PMBus 1.3 compliance for power system telemetry. The high power density of the SiC45x devices is made possible by co-packaging high performance n-channel trench MOSFETs with a PWM controller in a compact package. The regulators offer low operating current in idle mode, enabling peak efficiency up to 98 % and reducing power losses. Intended to simplify the design of high performance point of load (POL) converters, the integrated devices require minimal external components for configuration and loop compensation. The SiC45x family regulators offer current ratings of 15 A, 25 A, and 40 A with input voltages from 4.5 V to 20 V. They are are internally compensated over the entire VIN and VOUT range of operation. Highly configurable, the devices combine their wide input voltage range with an adjustable output voltage from 0.3 V to 12 V. The extremely versatile regulators are ideal for a wide range of applications, including POL converters in cloud computing, enterprise servers, and industrial computers, in addition to networking, telecom, and storage systems. The regulators feature programmable switching frequencies from 300 kHz to 1.5 MHz and three operating modes: forced continuous conduction, power save, or ultrasonic. All SiC45x family devices share the same footprint to provide designers with a scalable solution offering a cost and performance optimization while accelerating design time.

• Weltrend Semiconductor, Inc.

  USB PD Controller

  

  Combining the Company's core competences in both digital (MCU) and analog (power) technologies, strong and experienced firmware engineering experts, along with the advanced semiconductor process technology, Weltrend's USB PD controllers have advantages in high level of integration, high quality, and high compatibility. Weltrend’s USB PD controllers minimize external components by integrating USB PD baseband PHY, USB Type-C detection, shunt regulator, voltage and current monitors, NMOS or PMOS load switch driver and an 8-bit MCU to allow small form factor and low BOM cost. Wide operation voltage range (3V to 24V) supports USB PD 3.0 Programmable Power Supply (PPS) specification. One-Time-Programmable (OTP) or Multi-Time-Programmable (MTP) memories are provided for program code and user configuration data. As of fast charge protocol supports, all of Weltrend’s USB PD controllers are USB-IF certified while some of them also support the latest Qualcomm’s Quick Charge technologies such as Quick Charge 4, Quick Charge 4+, or Quick Charge 5, of which Weltrend was the first in the industry to launch such products. In addition to the USB PD controllers, Weltrend also developed other key ICs in a USB PD power adapter as a total solution that feature a PWM controller, a synchronize rectification controller, and a USB PD controller that are specifically designed and optimized for USB PD compliant power converters to achieve high power density and efficiency at a competitive BOM cost, enabling designers to shorten the design turnaround time plus a one-stop shopping advantage.

• Your Health Technology Co., Ltd. (Yutech)

  YuGuard

  

  Electrocardiography (ECG) is a fundamental method not only commonly used in the hospital for clinical requirement but also widely adopted in home and personal healthcare systems to obtain the electrical activity of the heart. An arrhythmia monitoring system (product name: YuGuard) is proposed and used in a clinical trial. The proposed system has three parts. The first is a high-resolution, low-power analog front-end circuit for implementing bio-signal sensing circuits. The features of the circuits are low complexity, high resolution, and low power consumption. The second part is a digital signal processor with a decimation filter and a universal asynchronous receiver/transmitter package generator. The last part is used to realize a software interface on smartphone for ECG signal recording, display, and classification. A wavelet-based classification method is also proposed to classify the rhythm. The chip used in the system is fabricated through TSMC 0.18 μm standard CMOS process. The classification algorithm is verified with data from the MIT/BIH Arrhythmia Database. The accuracy of beat detection and arrhythmia classification is 99.4% and 95.83%, respectively. Patients in Tainan hospital are enrolled in a human study to verify the performance of the proposed arrhythmia monitoring system. Results show that the system can acquire and classify ECG signals.

• Andes Technology

  NX27V vector processor IP

  

  As the world’s first commercial RISC-V vector processor, the 64-bit NX27V is a vector processor with 5-stage scalar pipeline that supports the latest RISC-V specification, including the IMAFD standard instructions, “C” 16-bit compression instructions, “P” DSP extension instructions, “V” vector extension instructions and “N” for user-level interrupts.. It brings enhanced performance in memory subsystem with higher memory bandwidth and memory latency reduction by supporting multiple outstanding data access. The NX27V was designed from ground up to be a Cray-like full vector compute engine and upgraded to support the RISC-V Vector (RVV) extension 1.0 spec in 2020. RVV 1.0 includes new instructions such as vector floating-point reciprocal and reciprocal square-root estimate for math calculation. In addition to the existing register grouping, LMUL (vector length multiplier) adds fractional options to use less register bits to make it more flexible. NX27V features branch prediction, instruction and data caches, ECC error protection, and Andes Custom Extension™ (ACE) to add proprietary instructions to accelerate performance/power consumption critical spots. It also includes vectored and preemptive interrupts to serve diversified system events. AXI data bus for wide data access, PowerBrake and WFI mode for rich power management, and JTAG debug interface and trace interface for software development support. The NX27V contains a scalar unit and an Out-of-Order Vector Processing Unit (VPU). The latter has multiple functional units, operating simultaneously to generate up to 512-bit results every cycle to sustain the computation throughput needed in diversified applications. The NX27V comes with standard development tools and RVV compute libraries as well as AndesClarity™, a powerful visualization and analysis tool to help analyze and optimize the performance of critical computation kernels. Furthermore, OpenCL™ with integrated LLVM compiler is provided to enable parallel programming on heterogeneous computing architecture using multiple NX27V. With the configuration of 512-bit VLEN and 256-bit SIMD width, the NX27V can achieve over 66x speedup in MobileNet v1, a popular convolution neural network (CNN). NX27V is ideal for applications with large arrays of data such as machine/deep learning, AR/VR, cryptography, multimedia processing, networking and scientific computing.

• Arm

  Cortex-M55 + Ethos-U55

  

  In a recent MIT Technology Review Insights survey, more than half of companies are putting AI on endpoint devices or in the edge computing, closer to the devices accessing data. The Arm® Cortex®-M55 processor and Arm Ethos™-U55 NPU, the industry’s first microNPU (Neural Processing Unit) for Cortex-M are significant additions to Arm’s artificial intelligence (AI) platform. For more demanding ML systems, the Cortex-M55 can be easily paired with the Ethos-U55, together delivering a combined 480x increase in ML performance to microcontrollers over existing Cortex-M processors. The new IP and supporting unified toolchain enable AI hardware and software developers with more ways to innovate as a result of unprecedented levels of on-device ML processing for billions of small, power-constrained IoT and embedded devices. As the IoT intersects with AI advancements and the rollout of 5G, more on-device intelligence means that smaller, cost-sensitive devices can be smarter and more capable while benefiting from greater privacy and reliability due to less reliance on the cloud or internet. By delivering this intelligence on microcontrollers designed securely from the ground up, this solution can reduce silicon and development costs and speeding up time to market for product manufacturers looking to efficiently enhance digital signal processing (DSP) and ML capabilities on-device. Arm is collaborating with Google for optimizing Google TensorFlow, which significantly reduces the cost of porting algorithms to end devices for developers. All the software that developers need is available under an Open Source license. Cortex-M55 + Ethos-U55 have been adopted by many customers and can facilitate endpoint devices to run securely and efficiently.

• Attopsemi Technology Co., Ltd

  I-fuse™

  

  I-fuse™ is a revolutionary non-breaking fuse technology that's program below thermal run away and above electromigration threshold. I-fuse™ offers high reliability (<1ppb defect), high temperature (300oC qual'd), small size (<1/10 of eFuse), low program/read voltage (core or IO), and low program/read current(~1uA) from 0.5um to 7nm and beyond. Essentially, I-fuse™ is a true logic OTP that can be programmed at core/IO voltage and read and sub-VDD. I-fuse™ also can be fully testable by creating non-destructive program state to generate alternated 0/1 test patterns.

• Cadence Design Systems, Inc.

  Cadence® Sigrity™ X Signal and Power Integrity (SI/PI) Solutions

  

  Sigrity X features powerful new simulation engines for system-level analysis and includes the innovative massively distributed architecture of the flagship Cadence Clarity™ 3D Solver. The new Sigrity X tool suite addresses the size and scalability challenges of system-level simulations faced by today’s leading-edge technologists in the 5G communications, automotive, hyperscale computing, and aerospace and defense industries. Delivering up to a 10X performance gain for simulation speed and design capacity, Sigrity X also provides a new user experience that streamlines setup time for detailed system-level SI/PI analysis by transitioning seamlessly across different analysis workflows. The next-generation release works in tandem with the Clarity 3D Solver and is deeply integrated into Cadence’s Allegro® PCB Designer and Allegro Package Designer Plus. This enables PCB and IC package designers to incorporate end-to-end, multi-fabric, multi-board systems (from transmitter to receiver or power source to power sink) for SI/ PI signoff success. Sigrity X is the most significant Sigrity breakthrough in the past decade, representing more than a rearchitected engine and transformed user interface. It’s a paradigm shift in customer productivity and SI/PI design insight.

• CEVA, Inc.

  Bluebud™ Wireless Audio Platform

  

  Bluebud addresses the technology complexities and scarcity of expertise that semiconductor and system companies are facing for the development of wireless audio systems. The platform serves to provide a standardized and self-contained solution that companies targeting the lucrative Bluetooth audio market can effectively drop-in to their system-on-chip (SoC) design, dramatically reducing the high entry barriers and time-to-market. Bluebud enables end-product differentiation via support for host-level application software which can run on the CEVA-BX1 DSP or an optional host CPU. Bluebud platform key features: - Single core CEVA-BX1 processor for DSP and control simplifies SoC architecture – compared with multiple cores that are required to build similar systems - Self-contained - while everything from Bluetooth link control, host protocol stack, profiles and audio codecs up to the application can run on the embedded CEVA-BX1, Bluebud provides the SoC integrator the option to add a host CPU to run user applications - Support for Bluetooth 5.2 with both Classic Audio and LE Audio, software upgradeable to next Bluetooth version - Complete Classic Audio software stack, required for Bluetooth audio streaming o A2DP profile for music streaming, including SBC, AAC and MP3 codecs o HFP profile for voice call, including CVSD and mSBC codecs - Complete LE Audio software stack, for audio streaming over Bluetooth low energy o Audio profiles for voice call and music streaming, including LC3 codec - Robust true wireless stereo connectivity for both voice calls and music streaming with low jitter / latency between left and right channels - Seamless bud-to-bud role-switching to maximize battery life - Easy and fast pairing with multi-source support, allowing buds to be connected to several devices and instantly switch between them when required

• Global Unichip Corporation

  GUC's HBM IP

  

  GUC HBM3 and HBM2E IPs provide complete solutions for SoC design targeting high bandwidth applications such as Data Cneter AI, HPC, and networking. GUC HBM IPs are fully compliant to JEDEC JESD235C with best PPA. Integrated with GUC proprietary interposer design and manufactured on TSMC CoWoS technology, GUC HBM3 7.2G PHY and Controller are silicon proven, HBM2E 3.6G are under production in customer's SoC.

• Hexas Technology Corporation

  FanFET 3D-NAND Flash

  

  Hexas's innovative transistor FanFET(Fan-type Field Effect Transistor) technology can double the density of 3D-NAND Flash, compared to the same node technology and the same stacked layers of GAA 3D-NAND Flash at the same area. FanFET 3D-NAND Flash is a three-dimensional transistor structure with stackable characteristics. The manufacturing process is not only compatible with the current silicon fabs dominated by DUV lithography, but also reduces the capital expenditure for research and development. The technical highlights of FanFET also includes (1) innovative FanFET Structure with vertical current, (2) applying for both memory and transistor, (3) diversified product for embedded system、computing-in-memory and stand-alone chips (4) expanding the nano-node technology roadmap from 120nm to below 10nm to extend the life cycle of the Moore's Law. (5) improving capacity utilization (6) co-sharing patent pool

• Imagination Technologies

  Series4 NNA

  

  The Series4 NNA is a scalable multicore neural network accelerator. The scalable nature of the core means it can deliver over 500TOPS of compute power at the edge, meaning it can provide for all current and future ADAS applications and full autonomy to spare. Thanks to its embedded architecture it can deliver this high performance using incredibly low power and area. Capable of delivering over 30TOPS per watt, the Series4 is substantially more performant than other neural network processing options in the automotive space. One of the ways it achieves this high level of performance is the patent pending Imagination Tensor Tiling (ITT) algorithm. By splitting the processing of data across layers in tiles, a single hardware pass executes multiple tiles in parallel using the available cores and local memory. This re-uses local data reducing latency and data movement. ITT executes tiles in parallel giving high utilization and low latency and reduces calls to external DDR based on a concept that starts with the final layer group configuration - A “layer group” is a collection of layers, grouped together, matching the order that layers are processed by the hardware. This results in a map of data relationships and dependencies described in tile-formations, which are chosen to utilise the highest overlap of reusable data for the network case being compiled for. Alongside this standout feature, the Series4 has safety features including CRC watchdogs, performance monitoring, Parity and ECC for protecting data paths and configurable dual-lockstep execution within the multicore. Series4 is also deterministic which, coupled with hardware synchronisation mechanisms and tight workload scheduling allows accurate scheduling of tasks. It is optimal for running multiple combinations which is essential to any future in vehicle neural network processor.

• iSTART-TEK

  START

  

  START is a professional EDA tool which is uused to test and repair memory. START has some patent on memory testing and repairing technical. START can help users easy to accomplish memory test and repair of SoC.

• Synopsys

  DesignWare tRoot HSM for Automotive IP

  

  Safety & Security for Automotive SoCs with DesignWare tRoot HSM for Automotive By 2025, more than 470 million connected cars will be on the road. As the connected car market grows, risk of cybersecurity threats also grows. In response, automotive IC designers and OEMs must adopt new techniques and technologies to build security into automotive software and systems. As all of the systems in a car are intertwined and interconnected, any connection to get into the vehicle’s electronics is a potential point of attack for hackers. Seemingly innocent, safety critical interfaces can provide a way into the vehicle, so protecting the passengers and data starting at the silicon level is critical. To address the combination of security and automotive safety, Synopsys has announced the availability of its new DesignWare® tRoot™ Hardware Secure Module (HSM) IP. The tRoot HSM offers integrated functional safety features to accelerate ISO 26262 certification of automotive SoCs. The ASIL B compliant tRoot HSM for Automotive adds hardware safety mechanisms for protection against permanent, transient and latent faults to its security system that includes an ARC processor, scalable side-channel resistant cryptography, true random number generator and security-enabled external memory controllers. The tRoot HSM for Automotive is supported by comprehensive safety documentation, including failure modes, effects and diagnostic analysis (FMEDA) reports that facilitate chip- and system-level ISO 26262 ASIL B or ASIL D compliance. The tRoot HSM with Root of Trust provides designers with a trusted execution environment (TEE) as part of a pre-integrated, pre-verified safety and security solution. The tRoot HSM for Automotive also incorporates safety mechanisms such as hardware redundancy, register error detection codes (EDC), memory error correction codes (ECC), watchdog timers and self-checking comparators for the entire system. In addition, the tRoot HSM for Automotive protects sensitive information and data processing in the connected car with features including secure boot, debug, firmware updates and key management.

• Texas Instruments

  PSpice® for TI

  

  Engineers can speed time to market with PSpice® for TI, a new version of the Cadence PSpice simulator. PSpice for TI enables designers to reduce the risk of circuit errors with full validation of system-level designs before prototype, going beyond the analytic capabilities of many other simulators on the market. With a built-in library of more than 5,700 TI analog models, PSpice for TI makes it easy to select, evaluate and verify components for new designs with one of the industry’s largest integrated circuit (IC) model libraries. The simulator is available for download at no cost at TI.com/pspice-for-ti.

• Your Health Technology Co., Ltd. (Yutech)

  YuCloth

  

  Combining the wearable devices with the concept of Internet of Things (IOT) to create a wearable health care system is a potential issue on an ageing society. Among the applications of wearable health care system, smart clothing has some unique advantages. First, unlike most wearable devices such as watch and belt, clothes is necessary for everyone in daily life, so the clothes-related medical wearable devices can be easily accepted by others. Also, smart clothing has the ability to provide more variety of bio-signal monitoring than other wearable devices because they have larger contact area to the body surface of the user. Thus, Tien Jiang Enterprise Co., Ltd. cooperates with our team in developing system of smart clothing. The system utilizes the fabric-based electrodes with comfortable sense of touch to provide the measurement of electrocardiogram (ECG) signal and respiration signal, and delivers the signal through Bluetooth to the mobile phone. At last, the physiological information such as energy expenditure and heart rate variability can be analyzed.

• ADATA Technology Co., Ltd.

  IM2P33E8 PCIe M.2 2280 SSD

  

  ● Ultra-fast PCIe Gen3x4 interface: R/W speed up to 3300/2800MB per second ● High capacity up to 2TB ● P/E Cycle up to 3K: improved product longevity ● Wide Temperature Support: -40°C to 85°C ● RAID Engine and End-to-End Data Path Protection ● AES 256-bit encryption and TCG Opal: ensure data safety ● Suitable for IoT applications, servers, data centers, surveillance, transportation, IPCs

• Apacer

  Anti-sulfuration SSDs and Memory Modules

  

  Global air pollution is becoming increasingly serious. Studies show that sulfurized corrosive gas in the air can compromise electronic components, which in turn affects the life and reliability of electronic devices. Apacer's anti-sulfuration memory and SSD solutions can meet the needs of industrial products facing harsh environments. Anti-sulfuration Memory Modules Apacer has observed that in the environment that is high in temperature and/or sulfur concentration, regular memory module would begin to sulfurate within 200 hours, causing malfunctions. However, Apacer’s patented anti-sulfuration memory module is built with a unique alloy that helps optimize the anti-sulfuration effect. In an environment with a temperature of 105°C and high in sulfur concentration, the module can still operate stably for more than 1000 hours. The anti-sulfuration state is strengthened beyond five-fold. This ensures the product’s reliability and durability and meets the needs of systems that require continuously stable operation in a practical way. ‧The world's first patented anti- sulfuration memory module ‧Use the highest grade anti-sulfuration resistor to effectively solve the problem of memory sulfuration in a polluted environment ‧Passed the rigorous test specification of anti-sulfuration, ASTM B809-95 ‧Obtained invention patents in many countries Anti-sulfuration SSDs Apacer has achieved another pinnacle in its patented anti-sulfuration technology. The anti-sulfuration SSDs achieve a complete air barrier through strict inspection of special materials and technologies. After two complete accelerated verification tests of MFG (Mixed Fluid Gas) and FoS (Flower of Sulfur), it has passed the ANSI/ISA 71.04 G3 air corrosion certification. This proves that it has reached the industry's highest level of sulfur resistance, including resistance to silver corrosion, copper corrosion and creep. Applications such as 5G, AIoT high-speed networking and edge computing will all benefit greatly from this protection against sulfuration and other negative effects that may arise in harsh environments.

• Cervoz Technology Co., Ltd.

  Cervoz M339 Family 3D MLC Military Grade SSD

  

  The Cervoz M339 Family 3D MLC Military Grade SSD is a high-reliability, high-security storage module that embodies what Cervoz does best. Using the reliable MLC technology, Cervoz designed the military-grade SSD to be in compliant with the U.S. military standard MIL-STD-810G. This standard is a guarantee that the product can sustain the harsh environment it may experience during its service life and potential hacks or attacks on its data in mission-critical operations. The environmental conditions include shock and vibration, and extreme weather and temperatures, so the Cervoz Military Grade SSD underwent and successfully passed shock, vibration and combined temperature/altitude tests during development. In terms of design, the SSD uses an anti-vibration fill made of acrylic resin to secure PCB and main chips in their place and prevent solder joints from coming loose. All parts of the SSD are wide temperature meaning that they can function normally in extreme temperatures of -40˚ C to 85˚C. Military-grade products require multiple levels of protection against data security and data integrity threats. To protect sensitive, confidential information, this Cervoz SSD features AES 256-bit encryption, write-protection, quick erase and self-physical destruction functions. The SSD's the form factor, design and technologies all come together to meet the data storage and transmission needs of military applications.

• Etron Technology, Inc.

  RPC DRAM®

  

  Promoting the miniaturization of AI / ML Edge / Endpoint applications, Etron Technology (TPEx: 5351.TW) showcases its innovative heterogeneous integration AI+DRAM platform: the latest RPC® DRAM x16bit DDR3 SDRAM, which uses only half the pins and 1/10th of package size compared with other similar DDR3 products. Thus, it fulfills the critical needs of miniaturization and lower cost for AI/ML Edge/Endpoint systems. Etron’s 256 Megabit RPC™ DRAM in Fan-In Wafer Level CSP packaging (FI-WLCSP) – known as the first DRAM in the world offered in this miniaturized package for ML/IOT/AI Edge/Endpoint usages - is now in Highly Reliable Volume-Scale Delivery. The FI-WLCSP is the smallest and lowest cost discrete package: it is a bare die with a Redistribution Layer (RDL) and solder bumps. The FI-WLCSP packaged RPC DRAM is 2 x 4.7 mm in size, features a x16 interface and uses 50 solder balls with ball pitches of 400 microns. The RPC DRAM matches x16 DDR3 bandwidth while being only 10% of the package size of the industrial standard 96 ball x16 DDR3 BGA, offering a very attractive form factor for new classes of applications. AI-Edge / Wearable / FPGA manufacturers can benefit greatly by porting designs with RPC DRAM.

• innodisk Corporation

  InnoAGE SSD

  

  InnoAGE SSD is the intelligent SSD always connected, even if the edge device crashes. From cloud-based management portal can remotely direct the edge device to reset, reboot, or restore the drive to an earlier backup, write-protect all data or even erase itself. Device status information is also provided to facilitate maintenance work. InnoAGE SSD provide system integrators an effective way to mitigate some of IoT’s biggest challenges including management, maintenance and edge security. (1) Key features: a. Secure out-of-band management b. Cloud-managed backup, restore, write-protection and erasing of the SSD c. Cloud-provided maintenance and device status panel d. I/O extension with GPIO, UART, and SPI interfaces (2) Solutions: Adding It All Together InnoAGE is a toolset to take on IOT’s biggest challenges. By enabling out-of-band signaling, management and maintenance can be facilitated while maintaining edge security at the highest level.

• Macronix International Co., Ltd.

  ArmorFlash

  

  ArmorFlash™ is an ideal security solution for a wide range of identification, authentication and encryption requirements for IoT, automotive, computing, industrial, healthcare, wearables, smart home, and smart cities. ArmorFlash™ offers secure technologies like a Physical Unclonable Function (PUF) that makes use of a semiconductor’s biometrics, which are characteristics derived from fabrication that can be used for encoding or identification. This highly unique fingerprint cannot be predicted, duplicated, or cloned and so provides a reliable unique ID with very high levels of entropy. (JS: See attached Word doc with suggested replacement text for this section.)

• Silicon Motion, Inc.

  Ferri Embedded Storage

  

  Silicon Motion Leverages the industry leading technologies and experiences in NAND flash controller along with Multi-Chip Package (MCP) solution to introduce Ferri Family, including FerriSSD®, Ferri-eMMC® and Ferri-UFS™. The FerriSSD® is designed optimally for a wide range of embedded, enterprise and data center applications requiring faster access speed, small flexible form factor and reliable PCIe NVMe/SATA/PATA storage. By combining industry proven controller technology, NAND flash and passive components into a small single BGA package, FerriSSD simplifies design efforts, reduces time-to-market while protecting from NAND technology migration concerns. Ferri-UFS™ is a highly integrated solution which combines a feature-wise flash controller compliant with the latest UFS2.1/3.1 standard and standard NAND flash memory. Its high-performance storage accessing, better power efficiency, and ease of system design make the Ferri-UFS a fabulous solution for automotive, industry, embedded and portable applications. Ferri-eMMC® is optimally designed for a wide range of embedded applications and is fully compliant to the JEDEC standards for eMMC 4.5/5.0/5.1 protocols. Available in 100/153-ball BGA packages, Ferri-eMMC eases PCB design and enables low-cost manufacturing. Easy to use • Plug & Play only requires format/fdisk prior to use • Small footprint for space-limited design Lower total cost of ownership • Rugged & Reliable (no moving parts) • Eliminate requalification cost from NAND generation change • Cost-saving with flexible TLCmode™/MLCmode™/SLCmode™, configurable capaities Eliminate down time • Supports S.M.A.R.T. and advanced SSD Telemetry logging features • IntelligentScan with DataRefresh for Data integrity enhancement • Full End-to-End data path protection with recovery algorithms • Silicon Motion's 4th generation LDPC ECC engine with Group Page RAID • Remote firmware update available via secured digital signature Silicon Motion Leverages the industry leading technologies and experiences in NAND flash controller along with Multi-Chip Package (MCP) solution to introduce Ferri Family, including FerriSSD®, Ferri-eMMC® and Ferri-UFS™. The FerriSSD® is designed optimally for a wide range of embedded, enterprise and data center applications requiring faster access speed, small flexible form factor and reliable PCIe NVMe/SATA/PATA storage. By combining industry proven controller technology, NAND flash and passive components into a small single BGA package, FerriSSD simplifies design efforts, reduces time-to-market while protecting from NAND technology migration concerns. Ferri-UFS™ is a highly integrated solution which combines a feature-wise flash controller compliant with the latest UFS2.1/3.1 standard and standard NAND flash memory. Its high-performance storage accessing, better power efficiency, and ease of system design make the Ferri-UFS a fabulous solution for automotive, industry, embedded and portable applications. Ferri-eMMC® is optimally designed for a wide range of embedded applications and is fully compliant to the JEDEC standards for eMMC 4.5/5.0/5.1 protocols. Available in 100/153-ball BGA packages, Ferri-eMMC eases PCB design and enables low-cost manufacturing. Easy to use • Plug & Play only requires format/fdisk prior to use • Small footprint for space-limited design Lower total cost of ownership • Rugged & Reliable (no moving parts) • Eliminate requalification cost from NAND generation change • Cost-saving with flexible TLCmode™/MLCmode™/SLCmode™, configurable capaities Eliminate down time • Supports S.M.A.R.T. and advanced SSD Telemetry logging features • IntelligentScan with DataRefresh for Data integrity enhancement • Full End-to-End data path protection with recovery algorithms • Silicon Motion's 4th generation LDPC ECC engine with Group Page RAID • Remote firmware update available via secured digital signature

• SMART Modular Technologies

  DDR4 NVDIMM

  

  SMART Modular’s DDR4 NVDIMMs, incorporating Micron® advanced DDR4 DRAM technology in combination with SMART's high-speed PCB designs, significantly improve signal integrity, resulting in broader design margins even at the highest DDR4 bus speeds. NVDIMMs have seen wide adoption in applications requiring "normal" memory operation at DRAM bus clock rates. SMART's new NVDIMMs also use Micron advanced 3D NAND technology which provides highly reliable memory persistence in the event of a system crash or power outage, with minimal back-up and restore times. The NVDIMMs operate as standard DDR4 RDIMMs with unlimited write endurance, combined with integrated persistence capability. This creates highly efficient write acceleration in flash storage appliances and high-speed recovery capability in cloud data centers. SMART NVDIMMs offer the full feature set currently defined by JEDEC standards. Additionally, AES-XTS 256 (Advanced Encryption Standard) provides enhanced data protection. SMART also offers a comprehensive set of intelligent back-up power modules (BPM) in various form factors which provide temporary power during back-up operations. SMART Modular’s DDR4 NVDIMM feature proprietary SafeStor™ technology, the engine which initiates backup and restore operations upon command from the host controller. The NVDIMM also support multiple command delivery options to trigger SafeStor™ backup during a host detected power outage and recovery events. The SafeStor™ engine also employs multi-channel NAND Flash and high-speed switching circuitry to provide robust backup and restore capability, all while functioning as a JEDEC standard DDR4 RDIMM during normal operation. SMART Modular’s NVDIMM runs at DDR4-3200 high speed bus rates with density in 16GB and 32GB. It’s expected to introduce more NVDIMM products to meet the growing demands for even higher speed like DDR5 in the future.

• Winbond Electronics Corporation

  HyperRAM™

  

  HyperRAM™: space-saving solution and ultra-low power consumption Winbond HyperRAM™ products provide a compact alternative to traditional pseudo-SRAM in IoT and consumer devices, automotive and industrial equipment. The introduction in 2021 of HyperRAM™ devices produced on Winbond’s 25nm process extends densities up to 256Mb and 512Mb. 1. Ultra-low Power Consumption Winbond’s Hybrid Sleep Mode (HSM) gives standby power consumption as low as 45µW, and operating power less than half that of equivalent pSRAM products. 2. Design Simplicity HyperRAM™ devices use just 13 signal pins, compared to 31 signal pins in pSRAM. This makes the board layout much simpler to design and manufacture. 3. Space-saving Low pin-count packages and a lower number of connections to the host controller reduce the memory system’s board footprint and save space in consumer devices such as smart watches.

• Your Health Technology Co., Ltd. (Yutech)

  YuPet

  

  Through combining pet clothing and front-end sensor, the I-Pet clothing is a wireless bio-signal detecting system for acquiring electrocardiogram and respiratory signal from a pet. An algorithm is implemented to evaluate the emotion state and heart rate variability. Based on these analysis results, this system can be a reference for veterinarian and provide suggestions to users. Moreover, the emotion index can help users to understand the mental states of their pets. This work combines the concept of wearable device and internet of things and contains the hardware implementation and software development. With a software application as graphical user interface, user can obtain the real-time and past condition of pet. This information platform is a channel to communicate with the vet and a bridge for the pet lovers to exchange their experience.

• Alifecom Technology Corp.

  NE6000 LTE-A Network Emulator

  

  SLIM, SMART, SPEEDY! NE6000 emulates a complete LTE-A network system with eNB and true EPC. NE6000 not only offers unprecedented diagnosis & troubleshooting capabilities for LTE-A system development and debug, but also tailors for production line and QA/QC.

• Anritsu Company, Inc.

  MT8000A Radio Communication Test Station

  

  The Radio Communication Test Station MT8000A is an all-in-one platform supporting RF and protocol testing, functional and application operation testing, beam characteristics testing and more. As well as supporting both NSA and SA-mode base-station simulation functions required for development of 5G chipsets and terminals, it also covers FR1 frequency bands, including 600 MHz, 2.5 GHz, 3.5 GHz, 4.5 GHz, and 6-GHz unlicensed bands, as well as the FR2 24 GHz, 28 GHz, 39 GHz, and 43-GHz mmWave bands, to support all the main bands used by 5G services. Additionally, it supports the functions required for high-speed communications, such as 4x4 MIMO in FR1, 8CC and 256QAM in FR2 as well as supporting the latest 3GPP Release 16 features. Furthermore, the MT8000A provides a versatile and efficient test environment that is easily configured using a simple user interface and software to test device performance.

• Chroma ATE Inc.

  OBC and DC-DC Converter Power HIL Testbed

  

  Chroma ATE introduces the Chroma 8620 OBC and DC-DC Converter Power HIL Testbed for testing electric vehicle charging systems and powertrain components.Hardware configuration can be adapted according to DUT specifications, with options including a programmable DC power supply,programmable DC electronic load, digital power meter, and oscilloscope. Chroma 8620 can be applied to different system architectures and boasts expansion and sharing of the platform. Chroma 8620 is specially designed for research and development of on-board chargers (OBC) or DC-DC converters. Its flexible software provides user interfaces for operation and monitoring of manual and automated test functions and automatically generates comprehensive test reports. Users can quickly conduct large numbers of repeated tests, improving test coverage and efficiency. Chroma 8620 supports the loading of Altair Activate models or Model-Based vehicle models so that users can continuously apply existing vehicle models, saving the trouble and time of redevelopment. Moreover, CAN HS/FD and LIN communication interfaces are able to load DBC and LDF communication files. For functional testing, Chroma 8620 can simulate normal operating conditions of the DUT in a real vehicle environment. It can also simulate abnormal operating conditions, including communication abnormalities and signal faults (Open Circuit, Short to Ground, Short to Battery, Pin-to-Pin Short). This serves to avoid possible hazards during the charging process or when the vehicle is on the road. Laboratory simulation testing not only diminishes the risk of accidents in the actual vehicle, but also eliminates the high costs associated with using real vehicles for testing.

• Good Will Instrument Co., Ltd

  Digital Power Meter

  

  GW Instek GPM-8310 is a digital power meter for single-phase (1P/2W) AC power measurement. Features include DC, 0.1Hz~100kHz test bandwidth, 16bits A/D, and 300 kHz sampling rate. It adopts 5” TFT LCD screen with a five-digit measurement display and provides 25 power measurement related parameters, and has a high-precision measurement capability. It also features the ability to display waveform (voltage/current/power), the integration measurement function, harmonic measurement and analysis of each order, external sensor input terminals, and various communication interfaces, etc., to help users achieve clear, convenient and accurate power measurements. This power meter is a most cost-effective power meter with most complete functionalities among the products of the same category.

• ITECH Electronic Co., Ltd.

  IT7800 High Power Programmable AC/DC Power Supply

  

  ITECH IT7800 programmable AC/DC power supply, with high power density of 15kVA in a 3U single unit, its voltage range is up to 350V L-N and 500V L-N. Compared with conventional AC source, it is much smaller. The power can be extended to 960kVA after parallel connection. IT7800 comes with synchronous On/Off input and output signals, which ensures the synchronization of paralleling. After parallel, not only all functions are retained, but there is also no loss of accuracy, which is flexible and good for ATE system integration. Its Output frequency is 16-2400Hz and the programmable slew rate setting is for changing voltage and frequency. It can realize single phase, 3 phase and reverse phase output. It’s worth to mention that the ‘reverse phase’ helps to double the voltage output which saves your cost of additional equipment purchasing. IT7800 has totally 4 output modes, AC, DC, AC+DC, DC+AC, which can cover a wider range of applications. The multi-channel function of the IT7800 is rare. It allows users to test 3 independent DUT at the same time which largely improves the equipment utilization. It has both keyboard and touch screen. You can operate easily in either way you like. Further more, IT7800 has built-in power meter and arbitrary waveform generator, which is able to simulate harmonics and other arbitrary waveform output. Besides, you can set output 0-360 ° start/stop phase angle. IT7800 provides multiple choice of interfaces, the built-in USB/CAN/LAN/Digital IO interface and optional GPIB /Analog&RS232. Combining with other highlight features including up to 50th harmonic analysis and simulation, programmable output impedance, all-round measurement function, and IEC standard compliance test ( IEC 61000-3-3, IEC 61000-4-13) make IT7800 series widely used in the industries like home appliances, avionics, renewable energy, power electronics , etc. and has become popular globally.

• Keysight Technologies

  N9042B UXA Signal Analyzer

  

  Although the high-frequency mmWave has enabled the access to numerous use cases, the signals at mmWave frequencies are more susceptible to impairments resulting in significant path loss between test and measurement instruments and the device under test (DUT). The lower signal-to-noise ratio (SNR) makes signal analysis measurements, such as error vector magnitude (EVM), adjacent channel power, and spurious emissions, very challenging and limits engineers from truly understanding the performance of their DUT. Therefore, engineers need a test solution with the widest analysis bandwidth and highest frequency range to help them solve their most difficult test challenges in mmWave applications. N9042B UXA X-Series, is the most powerful signal analyzer, in the industry. The N9042B and frequency extender, deliver a single connection preselected to 110 GHz and up to 11 GHz of analysis bandwidth with the industry’s widest dynamic range and best residual EVM, which allow our clients see signals they have never seen before. For a wide frequency range up to 110 GHz, the N9042B analyzer improves the EVM performance by 50% over a wide power range, compared to other signal analysis solutions in the market. This is extremely important to ensure the highest accuracy of test measurements for mmWave applications. The N9042B’s signal analyzer calibration, the U9361 RCal receiver calibrator, provides 10X improved receiver test system accuracy by removing magnitude and phase errors in measurement setups up to 110 GHz. This unique palm-sized, USB-powered and controlled calibrator, drastically reduces effort, cost, and complexity, and eliminates the need for multiple pieces of equipment to calibrate signal analyzer measurement systems. Our new millimeter-wave (mmWave) test solution supports 4 GHz of corrected RF bandwidth for signal generation and analysis, as well as high frequency coverage and the speed needed for wideband, high-throughput mmWave communications by using N9042B UXA signal analyzer and M9384B VXG signal generator. Keysight’s PathWave X-Series measurement applications address ever-changing measurement requirements for the latest standards with ready-to-use measurements for a variety of mmWave applications. Also, the 89600 PathWave VSA software is a comprehensive set of tools for demodulation and vector signal analysis, which with support for more than 75 signal standards and modulation types, enable engineers to explore virtually every facet of a signal and optimize their most advanced designs, while spending less time on measurement setup and delivering repeatable results.

• MICROTEST Corporation

  Precision Impedance Analyzer 6632

  

  The precision impedance analyzer 6632 has seven frequency options(10Hz to 1/3/5/10/20/30/50MHz). The equivalent circuit analysis function supports 7 different parameter models (three-element, four-element), it can help customers model the impedance versus frequency characteristics. 6632 Built-in DC Bias voltage ±12V, it can measurement of piezoelectric element admittance circle, and can measure DC bias characteristic of capacitance value. 6632 can use with DC bias current test system. Support RS-232、GPIB、Handler、LAN、USB Host/Device interfaces, PC connection software capabilities to improve the design and test efficiency significantly. The 6632 supports a variety of accessories that meet customer’s need. Such as dielectric material test fixture that allows PCB designed engineers to reduce the faulty conditions with the comprehensive information of permittivity while designing PCB layouts, liquid dielectric material test fixture for measuring dielectric constant of pure water and air, magnetic material test fixture for measuring of permeability of various toroidal cores or ferrite cores and electromagnetic shielding coating materials……etc. Features • Basic accuracy up to ±0.08% (typical ±0.05%) • ALC function • Output impedance 25Ω/100Ω, switchable • Built-in DC Bias voltage ±12V • Measurement of piezoelectric element admittance circle • Can measure DC bias characteristic of capacitance value. • Ultra-high measuring speed < 3ms • Open circuit/short circuit/load correct function • Up to four component parameters can be selected in the electric meter mode. The induction and DCR values can be measured and displayed simultaneously • Auto component classification: Comparator function and Handler BIN classification function • Using with DC bias current test system for the inductor • Support RS-232、GPIB、Handler、LAN、USB Host/Device interfaces • PC connection data analysis software is available

• NI

  mmWave Over-the-Air (OTA) Validation Reference Architecture

  

  - Real-time, hardware-accelerated DUT positioner control for sampling thousands of points per minute (Azimuth and elevation) - Fast 3D EVM, ACLR, CHP, and SEM spatial results with the high-bandwidth mmWave Vector Signal Transceiver, using 3GPP-compliant 5G waveforms - Cost-optimized, high-isolation, low-loss CATR chamber for minimal signal interference and improved link budget - mmWave OTA Validation Software enables interactive use and rapid automation

• proteanTecs

  Proteus™

  

  By spearheading a new category, proteanTecs is transforming the electronics industry with the introduction of Deep Data. The company monitors health & performance of electronic systems, from design, through production, to field for newfound insights, predictions & recommendations. Proteus, the company’s deep data analytics platform enables visibility into advanced electronics, based on UCT (Universal Chip Telemetry), throughout their entire lifecycle. Machine learning algorithms and advanced analytics are applied to measurements extracted from on-chip UCT monitors (IPs), strategically placed during design. These provide a high coverage, high resolution picture of the SoC’s design and manufacturing sensitivities as well as its operational behavior. Users along the value chain gain insights and alerts, based on common, correlated and predictive data - allowing them to take immediate action to maximize profit, ensure uptime and improve power, performance, and reliability. UCT creates a new realm of advanced, adaptive and measurement-based testing, introducing novel and parametric data created inside the system. Service providers can significantly reduce costs associated with system maintenance and increase time-to-repair. The technology operates in mission-mode, without disruption to normal operation, for continuous availability. It also provides high-resolution visibility for supply chain management and quality, delivering a 10X DPPM (defect parts per million) reduction, and avoiding ‘walking wounded’ devices making it to the field.

• Keithley

  Keithley 2601B-PULSE

  

  The new 2601B-PULSE System SourceMeter® 10μs Pulser/SMU Instrument, integrating a high-speed current pulser with DC source and measurement functions in one instrument. The new system incorporates PulseMeter™ technology for sourcing current pulses as short as 10μsec at 10A and 10V without the need to manually tune the output to match device impedance up to 3μH. This is critical for minimizing device self-heating, which for optical devices, can result in erroneous measurements and the potential for damaging test equipment. The new 2601B-PULSE also includes all current and voltage source measure unit (SMU) ranges that are available in Keithley’s standard Model 2601B System SourceMeter® (40V, 3A DC, 10A Pulse).

• Tektronix

  6 Series B MSO

  

  The new 6 Series B Mixed Signal Oscilloscope (MSO) which extends the performance threshold of the Tektronix Mainstream Oscilloscopes Portfolio to 10 GHz and 50 GS/sec. Developed to meet the demand for high-speed data movement and processing in embedded designs, the enhanced 6 Series B MSO offers leading signal fidelity with12-bit ADCs and extremely low noise, 10 GHz bandwidth and up to 8 FlexChannel™ inputs, enabling users to confidently analyze and debug today’s embedded systems while enjoying exceptional ease of use. The 6 Series B MSO offers a superior combination of bandwidth, sample rate, vertical resolution, low noise and high ENOB, providing exceptional measurements and confidence. With up to 10 GHz of fully-upgradable bandwidth and up to 50 GS/s sample rate, users have better visibility of signals in high-performance designs. This instrument delivers industry-leading signal fidelity, contributing less than 51.1 µV of noise at 1 mV/div and 1 GHz, and less than 1.39mV of noise at 50 mV/div and 10 GHz. The 6 Series B MSO is the industry’s first oscilloscope with bandwidth more than 2 GHz to offer 4, 6 or 8 channels.

• TMY Technology

  XBeam, mmWave OTA (Over-the-air) testing soluton for lab, fab and system house

  

  #XBeam - 5G NR mmWave OTA testing Solution for Production XBeam resolves the slow OTA testing issue in mass production lines to verify the billions of mmWave modules, smartphones, and base stations before shipping.XBeam is an Over-The-Air (OTA) testing solution without mechanical positioners. OTA is the only way to test the mmWave AiP modules. XBeam can test passive Array Antenne, Antenna-in-Package, Device eg. smart phone, CPE, small cell… XBeam is the world's first Beam Engine integrated automation and 5G mmWave testing that can do pure electronic beam-to-beam measurement which is 20 times faster than any traditional methods like CATR. It is capable of measuring a module in 3 seconds as well as identifying a broken module, while analyzing failure reasons and the way to fix it.

• Your Health Technology Co., Ltd. (Yutech)

  TriAnswer

  

  Trianswer is a bio-medical evaluation module designed for wearable and IOT-based products. It not only contains several features about low-power consumption, miniaturization and IOT-based design, but also provides the acquisition of high-quality bio-signals including Electrocardiography (ECG), Electroencephalography (EEG), Electromyography (EMG), etc. By reducing the development time and cost, developers can manufacture their wearable devices rapidly with the assistance of Trianswer. In addition, acquiring the specific bio-signal needs its own corresponding module. Developers can combine the modules like building blocks according to their needs. The main concept of Trianswer is to promote the development of bio-medical wearable devices.

• ACKTEC Technologies

  ACKTEC Learn

  

  ACKTEC Learn digitizes learning content to help scale training, education and learning activities. The solution is custom-built according to your needs. Your brand’s learning content can be digitized through animation, augmented reality (AR), virtual reality (VR), interactive 2D and 3D content and gamification to enable remote learning, as well as being a mobile-ready solution. Train or teach thousands without the need for physical classrooms and with minimal technology requirements such as a smartphone or tablet.

• AHEAD Intelligence Ltd.

  AHEAD-Flow AI Powered Automated Analysis Platform

  

  AHEAD-flow platform, an fully automated, AI-powered flow cytometry analysis platform designed to help physicians perform blood cancer (including leukemia, lymphoma and myeloma) diagnosis and disease monitoring triage in seconds. Introduction of AHEAD-flow platform could reduce treatment initiation delay by reducing labor intensive and time consuming manual analysis tasks performed by laboratory medicine specialists and/or pathologists.

• AMPLYFI LTD

  DeepInsight

  

  AMPLYFI has built the Worlds first Insights Automation Platform (IAP), tool that helps any organisation to research, analyse and create insights from written content - DeepInsight. DeepInsight helps organisation connect with Deep Information - that is trapped in silos, hidden by search boxes and limited by paywalls. Our IAP uses over 16 Machine Learning models to “machine-reads” this content, faster than any human can, sorting, tagging and analysing the information inside each document, so that it can be used to create clear, market changing insights. Helping everyone in an organisation make better decisions, so they can change with conviction.

• Avalanche Computing Taiwan Inc.

  Fast-AI: Accelerating Deep Learning Development and Deployment in Clicks-Through

  

  FAST-AI Inspired by the challenges in AI development, Fast-AI is fast, easy to learn, hyper-scaled, and integrated. The goal is to allow users to be able to focus on the critical AI model design instead of the tedious tasks of building, configuring, and optimizing AI environments. With Fast-AI, users are able to train AI on multiple GPUs and deploy AI with just a few clicks, utilizing its innovative click-through AI framework. And as deep learning increases demand computing power, Avalanche Computing looks to serve the growing global AI industry. Among its long list of partnerships, the company has recently teamed up with medical, manufacturing, and constructing partners in accelerating the AI development workflow.

• Benano

  C2100 3D Scanner

  

  Benano's C2100 3D scanner integrate TI DLP, Intel FPGA and Benano's own camera. C2100 provide best cost / performance ratio in the 3D sensing market. Benano has years of experience in high precision structured light technology, and apply our product on connector industry for pin and ball's true position and coplanarity inspection. On 2020, Benano implement core technology into entry level product, C2100. This brand new product not only provide high quality 3D image, but also offer at an attractive price. In CES 2020, C2100's prototype was publish on TI's booth; C2100 is integrated by dozens of customers on different domain since it on the market by July 2020. Such as grinding and gluing with robotic arm; In-tray chip counting; object positioning or reverse engineering. C2100 has in-builded dual camera and RGB structured light module, provide 2D color image (.bmp), 3D point cloud (.xyz) and mesh (.stl, .obj, .ply). Users may control C2100 via C++ or C# SDK in their own software for different vision task.

• Breathonix Pte Ltd

  BreFenceTM Go COVID-19 Breath Test System

  

  Technology The BreFenceTM Go is a real-time, non-invasive COVID-19 Breath Test System intended for the quantitative detection of volatile organic compounds (VOCs) in the human breath. The VOCs being detected are indicative of the presence of COVID-19 disease. The BreFenceTM Go is intended for use in point-of-care settings, hospitals, clinical laboratories and clinical settings by trained operators. Operators of this system need not be trained healthcare professionals. 1. Breathonix technology allows the total turnaround time from breath collection to diagnostic results to be less than 1 minute. 2. Initial Clinical Trials for Covid-19 and Lung Cancer detection have shown promising results of more than 90% and 80% accuracy respectively. 3. Breathonix’s API (Application Programming Interface) enables 3rd party healthcare providers or authorities to retrieve the results while complying to data protection policies.

• DeCloak Intelligences Inc.

  Data De-identification

  

  PPU (Privacy Processing Unit) is a security chip designed by DeCloak to protect individual’s privacy while allowing data to be aggregated, analyzed and even sold without worrying about breaking privacy regulations such as GDPR (General Data Protection Regulation) or CCPA (California Consumer Privacy Act). It works with a broad range of IoT devices such as smart phone, medical, wearable, smart appliances, utility meters, etc. with seamless integration so that users can use their devices in the same manner as always, except their online behavior/data is anonymous. The core technology of PPU is “Differential Privacy” which can release statistics from sensitive user data while query of such released statistics cannot be used to trace back to single individual, and therefore protects privacy. PPU is positioned to serve as a trusted third party solution provider to (i) enable sensitive data de-identified a.k.a. anonymized before leave users’ personal devices while (ii) extracts the statistics from de-identified data without trace back to individual. PPU can bridge the privacy protection and data analyzability and enables telecom, financial institutions, and government organizations to extend innovative mobile services in a secure and convenient manner. There are several features of PPU: 1. Higher level of security (over pure software solution): since every PPU piece is unique during manufacture process. 2. OS agnostic 3. Fast processing 4. User control

• FaceHeart Inc.

  AI Healthcare Monitoring Solution

  

  FaceHeart, an AI software provider of video-based vital sign measurements, launched the product "AI Healthcare Monitoring Solution" to enable its services to be delivered to the people/elderly in their home, living rooms, retirement village, offices, working facilities, or any other spaces they prefer for their daily vital signs to be measured, while not disturbing their normal activities. By incorporating a simple camera with a series of sophisticated image processing tools and AI algorithms, users will turn the personal device/ home device/ Robot into a vital sign measuring device for heart rate, heart rate variability (HRV), blood pressure, respiration rate and stress level plus more, using video of your face. The solution is able to automatically, seamlessly and effectively measure people's health condition during using the phone, laptop, or watching TV and give an appropriate warning while abnormality. Meanwhile, recording the health data for a report to the family or medical staff a reference, and could get feedback or suggestion based on the health information. The solution not only removes the inconvenience and discomfort of wearable medical devices but also brings different levels of flexibility to the traditional healthcare management system. Also, can be used to continuously monitor the people’s health conditions or casual measurements, as well as providing clinical healthcare facilities with desired non-invasive alternatives for vital sign measurements. To ensure accuracy, FaceHeart has conducted a variety of clinic trials via Institutional Review Board (IRB) initiatives with several doctors and hospitals. Upon the completion of clinical trials, approximately 2 million minutes of imaging data will be collected to validate/optimize the "AI Healthcare Monitoring Solution". Meanwhile, various adjunct procedures are used during these clinical trials to extract and integrate physicians’ medical domain knowledge as an integral part of "AI Healthcare Monitoring Solution" product functionalities.

• Ficus Data Inc.

  LAVA: Vision-Based Hand Hygiene Auditing Assistant

  

  We propose a computer-vision solution to assist hand hygiene audition for infection control in hospitals. The system comprises an image module and cloud data management, providing a real-time video analysis. Powered by our artificial intelligence technology deployed on an edge computing device, each user's 7-steps hand-washing procedure will be examined. Improved hygiene compliance can be expected. The data reporting service illustrates the statistics via the website or APP. Moreover, the machine learning model is updated by continually collecting the images from the edge devices.

• Ganzin Technology, Inc.

  Eye Tracking Solution

  

  Ganzin Technology is an eye tracking solution provider. Ganzin’s break-through AI based eye tracking technology is the most easy-to-install solution on the market. With Ganzin’s solution, the potential of eyes as the ultimate interface to the digital world is unblocked. It is expected that eye tracking will be integrated into all kinds of glasses and HMDs for supporting wide applications of AR/VR/smart-glasses; it is also expected that eye tracking will be employed by all general users in their daily lives. Ganzin can support different forms of eye tracking solutions to fulfill various requirements. First, Ganzin provides software eye tracking solution AURORA on Qualcomm XR platform, which is widely employed for high-end AR/VR devices. Second, Ganzin’s in-house edge-AI processor, EPU (eye processing unit), can enable low-power eye tracking capability for smart-glasses. The top competitive advantages of Ganzin’s eye tracking solution include simple design, compact form, and broad application scenarios.

• Gintel Tech

  AIoT Aquaculture Water Quality Monitoring Tracking Prewarning and Non-Toxic Solutions

  

  1. Unique design: The system design is using composite physical technology instead of traditional chemical and biological technologies to increase system stability, working efficiency, and environmental protection. The functions of quick monitoring and pre-warning are friendly designed for users without the limit of professional aquaculture knowledge, which can reduce labor costs and increase working efficiency. The core technology is a combination of ABCDMS trans-disciplinary majors. A-AIoT and aquaculture B-Big data C-Cloud technology D-Device of integration of hardware and software M- Mobile technology S- Composite physical sensor. 2. Special features: To compare the market products, the special feature including (1) Quick monitoring (2) Tracking and predicting the change of toxic concentration (3) Pre-warning the water parameters out of the safety range (4) Providing non-toxic solutions, no chemicals, to solve the water toxic problems for seafood safety. 3. Solving pain points: From users’ experience, the system solves at least five pain points in aquaculture, including (1) Increasing 100 times of the working efficiency. (2) Reducing 90% of the labor cost. (3) Reducing 50% of feed materials. (4) Increasing two times of aquaculture production. (5) Controlling the toxic concentration by non-toxic technology. To solves the aquaculture pain points, the unique designs are embedded in the system includes (1) Composite physical sensor for quick monitoring and high stability. (2) Smart calibration at no cost to aquaculture farmers to keep the system with high stability with high working efficiency and reduce the farming cost. (3) Customized design for farming different aquatic creatures. (4) The safety ranges of water parameters are embedded in the system to meet the need of farming different aquatic creatures.

• GoodLinker Co., Ltd.

  GoodLinker Cloud of War Room

  

  Most manufacturing SMEs cannot achieve digital transformation because of the high import cost and lack of talent. "GoodLinker Cloud of War Room" is for monitoring machinery operation, help to increase management and production efficiency, and reduce human cost. We provides a HaaS with our AWS Quilified IPC to do data collection via digital signal/analog signal/Modbus. Also, our SaaS includes web dashboard & mobile APP could real-time remote monitoring, malfunction alert, and history reports to Excel.

• Hyson Technology Inc.

  FarmABetterFish AIoT Aquaculture Management System

  

  The biggest difficulty facing the aquaculture industry is that the fish and shrimp are underwater and difficult to be observed, which makes aquaculture extremely risky. To conquer this, we have developed the “FarmABetterFish AIoT Aquaculture Management System” to lower the risks caused by hard to check fish growth in the farming ponds. This product is applicable to inland and offshore aquaculture. It allows fishermen to examine the fish/shrimp growth via their mobile phones, and also can integrate on-site machinery equipment to automate routine works, reduce operational risks, and improve productivity in a friendly environment. FarmABetterFish system includes a self-developed underwater camera together with an AIoT portable analyzer to monitor fish. An embedded edge-AI image defogging technology is applied to make the underwater images to become clear, so that fishermen can see the fish, check the fish activities, examine feeding status, and know whether fish is sick or not, etc. Fish images will be synchronized to the cloud. Cloud-AI will automatically identify, measure, and record the fish biological information to statistic the growth status of the fish population, analyze the feed conversion rate, and present the information in visualized charts. Based on the growth data, the AI expert system predicts the harvest date for you to arrange sales and shipment schedules, and ensures the stability of supply chain. This system can be expanded to remotely control on-site automation equipment and link peripheral modules such as water quality detector, flood detector, and micro-weather stations, to monitor and alert the in-pond water quality and the environment outside the ponds. This system can automate 75% aquaculture daily work, reduce 40% risks, and increase 30% productivity. This is the best product to make aquaculture visible, measurable, controllable, and thus easier for you to manage your stock and scale up your aquaculture business with lower risk.

• KDH Design Inc.

  Flexible Augmented Reality Display (AR Film)

  

  KDH Design Inc (“KDH”) is committed to a radical change of the transparent, flexible, and keeping high brightness with high optical performance display technology in far-field and near-eye applications like AR (Augmented Reality) through the patent-pending AR FILM solution. KDH Design Inc. controls the entire process from the material pipeline, product development all the way to mass production process as well as conducts joint-development with Advanced R&D team at NCRIS in Melbourne, Australia. We are on the way to deliver the AR visor powered smart helmet, car windshield and AR commercial stretch bar in 2021. With this AR film technology, we’ve developed the following products: XR on shelf and AR car windshield. XR on shelf is an AR powered stretch-bar designed to replicate key benefits of the online experience into physical retail environments. The platform utilizes ruggedized shelf-edge displays combined with high-definition optical sensors to automate intelligence into on-the-shelf inventory levels and planogram compliance, play optimal video based on shopper distance (including product pricing and information), provide insight into demographics, and allow for content triggering on detected age, gender, or ethnicity. The technologies work together to enhance operational efficiencies and to provide sales uplift and valuable data. KDH has signed a cooperative agreement with the biggest retailer in the US, to provide XR on shelf by late 2023. We continue to grow our engagement with key partners like Panasonic, FICOSA, a Barcelona based automotive solution vendor, to enable see-through AR display powered smart car windows to be seamlessly integrated within the side window to stream information, such as navigation, point of interest, distance to destination, speed, hazard alerts, (like playing the role of adaptive side mirror to driver or passengers) and to further make the car window become a mobile advertising billboard on the road.

• Kneron (Taiwan) Co., Ltd

  3D Liveness FACE RECOGNITION

  

  Kneron's lightweight image recognition algorithms can recognize human faces, bodies, gestures, objects, and scenes on-device, and power applications such as secure payments, door security, facilities management, retail management, and traffic management. The key to effective edge AI computing is balancing size, performance, and power usage. That said, Kneron's facial recognition algorithm (Kneron-003) scored the best aggregate performance rating among all lightweight models under 100MB in the U.S. National Institute of Standards and Technology (NIST) 2019 Face Recognition Vendor Test (FRVT). The solution on Smart door lock: 1.3D deep analysis and infrared imaging technology: The feature point spread observed by the dual camera is used to calculate the relative 3D depth information of the face. In addition, infrared spectrum information algorithms are used to prevent live attacks on 2D images and high-precision 3D head masks, making live attacks more difficult. 2. Proprietary, efficient and safe lightweight 3D face recognition algorithm: The dual camera's energy-resistant lightweight 3D face recognition algorithm ranks first in NIST testing on edge computing devices. Also passed the BTC enhanced level of live attack face recognition test. 1:N Face recognition loss rate is only 1/1000,000. 3. Ultra-low energy AI chip, giving smart door locks a security level up to payment level face recognition system. Unlocked within 1.2s with a battery life of one year (8 x AA batteries).

• Liscotech System Co., Ltd.

  AI-edge Remote sensing instrument (RSI)

  

  This work presents an AI-edge Remote sensing instrument (RSI), which is an intelligent telemetering payload for the cube satellite using a Deep Learning method to detect interesting region and moving objects in the Earth then predict disaster. For the video coding, we use H.264 for taken video when the cubic satellite on the orbit. The hardware design of this AI-edge remote sensing instrument (RSI) payload system includes the following functions: (1) RSI payload and an edge computing system: This includes optical camera, FPGA processing unit, and CPU/GPU high-efficiency edge computing unit. This system and will be used to taking images and performing functional algorithms. (2) Video compression of satellite-taken images with H.264 video coding. It would provide high coding efficiency with high image quality. (3) Performing moving object detection, landscape recognition, disaster detection and prediction with proposed deep learning algorithms. This work is expected to be beneficial to the Third Phase of National Space Program and to local industrial companies in the enhancement of the technical readiness level for space commerce in Taiwan.

• MyProGuide

  5G + VR

  

  VR 360 streaming online tour in real time. Travel via screen, make tourist and tour guide to meet each other online, especially if not able to travel. VR+360 video for streaming is new things for tourism industry, tourist can have more reality experience with local tour guide and interaction with each other in real-time. Tourist wear VR glasses, tour guide hold a 360 video camera, use 5G internet. We have resource for content provide, very advantage.

• PowerArena Corporation

  PowerArena AI Human Factors Analysis System

  

  The PowerArena AI human factors analysis system combines image collection and AI technology to provide on-site lenses with complete analysis functions, helping production managers to obtain actual information on the on-site status through this tool. The product design of PowerArena is as follows: 1. Set up cameras at each station and collect production line operator images. 2. Use AI algorithm to analyze images, obtain real-time production time of each station and balance status of production line. 3. Connect the output data with the customer's process management system (shopflow) to summarize the actual production capacity status of each station on production line operator status in real time. 4. With the above data, industrial engineers can analyze the working status of each station in real time, quickly identify problems and make real-time improvements. Customers can also review the production line situation in the system based on the production time or the point of time of the problem, and watch the video to unify the production line problems and formulate countermeasures.

• proteanTecs

  Proteus™

  

  We live in a world where we depend on car electronics to be available 24/7 and operate with zero in-mission failures. We put our lives in the hands of ECUs, ADAS and E/E systems every day. But how can we guarantee these systems’ reliability, safety, and functionality? How can we track their health at any given stage, under extreme conditions, to make sure they last the full extent of their expected lifetime? proteanTecs has developed health and performance monitoring solutions for advanced electronics, enabling visibility from within. The company provides deep data based on Universal Chip Telemetry™ (UCT), to uncover insights at test and in mission. Our cloud-based analytics platform applies machine learning algorithms to measurements extracted from on-chip monitoring IPs, strategically placed during design to provide a high coverage, high resolution picture of the system’s quality, reliability and performance throughout its lifecycle. Users along the value chain gain insights and alerts, based on common, correlated and predictive data - allowing them to take immediate action to maximize profit, ensure supply and improve safety and reliability - all while reducing costs. Chip manufacturers and Tier 1’s can reduce DPPM by 10X, accelerate TTM, optimize system performance, improve performance yields and optimize reliability margins. Once deployed in the field, OEMs can be alerted on faults before failures for predictive safety and maintenance, increase system availability, perform Over-The-Air updates, and optimize fleet management, all in mission-mode without disruption to normal operation. proteanTecs already serves leading electronics vendors across multiple industries, and our solutions are silicon proven at high volumes in single-digit process technologies.

• SAVE A CRUST PRIVATE LIMITED

  Fermentation Technology

  

  Our company uses Fermentation Technology in our production to extract the most out of the surplus ingredients used. Using fermentation technology, we are able to maximise various types of food waste and loss ranging from bread to grains and also fruits and vegetables. We maximise the extraction of sugar content and also extraction of the flavour of each ingredient for our production. Our company not only work with flesh of fruits and vegetables, but also focuses on food loss such as ugly fruits and vegetables, fruit peels, rinds and seeds. Currently we are also co-developing intellectual properties (IPs) with Singapore Agency for Science, Technology and Research (A*Star). Here are the following IPs we are in the midst of developing to further enhance our production: 1. Co-developing a tech with A*Star whereby we can use bread waste with high oil/lipids content for beer. The tech will help to consume most of the oil content/lipids in beer whereas also giving it a nice flavour 2. Co-developing Encapsulated Probiotic for Enhanced Stability and Functionality with A*star - Desired state is shelf stable, functional probiotic drinks, encapsulation immobilises probiotics and slows down their ability to ferment the surrounding beverage, hence maintaining the taste of the drink while still retaining functionality

• Sounds Great Co., Ltd.

  Sounds Great Co., Ltd.

  

  Sounds Great uses a semiconductor process to produce magnetic chips. Due to the advantages of semiconductor processes, this magnetic chip can generate a very large magnetic field with high power in a very small space. It is applied to the structure of micro speakers and micro motors, making the product volume more miniaturized.

• Spatial Topology Technology Co., Ltd.

  LBS AR

  

  Nowadays, 80% of shoppers go windows shopping physically first, but end up purchasing online. Offline behavior is the key puzzle to complete the user profiling also to bridge the gap between online and offline shopping. Especially in O2O/Retail/E-Commerence industry, LBS AR is the best entry point, it not only creates brand engagement through in-store gamified customer experiences, but also achieves geo-retargeting by reward points and membership.

• TMY Technology

  5G/B5G mmWave phased array module and mass production OTA testing solution

  

  TMYTEK is capable of various types of antenna to work with beamformer chips in 28/39/60/77 GHz bands. Antenna BW, gain, steering coverage and polarizations are well modeled to make sure EIRP and other indexes meet the customers and markets. TMYTEK is creating ready-to-commercialize FR2 O-RU solution, 60 GHz 5G-U FWA turnkey and large-size phased array for 5G/B5G and SATCOM market to keep ahead of the curve. To realize mosaic structure to form a large array by repeating unit AiP module, integrating IF from/to RF circuits into the package is critical to have I/O pin work in IF. A mixer and BPF needed to be integrated into the package, too. ORAN opens up the opportunities for the base station ecosystem. The new split 7.2 relieves the load of the front haul network. We need the integration of Low PHY in the RU module. We are building sophisticated AiP modules. #XBeam - 5G NR mmWave OTA testing Solution for Production XBeam resolves the slow OTA testing issue in mass production lines to verify the billions of mmWave modules, smartphones, and base stations before shipping.XBeam is an Over-The-Air (OTA) testing solution without mechanical positioners. OTA is the only way to test the mmWave AiP modules. XBeam can test passive Array Antenne, Antenna-in-Package, Device eg. smart phone, CPE, small cell… XBeam is the world's first Beam Engine integrated automation and 5G mmWave testing that can do pure electronic beam-to-beam measurement which is 20 times faster than any traditional methods like CATR. It is capable of measuring a module in 3 seconds as well as identifying a broken module, while analyzing failure reasons and the way to fix it.

• Turing Drive Inc.

  Data-fusion-based fail-safe decision making system

  

  Data from a variety of sensors is fused to reduce the risk of failure of different sensors. Such fusion also enables highly precise positioning, or localization, for moving vehicles under different environments, thereby improving the overall safety of the vehicle. In addition, even without sensor fusion, Turing Drive can use only the camera to perform lane recognition and lane-level positioning. If combined with trajectory planning, camera data is sufficient to provide lane keeping for autonomous driving.

• VACAN

  IoT smart restroom solution

  

  「Throne」 visualizes real-time congestion information of restrooms using sensors installed on the door of the stall. The information detected can be displayed on digital signages, websites, apps, etc. 「AirKnock Ads」 is a video ad distribution service for restrooms, and display the real-time congestion status detected by sensors.

• Vayyar

  Vayyar's XRR 4D imaging radar chip

  

  Vayyar’s newly launched multi-range 4D imaging radar “XRR” chip is the world’s first single RFIC with a range of 0-300m. It’s designed to support ADAS and autonomous vehicle applications in passenger cars, trucks and motorcycles. Supported by a 48-antenna MIMO array, the leading-edge platform provides radar imaging with unprecedented accuracy for numerous safety applications, without the need for external processors. Vayyar’s XRR chip – AEC-Q100 qualified and ASIL-B compliant - is unmatched in terms of range, resolution, and performance. With an ultra-wide field of view and rich 4D point cloud imaging, it delivers unprecedented multifunctionality on a single-chip platform, supporting dozens of Advanced Driver Assistance Systems (ADAS), Advanced Rider Assistance Systems (ARAS) and autonomy features. This eliminates the need for multiple, costly vehicle sensors and reduces costs, complexity, hardware, software, power consumption, wiring and integration efforts. Affording a range of 0-300m, the multi-range 4D imaging radar XRR chip differentiates between static obstacles such as dividers, curbs and parked vehicles, and between different types of VRUs, moving vehicles and other hazards. In low-speed environments such as parking lots, the XRR chip’s SRR sensing supports advanced parking assistance, scanning the vehicle’s surroundings for pedestrians and obstacles. On the open road, MRR and LRR capabilities facilitate a variety of ADAS and autonomy applications such as Lane Change Assist (LCA), Adaptive Cruise Control (ACC), Blind Spot Detection (BSD), Collision Warnings (fCW/rCW), Cross Traffic Alerting (CTA) and Autonomous Emergency Braking (AEB). Compared with alternatives such as cameras, standard radar and LIDAR, Vayyar’s multi-range 4D imaging radar XRR chip delivers unprecedented multifunctionality on a single-chip platform, maximizing affordability, coverage, range, resolution and robustness. It provides real-time 4D detection, identifying and tracking numerous objects simultaneously, even in extremely challenging conditions such as heavy traffic, darkness, or fog. As automakers strive to protect motorists and their passengers, Vayyar’s multi-range 4D imaging radar XRR chip is redefining ADAS, ARAS and autonomy, making the utmost safety available to all vehicles.

• Verdigris Technology INC

  UHF-AI driven energy monitoring system

  

  Easily install with flexible expansion systems that show your integral energy usage per panel or device,to help find out where you can reduce operating costs in time to make changes. Use our cutting-edge technology to insight and analyze granular data through hi-frequency AIoT device sampling up to 8000/sec to manage peak demand based on forecasting model configured by AI that enhance furthermore continuously monitor equipment for anomalous behavior.Besides,provide compatibility to modbus/bacnet portocol for integration with existed conventional system which mostly are BEMS or SCADA.

• VitalSigns Technology Co., Ltd

  Femto Ampere Level Electron Ionization

  

  Our product is Femto ampere level professional air quality monitoring system. We made a very small pulse discharge detector. It can charge the air to 10 thousand volt and do an ultra small signal measurement. The signal is around one of 100 trillion ampere. We made ultra-high accurate measurement small and possible. The Remote Monitoring System is equipped with a uniquely EI sensor for PM 2.5. This analyzer is the perfect solution for the measurements of trace amounts of particulate matter. And it can also install the series expansion like Toxic Gases.

• Weebit Nano Ltd.

  Weebit ReRAM

  

  Weebit's ground-breaking Resistive RAM (ReRAM) addresses the growing need for higher performance and lower power memory solutions in emerging applications such as IoT devices, drones, robotics, autonomous vehicles, 5G, and AI. Embedded Flash, the incumbent Non-Volatile Memory (NVM) technology, has several cost, scalability and complexity limitations when it comes to being embedded in a next-generation System-on-Chip (SoC). It also requires much more power, leading to shorter battery life. Weebit’s ReRAM overcomes the challenges of traditional Flash, representing the most cost-effective and highest performance emerging embedded NVM. ReRAM allows semiconductor memory elements to be significantly faster, less expensive, more reliable, and more energy efficient than those using existing Flash memory. Weebit’s use of fab-friendly materials in its ReRAM, and the fact that it only requires two additional masks for manufacturing, are significant competitive advantages. Weebit’s executive team and Board represent highly respected industry veterans. They include CEO Coby Hanoch, who was Co-Founder of Verisity; Chairman David Perlmutter, previously an EVP, GM, and Chief Product Officer at Intel; Yoav Nissan-Cohen who was Founder and CTO of Tower Semiconductor; Atiq Raza who was President/COO of AMD and Chairman/CEO of RMI, as well as other C-level executives and technologists from across the industry from companies including CEVA, Micron, National Semi, Samsung, Sandisk, STMicro, and other leading companies. In the past year, Weebit completed technology stabilization, taking the level of functional cells in its design to over 99%. This is a key requirement for moving to production. Weebit’s patented technology is now ready for transfer to a production fab. Weebit announced initial engagements with potential customers and partners in China and Korea including XTX, a company that successfully tested Weebit’s technology in its China labs. Following a heavily oversubscribed AU$15M placement in 2020, Weebit is well-funded to progress development and commercialization.

• Wise-Integration

  WiseGan® and WiseWare®

  

  Wise-Integration develops innovative solutions to reduce the size and improve energy efficiency of AC-DC power supply (chargers). Combining both GaN component (WiseGan®) and advanced AC-DC system architecture with software (WiseWare®). Wise-Integration will disrupt the power supply market, by offering a breakthrough technology and opening the possibility up to 6x smaller, 5x more efficient and 4x lighter charger from 65W to 3kW. The combination of these two innovations targets 3 markets: consumer, e-mobility and server for datacenter. Wise-Integration has developed the world’s most energy efficient and smallest GaN charger. The first best achievement, is a 100W power cube demonstrator. Using WiseGan® Integrated Circuits and the proprietary patented architecture controlled by a specific software, a drastic size reduction is achieved without compromising efficiency. This combination is offering only 4% losses for a record energy density of 50W/inch3, and will accelerate the creation of next-generation compact and efficient chargers and power adapters for consumer and industrial applications up to 3KW. A Power cube is enabling fast charging of laptop computers and electric bicycles.

• YajanTech Co. Ltd.

  A crossed-platform AR SDK

  

  YajanTech was founded in August 2015 and focuses on software development. As the SDK (Software Develop Kit) designer, YajanTech holds domain knowledge in image processing, image stitching, image recognition, and image tracking. There are 4 big functions of SDK and people can perform face check and AR animation through the kit. The company claims, it is very hard to design a system and very hard to let the client know what is SDK. So YajanTech does much for that like it designs more applications by SDK to prove the power of software engine. Finally, YajanTech has partnered with leading companies like NTT communication, GMO internet in Japan and they use the engine to design very good productions.

• Your Health Technology Co., Ltd. (Yutech)

  Guard Patch: Intelligent Wearable Technology with Internet of Things and Platform

  

  The goal of the Guard Patch is to develop a Low-power Long-term Wearable Body Sensor SOC for Wireless Electrocardiogram Monitor. Our team designs and implements a high resolution and low power bio-signal acquisition chip. The chip is fabricated in a TSMC 0.18 μm standard CMOS process. Based on this chip, we integrate the required circuits into a wearable system module to sense the ECG signal from users. The communication between the sensor and the smart phone is established via Bluetooth. The software needs to fulfill the following four principal tasks: 1) data processing, 2) analyzing, 3) displaying, and 4) recording. A back-end application (APP) on Android/iOS system carries out the further mathematical calculation and analysis, including demodulation and digital signal processing. With the basic monitor function (off-line bio-signal data storage), the real-time monitoring function is also developed and the real-time bio-signal can be checked on the smart device. The processed bio-signal will then be displayed on the screen. With such a wearable platform for wireless bio-signal acquisition, the user can access and monitor his own physiological condition anytime and anywhere. For these functions mentioned above, this wireless bio-signal acquisition system will become the guard patch of the user. There are three main advantages of this system, including real-time monitoring, convenient for wear, and easy to use. Besides, the technology of Guard Patch is promoted to other application including 24-hour arrhythmia monitoring system, Intelligent medical stethoscope, portable and wireless urine detection system and platform, smart clothing, Arrhythmia monitoring Belt, I-Pet clothing, Bio-medical development module for wearable and IOT-based products, etc. The detailed has been presented in product introduction video. (https://www.youtube.com/watch?v=xOxKiOdbVXc&list=PL97ZBA5GLz5uJVRsz1hg9WSdPIR_Q2B_W&index=2 ).

*Nominees are in random orders